{"id":"https://openalex.org/W2970777640","doi":"https://doi.org/10.1109/tcsii.2019.2937541","title":"A 32-dB SNR Readout IC With 20-Vpp Tx Using On-Chip DM-TISM in HV BCD Process for Mutual-Capacitive Fingerprint Sensor","display_name":"A 32-dB SNR Readout IC With 20-Vpp Tx Using On-Chip DM-TISM in HV BCD Process for Mutual-Capacitive Fingerprint Sensor","publication_year":2019,"publication_date":"2019-08-27","ids":{"openalex":"https://openalex.org/W2970777640","doi":"https://doi.org/10.1109/tcsii.2019.2937541","mag":"2970777640"},"language":"en","primary_location":{"id":"doi:10.1109/tcsii.2019.2937541","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2019.2937541","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5001040595","display_name":"Eun-Ho Choi","orcid":"https://orcid.org/0000-0003-3996-6585"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Eunho Choi","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076296195","display_name":"Seongmun Kim","orcid":"https://orcid.org/0000-0002-6883-2773"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seongmun Kim","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102721821","display_name":"Kyoungmin Park","orcid":"https://orcid.org/0009-0003-5645-4415"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kyoungmin Park","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091366075","display_name":"Sanghyun Heo","orcid":"https://orcid.org/0000-0002-2837-0834"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sanghyun Heo","raw_affiliation_strings":["Samsung Display, Gyeonggi, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Display, Gyeonggi, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067311469","display_name":"Hyunggun Ma","orcid":"https://orcid.org/0000-0002-2976-7315"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyunggun Ma","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000157558","display_name":"Gyeongho Namgoong","orcid":"https://orcid.org/0000-0001-5326-2897"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Gyeongho Namgoong","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014523975","display_name":"Haksun Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Haksun Kim","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058339861","display_name":"Franklin Bien","orcid":"https://orcid.org/0000-0002-9582-295X"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Franklin Bien","raw_affiliation_strings":["Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"Electrical and Computer Engineering Department, Ulsan National Institute of Science and Technology, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5001040595"],"corresponding_institution_ids":["https://openalex.org/I48566637"],"apc_list":null,"apc_paid":null,"fwci":0.1986,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.51130602,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":"67","issue":"7","first_page":"1224","last_page":"1228"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transmitter","display_name":"Transmitter","score":0.558158814907074},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5315900444984436},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5186416506767273},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.4973013699054718},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.49257928133010864},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49125975370407104},{"id":"https://openalex.org/keywords/fingerprint","display_name":"Fingerprint (computing)","score":0.4555160105228424},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4303818345069885},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.40181639790534973},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3368479013442993},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1582133173942566},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.133138507604599},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.10408791899681091},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.09789380431175232}],"concepts":[{"id":"https://openalex.org/C47798520","wikidata":"https://www.wikidata.org/wiki/Q190157","display_name":"Transmitter","level":3,"score":0.558158814907074},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5315900444984436},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5186416506767273},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4973013699054718},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.49257928133010864},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49125975370407104},{"id":"https://openalex.org/C2777826928","wikidata":"https://www.wikidata.org/wiki/Q3745713","display_name":"Fingerprint (computing)","level":2,"score":0.4555160105228424},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4303818345069885},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.40181639790534973},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3368479013442993},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1582133173942566},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.133138507604599},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.10408791899681091},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.09789380431175232}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/tcsii.2019.2937541","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2019.2937541","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"},{"id":"pmh:oai:scholarworks.unist.ac.kr:201301/30787","is_oa":false,"landing_page_url":"https://ieeexplore.ieee.org/document/8815871","pdf_url":null,"source":{"id":"https://openalex.org/S4306401118","display_name":"Scholarworks@UNIST (Ulsan National Institute of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I48566637","host_organization_name":"Ulsan National Institute of Science and Technology","host_organization_lineage":["https://openalex.org/I48566637"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"ARTICLE"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.6299999952316284,"display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G4600830926","display_name":null,"funder_award_id":"IITP-2019-2017-0-01635","funder_id":"https://openalex.org/F4320335489","funder_display_name":"Institute for Information and Communications Technology Promotion"}],"funders":[{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"},{"id":"https://openalex.org/F4320335489","display_name":"Institute for Information and Communications Technology Promotion","ror":"https://ror.org/01g0hqq23"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1966457520","https://openalex.org/W2011898260","https://openalex.org/W2016203405","https://openalex.org/W2031424373","https://openalex.org/W2036857396","https://openalex.org/W2050698284","https://openalex.org/W2061808932","https://openalex.org/W2103198996","https://openalex.org/W2153020878","https://openalex.org/W2285045004","https://openalex.org/W2510781921","https://openalex.org/W2802315030","https://openalex.org/W6682315997","https://openalex.org/W6695556703"],"related_works":["https://openalex.org/W2355663289","https://openalex.org/W2982399888","https://openalex.org/W2106913410","https://openalex.org/W4380372336","https://openalex.org/W2354248671","https://openalex.org/W3102847316","https://openalex.org/W2359134391","https://openalex.org/W2594116857","https://openalex.org/W2947628004","https://openalex.org/W2935229758"],"abstract_inverted_index":{"This":[0],"brief":[1],"presents":[2],"a":[3,7,23,27,77],"readout":[4,59,106],"IC":[5,60,107],"with":[6,61,113,159],"20":[8],"V":[9],"high-voltage":[10],"(HV)":[11],"transmitter":[12],"(Tx)":[13],"and":[14,47,76,122,147,155,165],"On-Chip":[15],"Differentially":[16],"Modulated":[17],"Time-Interleaved":[18],"Sensing":[19],"Method":[20],"(DM-TISM)":[21],"in":[22,33],"BCD":[24,153],"process":[25,154,158],"for":[26,49,85,119,125,144],"mutual-capacitive":[28],"Transparent":[29],"Fingerprint":[30],"Sensor":[31],"(TFPS)":[32],"order":[34],"to":[35,132],"achieve":[36],"high":[37,44],"SNR,":[38],"AC":[39],"&":[40],"DC":[41],"offset":[42],"reduction,":[43],"noise":[45,87],"immunity,":[46],"compensate":[48],"the":[50,90,104,120,126,145],"signal":[51],"loss":[52],"under":[53],"thick":[54],"cover":[55],"glass.":[56],"A":[57],"proposed":[58,105],"onchip":[62],"DM-TISM":[63,91],"is":[64],"composed":[65],"of":[66,110,116,135],"42":[67],"identical":[68,73],"HV":[69],"Tx":[70,121,146],"channels,":[71,75],"32":[72,111],"Rx":[74,148],"diamond-patterned":[78],"TFPS.":[79],"The":[80,98,142],"performance":[81],"results":[82],"including":[83],"those":[84],"transient":[86],"show":[88,102],"that":[89,103,138],"achieves":[92,108],"greater":[93],"SNR":[94,109],"than":[95],"conventional":[96],"TISM.":[97],"measured":[99],"raw":[100],"data":[101],"dB":[112],"current":[114],"consumption":[115],"25":[117],"mA":[118,124],"13":[123],"Rx.":[127],"It":[128],"can":[129],"be":[130],"applied":[131],"any":[133],"type":[134],"mobile":[136],"device":[137],"needs":[139],"fingerprint":[140],"recognition.":[141],"ICs":[143],"are":[149],"fabricated":[150],"using":[151],"0.25-\u03bcm":[152],"0.18-\u03bcm":[156],"CMOS":[157],"1.6":[160],"mm":[161,164,167,170],"\u00d7":[162,168],"3.5":[163],"2.5":[166,169],"areas,":[171],"respectively.":[172]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}