{"id":"https://openalex.org/W2910633596","doi":"https://doi.org/10.1109/tcsii.2018.2873236","title":"Miniaturized W-Band Gap Waveguide Bandpass Filter Using the MEMS Technique for Both Waveguide and Surface Mounted Packaging","display_name":"Miniaturized W-Band Gap Waveguide Bandpass Filter Using the MEMS Technique for Both Waveguide and Surface Mounted Packaging","publication_year":2019,"publication_date":"2019-05-20","ids":{"openalex":"https://openalex.org/W2910633596","doi":"https://doi.org/10.1109/tcsii.2018.2873236","mag":"2910633596"},"language":"en","primary_location":{"id":"doi:10.1109/tcsii.2018.2873236","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2018.2873236","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088212717","display_name":"Yongrong Shi","orcid":"https://orcid.org/0000-0002-9423-4523"},"institutions":[{"id":"https://openalex.org/I4210110458","display_name":"Institute of Electronics","ror":"https://ror.org/01z143507","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210110458"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yongrong Shi","raw_affiliation_strings":["Department of Electric Circuit, Nanjing Electronics Devices Institute, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0002-9423-4523","affiliations":[{"raw_affiliation_string":"Department of Electric Circuit, Nanjing Electronics Devices Institute, Nanjing, China","institution_ids":["https://openalex.org/I4210110458"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103139391","display_name":"Junzhi Zhang","orcid":"https://orcid.org/0000-0003-3795-1865"},"institutions":[{"id":"https://openalex.org/I4210110458","display_name":"Institute of Electronics","ror":"https://ror.org/01z143507","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210110458"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junzhi Zhang","raw_affiliation_strings":["Department of Electric Circuit, Nanjing Electronics Devices Institute, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electric Circuit, Nanjing Electronics Devices Institute, Nanjing, China","institution_ids":["https://openalex.org/I4210110458"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088426274","display_name":"Ming Zhou","orcid":"https://orcid.org/0000-0003-0076-6965"},"institutions":[{"id":"https://openalex.org/I4210110458","display_name":"Institute of Electronics","ror":"https://ror.org/01z143507","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210110458"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Zhou","raw_affiliation_strings":["Department of Electric Circuit, Nanjing Electronics Devices Institute, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electric Circuit, Nanjing Electronics Devices Institute, Nanjing, China","institution_ids":["https://openalex.org/I4210110458"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023982737","display_name":"Wenjie Feng","orcid":"https://orcid.org/0000-0003-0360-9412"},"institutions":[{"id":"https://openalex.org/I36399199","display_name":"Nanjing University of Science and Technology","ror":"https://ror.org/00xp9wg62","country_code":"CN","type":"education","lineage":["https://openalex.org/I36399199"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenjie Feng","raw_affiliation_strings":["Department of Communication Engineering, Nanjing University of Science and Technology, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0003-0360-9412","affiliations":[{"raw_affiliation_string":"Department of Communication Engineering, Nanjing University of Science and Technology, Nanjing, China","institution_ids":["https://openalex.org/I36399199"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111356742","display_name":"Baolin Cao","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Baolin Cao","raw_affiliation_strings":["Nanjing Corad Electronic Equipment Corporation, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nanjing Corad Electronic Equipment Corporation, Nanjing, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5071149976","display_name":"Wenquan Che","orcid":"https://orcid.org/0000-0002-9388-6570"},"institutions":[{"id":"https://openalex.org/I36399199","display_name":"Nanjing University of Science and Technology","ror":"https://ror.org/00xp9wg62","country_code":"CN","type":"education","lineage":["https://openalex.org/I36399199"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenquan Che","raw_affiliation_strings":["Department of Communication Engineering, Nanjing University of Science and Technology, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Communication Engineering, Nanjing University of Science and Technology, Nanjing, China","institution_ids":["https://openalex.org/I36399199"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5088212717"],"corresponding_institution_ids":["https://openalex.org/I4210110458"],"apc_list":null,"apc_paid":null,"fwci":3.5109,"has_fulltext":false,"cited_by_count":46,"citation_normalized_percentile":{"value":0.93058698,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":99},"biblio":{"volume":"66","issue":"6","first_page":"938","last_page":"942"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.986299991607666,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.754203200340271},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.750379204750061},{"id":"https://openalex.org/keywords/band-pass-filter","display_name":"Band-pass filter","score":0.7496000528335571},{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.7319007515907288},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6623162627220154},{"id":"https://openalex.org/keywords/waveguide","display_name":"Waveguide","score":0.6499744653701782},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.6110970973968506},{"id":"https://openalex.org/keywords/return-loss","display_name":"Return loss","score":0.5943813323974609},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.522549569606781},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.5199567079544067},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.516170084476471},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.4960971772670746},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.44951462745666504},{"id":"https://openalex.org/keywords/w-band","display_name":"W band","score":0.44741880893707275},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.3089742660522461},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.14353328943252563},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1086122989654541},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08160048723220825},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.07820823788642883},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06775432825088501},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.060123056173324585}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.754203200340271},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.750379204750061},{"id":"https://openalex.org/C147788027","wikidata":"https://www.wikidata.org/wiki/Q2718101","display_name":"Band-pass filter","level":2,"score":0.7496000528335571},{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.7319007515907288},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6623162627220154},{"id":"https://openalex.org/C200687136","wikidata":"https://www.wikidata.org/wiki/Q11233438","display_name":"Waveguide","level":2,"score":0.6499744653701782},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.6110970973968506},{"id":"https://openalex.org/C196901423","wikidata":"https://www.wikidata.org/wiki/Q3933836","display_name":"Return loss","level":3,"score":0.5943813323974609},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.522549569606781},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.5199567079544067},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.516170084476471},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.4960971772670746},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.44951462745666504},{"id":"https://openalex.org/C2781183794","wikidata":"https://www.wikidata.org/wiki/Q3772984","display_name":"W band","level":2,"score":0.44741880893707275},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.3089742660522461},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14353328943252563},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1086122989654541},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08160048723220825},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07820823788642883},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06775432825088501},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.060123056173324585},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcsii.2018.2873236","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2018.2873236","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6299999952316284,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G4795343032","display_name":null,"funder_award_id":"61601421","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8519012026","display_name":null,"funder_award_id":"61822110","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1622502811","https://openalex.org/W1953303490","https://openalex.org/W1997560463","https://openalex.org/W2055419498","https://openalex.org/W2076337527","https://openalex.org/W2120429006","https://openalex.org/W2289238224","https://openalex.org/W2333681360","https://openalex.org/W2473309872","https://openalex.org/W2554750902","https://openalex.org/W2565628863","https://openalex.org/W2589840285","https://openalex.org/W2606390924","https://openalex.org/W2774823348","https://openalex.org/W2793400551","https://openalex.org/W2796769627","https://openalex.org/W2803910175","https://openalex.org/W6729815374"],"related_works":["https://openalex.org/W2124725464","https://openalex.org/W1973870453","https://openalex.org/W2086351729","https://openalex.org/W4313451576","https://openalex.org/W2772649333","https://openalex.org/W2106709610","https://openalex.org/W2008701935","https://openalex.org/W1821229267","https://openalex.org/W2090384652","https://openalex.org/W2160821924"],"abstract_inverted_index":{"A":[0],"novel":[1],"miniaturized":[2],"and":[3,39,100,108,123],"light":[4],"weight":[5],"W-band":[6],"bandpass":[7],"filter":[8],"(BPF)":[9],"is":[10,27,77,87,119],"proposed":[11,73],"based":[12],"on":[13],"the":[14,20,52,58,67,72,90,97,101,124],"gap":[15],"waveguide":[16,46],"(GWG)":[17],"concept":[18],"using":[19,96],"micro-electromechanical":[21],"system":[22],"(MEMS)":[23],"technique.":[24],"The":[25,115],"BPF":[26,76],"achieved":[28],"by":[29,89],"cascading":[30],"four":[31],"rectangular":[32,38],"GWG":[33,75],"resonant":[34],"cavities":[35],"with":[36],"designed":[37,50,78],"cross-shaped":[40],"coupling":[41,47,69],"structure.":[42,114],"Two":[43],"standard":[44],"WR-10":[45],"windows":[48],"are":[49,105,127],"as":[51,111],"input/output":[53],"couplings,":[54],"which":[55,86],"contributes":[56],"to":[57,79,83],"flexible":[59],"application":[60],"in":[61],"various":[62],"packaging":[63],"configurations.":[64],"By":[65],"utilizing":[66],"classical":[68],"matrix":[70],"theory,":[71],"MEMS":[74],"work":[80],"from":[81],"89.8":[82],"97.4":[84],"GHz,":[85],"fabricated":[88,102],"deep":[91],"reactive":[92],"ion":[93],"etching":[94],"process":[95],"silicon":[98,103],"wafers,":[99],"wafers":[104],"also":[106],"electroplated":[107],"bonded":[109],"together":[110],"a":[112],"whole":[113],"measured":[116],"insertion":[117],"loss":[118],"within":[120],"1.6":[121],"dB,":[122],"return":[125],"losses":[126],"larger":[128],"than":[129],"15":[130],"dB.":[131]},"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":9},{"year":2020,"cited_by_count":10},{"year":2019,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}