{"id":"https://openalex.org/W2920432279","doi":"https://doi.org/10.1109/tencon.2018.8650413","title":"Temperature-dependent Delay, Power and Frequency Analysis of Multilayer Graphene Nanoribbon Interconnects","display_name":"Temperature-dependent Delay, Power and Frequency Analysis of Multilayer Graphene Nanoribbon Interconnects","publication_year":2018,"publication_date":"2018-10-01","ids":{"openalex":"https://openalex.org/W2920432279","doi":"https://doi.org/10.1109/tencon.2018.8650413","mag":"2920432279"},"language":"en","primary_location":{"id":"doi:10.1109/tencon.2018.8650413","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon.2018.8650413","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2018 - 2018 IEEE Region 10 Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091773174","display_name":"Surbhi Shrada","orcid":null},"institutions":[{"id":"https://openalex.org/I162030827","display_name":"Thapar Institute of Engineering & Technology","ror":"https://ror.org/00wdq3744","country_code":"IN","type":"education","lineage":["https://openalex.org/I162030827"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Surbhi Shrada","raw_affiliation_strings":["Electronics and Communication Engineering, Thapar Institute of Engineering and Technology, Patiala, India"],"affiliations":[{"raw_affiliation_string":"Electronics and Communication Engineering, Thapar Institute of Engineering and Technology, Patiala, India","institution_ids":["https://openalex.org/I162030827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059611078","display_name":"Mayank Kumar","orcid":"https://orcid.org/0000-0001-5141-6629"},"institutions":[{"id":"https://openalex.org/I162030827","display_name":"Thapar Institute of Engineering & Technology","ror":"https://ror.org/00wdq3744","country_code":"IN","type":"education","lineage":["https://openalex.org/I162030827"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Mayank Kumar Rai","raw_affiliation_strings":["Electronics and Communication Engineering, Thapar Institute of Engineering and Technology, Patiala, India"],"affiliations":[{"raw_affiliation_string":"Electronics and Communication Engineering, Thapar Institute of Engineering and Technology, Patiala, India","institution_ids":["https://openalex.org/I162030827"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5091773174"],"corresponding_institution_ids":["https://openalex.org/I162030827"],"apc_list":null,"apc_paid":null,"fwci":0.1945,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.47709166,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"0291","last_page":"0296"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10074","display_name":"Carbon Nanotubes in Composites","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7709956169128418},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.740409255027771},{"id":"https://openalex.org/keywords/graphene","display_name":"Graphene","score":0.7306882739067078},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.6982989311218262},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5717082023620605},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5387597680091858},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.43282294273376465},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.421161413192749},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3611130118370056},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2788016200065613},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.194090336561203},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.13211843371391296},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1300109624862671},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.07356515526771545}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7709956169128418},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.740409255027771},{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.7306882739067078},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.6982989311218262},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5717082023620605},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5387597680091858},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.43282294273376465},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.421161413192749},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3611130118370056},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2788016200065613},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.194090336561203},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13211843371391296},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1300109624862671},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07356515526771545},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tencon.2018.8650413","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tencon.2018.8650413","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"TENCON 2018 - 2018 IEEE Region 10 Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.6399999856948853,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1492933538","https://openalex.org/W1749710112","https://openalex.org/W1970977028","https://openalex.org/W1974513150","https://openalex.org/W1985700440","https://openalex.org/W1991342345","https://openalex.org/W1995143643","https://openalex.org/W1996164241","https://openalex.org/W2012940777","https://openalex.org/W2014935324","https://openalex.org/W2034089924","https://openalex.org/W2045956059","https://openalex.org/W2058164900","https://openalex.org/W2060215587","https://openalex.org/W2103497259","https://openalex.org/W2104948161","https://openalex.org/W2111235106","https://openalex.org/W2118784851","https://openalex.org/W2125740733","https://openalex.org/W2141368806","https://openalex.org/W2146564548","https://openalex.org/W2146597111","https://openalex.org/W2151714550","https://openalex.org/W2160019980","https://openalex.org/W2233020476","https://openalex.org/W2331494337","https://openalex.org/W2611447589","https://openalex.org/W3104849318","https://openalex.org/W4242709831","https://openalex.org/W6737319673"],"related_works":["https://openalex.org/W2606452130","https://openalex.org/W3149465128","https://openalex.org/W3196929922","https://openalex.org/W2377562106","https://openalex.org/W2328592354","https://openalex.org/W2081887179","https://openalex.org/W3033906315","https://openalex.org/W1578765583","https://openalex.org/W2914224237","https://openalex.org/W4210414851"],"abstract_inverted_index":{"Graphene":[0],"nanoribbon(GNR)":[1],"is":[2,66,71,84,105,144,182],"gradually":[3],"emerging":[4],"as":[5,69,86,113],"plausible":[6],"interconnect":[7,164],"material":[8],"in":[9,29,102,107,133,139,157,187,192,197,199],"deep":[10],"sub-micron(DSM)":[11],"technology":[12,63],"nodes.":[13],"This":[14],"paper":[15,40],"addresses":[16],"the":[17,22,43,100,108,148,170,175,185,190],"role":[18],"of":[19,24,31,45,49,82,110,159,172,178],"temperature":[20,70,173,188],"on":[21,123,174],"performance":[23,44],"multilayer":[25],"graphene":[26],"nanoribbon":[27],"(MLGNR)":[28],"terms":[30],"signal":[32,77,103,131,193],"delay,":[33],"power":[34,80,104,160,194],"dissipation":[35,81,161],"and":[36,57,79,195],"frequency":[37,93,176],"analysis.":[38],"The":[39,166],"further":[41],"compares":[42],"MLGNR":[46,83,116,134,179,200],"with":[47],"that":[48,99,122,184],"copper(Cu)":[50],"interconnects":[51,112],"by":[52,135],"using":[53,136],"both":[54],"conventional":[55],"(temperature-independent)":[56],"temperature-dependent":[58,137],"models":[59,138,143],"at":[60],"14":[61],"nm":[62],"node.":[64],"It":[65,181],"noted":[67,98],"that,":[68],"increased":[72],"from":[73,127],"300K":[74],"to":[75,88,115,129,141],"500K,":[76],"delay":[78,132],"lower":[85],"compared":[87,114],"copper":[89,111],"interconnects.":[90,117,180,201],"Also,":[91],"through":[92],"analysis":[94],"it":[95],"can":[96],"be":[97],"loss":[101,191],"more":[106],"case":[109,158],"Moreover,":[118],"simulated":[119],"results":[120,167],"reveal":[121],"different":[124],"lengths,":[125],"ranging":[126],"400\u03bcm":[128],"1000\u03bcm,":[130],"comparison":[140],"temperature-independent":[142],"significantly":[145],"low.":[146],"On":[147],"other":[149],"hand,":[150],"small":[151],"improvement":[152],"has":[153],"also":[154,168],"been":[155],"seen":[156],"for":[162],"same":[163],"lengths.":[165],"gives":[169],"effect":[171],"spectrum":[177],"found":[183],"increase":[186],"causes":[189],"decrease":[196],"bandwidth":[198]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2019,"cited_by_count":2}],"updated_date":"2026-03-01T08:55:55.761014","created_date":"2025-10-10T00:00:00"}