{"id":"https://openalex.org/W2343022744","doi":"https://doi.org/10.1109/te.2016.2515071","title":"3-D Printing as an Effective Educational Tool for MEMS Design and Fabrication","display_name":"3-D Printing as an Effective Educational Tool for MEMS Design and Fabrication","publication_year":2016,"publication_date":"2016-01-21","ids":{"openalex":"https://openalex.org/W2343022744","doi":"https://doi.org/10.1109/te.2016.2515071","mag":"2343022744"},"language":"en","primary_location":{"id":"doi:10.1109/te.2016.2515071","is_oa":false,"landing_page_url":"https://doi.org/10.1109/te.2016.2515071","pdf_url":null,"source":{"id":"https://openalex.org/S207741693","display_name":"IEEE Transactions on Education","issn_l":"0018-9359","issn":["0018-9359","1557-9638"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310322189","host_organization_name":"IEEE Education Society","host_organization_lineage":["https://openalex.org/P4310322189","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Education Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Education","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086396919","display_name":"Reena Dahle","orcid":"https://orcid.org/0000-0003-4677-2391"},"institutions":[{"id":"https://openalex.org/I157455823","display_name":"SUNY New Paltz","ror":"https://ror.org/03j3dv688","country_code":"US","type":"education","lineage":["https://openalex.org/I157455823"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Reena Dahle","raw_affiliation_strings":["Division of Engineering Programs, State University of New York (SUNY) New Paltz, New Paltz, NY, USA"],"raw_orcid":"https://orcid.org/0000-0003-4677-2391","affiliations":[{"raw_affiliation_string":"Division of Engineering Programs, State University of New York (SUNY) New Paltz, New Paltz, NY, USA","institution_ids":["https://openalex.org/I157455823"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049301370","display_name":"Rafiul K. Rasel","orcid":"https://orcid.org/0000-0002-2850-8493"},"institutions":[{"id":"https://openalex.org/I157455823","display_name":"SUNY New Paltz","ror":"https://ror.org/03j3dv688","country_code":"US","type":"education","lineage":["https://openalex.org/I157455823"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Rafiul Rasel","raw_affiliation_strings":["Division of Engineering Programs, State University of New York New Paltz, New Paltz, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Division of Engineering Programs, State University of New York New Paltz, New Paltz, NY, USA","institution_ids":["https://openalex.org/I157455823"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I157455823"],"apc_list":null,"apc_paid":null,"fwci":1.4256,"has_fulltext":false,"cited_by_count":19,"citation_normalized_percentile":{"value":0.83144664,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"59","issue":"3","first_page":"210","last_page":"215"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11283","display_name":"Experimental Learning in Engineering","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14089","display_name":"Nanotechnology research and applications","score":0.9904999732971191,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microfabrication","display_name":"Microfabrication","score":0.8138731718063354},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8105796575546265},{"id":"https://openalex.org/keywords/cleanroom","display_name":"Cleanroom","score":0.7277035713195801},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.5025556087493896},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.49440646171569824},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.47654658555984497},{"id":"https://openalex.org/keywords/course","display_name":"Course (navigation)","score":0.44891294836997986},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.42769503593444824},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4153686761856079},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.33738774061203003},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3348997235298157},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12928083539009094},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.11434110999107361},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.09433534741401672},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.07013490796089172}],"concepts":[{"id":"https://openalex.org/C527607","wikidata":"https://www.wikidata.org/wiki/Q175538","display_name":"Microfabrication","level":4,"score":0.8138731718063354},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8105796575546265},{"id":"https://openalex.org/C127094628","wikidata":"https://www.wikidata.org/wiki/Q794827","display_name":"Cleanroom","level":2,"score":0.7277035713195801},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.5025556087493896},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.49440646171569824},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47654658555984497},{"id":"https://openalex.org/C2777552389","wikidata":"https://www.wikidata.org/wiki/Q1962728","display_name":"Course (navigation)","level":2,"score":0.44891294836997986},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.42769503593444824},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4153686761856079},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.33738774061203003},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3348997235298157},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12928083539009094},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.11434110999107361},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.09433534741401672},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.07013490796089172},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/te.2016.2515071","is_oa":false,"landing_page_url":"https://doi.org/10.1109/te.2016.2515071","pdf_url":null,"source":{"id":"https://openalex.org/S207741693","display_name":"IEEE Transactions on Education","issn_l":"0018-9359","issn":["0018-9359","1557-9638"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310322189","host_organization_name":"IEEE Education Society","host_organization_lineage":["https://openalex.org/P4310322189","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Education Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Education","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W49547224","https://openalex.org/W1495602024","https://openalex.org/W1997183935","https://openalex.org/W2057696289","https://openalex.org/W2072107686","https://openalex.org/W2091054791","https://openalex.org/W2127265626","https://openalex.org/W2329491733","https://openalex.org/W2542682299","https://openalex.org/W3003783502","https://openalex.org/W6678835097","https://openalex.org/W6729009623","https://openalex.org/W6773855857"],"related_works":["https://openalex.org/W1542380701","https://openalex.org/W1816327758","https://openalex.org/W2085527795","https://openalex.org/W4251446537","https://openalex.org/W2171937395","https://openalex.org/W2783300447","https://openalex.org/W4250420135","https://openalex.org/W2055226196","https://openalex.org/W4212850813","https://openalex.org/W2913475304"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,10,53,71,84,131],"series":[4],"of":[5,25,58,107,129,153,163],"course":[6,63,101,109,149,155],"modules":[7,64,156],"developed":[8,66],"as":[9,86,98,100],"high-impact":[11],"and":[12,18,23,43,74,117,170],"cost-effective":[13],"learning":[14],"tool":[15],"for":[16,41,77],"modeling":[17,80],"simulating":[19],"the":[20,56,88,105,119,122,127,135,148,151,164,166,173],"microfabrication":[21],"process":[22,128],"design":[24],"microelectromechanical":[26],"systems":[27],"(MEMS)":[28],"devices":[29],"using":[30],"three-dimensional":[31],"(3-D)":[32],"printing.":[33],"Microfabrication":[34],"technology":[35],"is":[36,87],"an":[37],"established":[38],"fabrication":[39],"technique":[40],"small":[42],"high-precision":[44],"MEMS":[45,79,120,132],"devices;":[46],"these":[47,108,112,154],"processes":[48],"typically":[49],"take":[50],"place":[51],"in":[52,81,90,147],"cleanroom":[54],"with":[55],"use":[57],"expensive":[59],"high-vacuum":[60],"equipment.":[61],"These":[62],"were":[65],"to":[67,143,157],"provide":[68],"engineering":[69],"educators":[70],"more":[72],"affordable":[73],"effective":[75],"method":[76],"teaching":[78],"settings":[82],"without":[83],"cleanroom,":[85],"case":[89],"many":[91],"undergraduate":[92],"institutions.":[93],"Feedback":[94],"from":[95,134],"student":[96],"evaluations":[97],"well":[99],"grades":[102],"all":[103],"support":[104],"efficacy":[106],"modules.":[110],"In":[111],"hands-on":[113],"modules,":[114,165],"by":[115,125],"designing":[116],"building":[118,130],"prototypes,":[121],"students":[123],"learn":[124],"experiencing":[126],"device":[133],"specifications":[136],"given.":[137],"The":[138,160],"results":[139],"are":[140,175],"also":[141],"compared":[142],"similar":[144],"assessments":[145],"made":[146],"before":[150],"introduction":[152],"verify":[158],"success.":[159],"detailed":[161],"description":[162],"evaluation":[167],"methodologies":[168],"adopted,":[169],"reflections":[171],"on":[172],"implementation":[174],"discussed.":[176]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":4},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}