{"id":"https://openalex.org/W2010037194","doi":"https://doi.org/10.1109/tcsii.2014.2335426","title":"A 3-Gb/s/ch Simultaneous Bidirectional Capacitive Coupling Transceiver for 3DICs","display_name":"A 3-Gb/s/ch Simultaneous Bidirectional Capacitive Coupling Transceiver for 3DICs","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2010037194","doi":"https://doi.org/10.1109/tcsii.2014.2335426","mag":"2010037194"},"language":"en","primary_location":{"id":"doi:10.1109/tcsii.2014.2335426","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2014.2335426","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068290446","display_name":"Myat Thu Linn Aung","orcid":"https://orcid.org/0000-0001-7482-2056"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Myat Thu Linn Aung","raw_affiliation_strings":["VIRTUS, Nanyang Technological University, Singapore","VIRTUS, Nanyang Technol. Univ., Singapore, Singapore"],"affiliations":[{"raw_affiliation_string":"VIRTUS, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"VIRTUS, Nanyang Technol. Univ., Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090374235","display_name":"Eric Lim","orcid":null},"institutions":[{"id":"https://openalex.org/I1283155146","display_name":"Panasonic (Japan)","ror":"https://ror.org/011tm7n37","country_code":"JP","type":"company","lineage":["https://openalex.org/I1283155146"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Eric Lim","raw_affiliation_strings":["Panasonic Industrial Devices, Singapore","Panasonic Ind. Devices, Singapore, Singapore"],"affiliations":[{"raw_affiliation_string":"Panasonic Industrial Devices, Singapore","institution_ids":[]},{"raw_affiliation_string":"Panasonic Ind. Devices, Singapore, Singapore","institution_ids":["https://openalex.org/I1283155146"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039195554","display_name":"Takefumi Yoshikawa","orcid":"https://orcid.org/0000-0002-9256-4422"},"institutions":[{"id":"https://openalex.org/I1283155146","display_name":"Panasonic (Japan)","ror":"https://ror.org/011tm7n37","country_code":"JP","type":"company","lineage":["https://openalex.org/I1283155146"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takefumi Yoshikawa","raw_affiliation_strings":["Panasonic Corporation, Osaka, Japan","Panasonic Corp., Kadoma, Japan"],"affiliations":[{"raw_affiliation_string":"Panasonic Corporation, Osaka, Japan","institution_ids":["https://openalex.org/I1283155146"]},{"raw_affiliation_string":"Panasonic Corp., Kadoma, Japan","institution_ids":["https://openalex.org/I1283155146"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076628109","display_name":"Tony Tae-Hyoung Kim","orcid":"https://orcid.org/0000-0002-1779-1799"},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Tony Tae-Hyoung Kim","raw_affiliation_strings":["VIRTUS, Nanyang Technological University, Singapore","VIRTUS, Nanyang Technol. Univ., Singapore, Singapore"],"affiliations":[{"raw_affiliation_string":"VIRTUS, Nanyang Technological University, Singapore","institution_ids":["https://openalex.org/I172675005"]},{"raw_affiliation_string":"VIRTUS, Nanyang Technol. Univ., Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5068290446"],"corresponding_institution_ids":["https://openalex.org/I172675005"],"apc_list":null,"apc_paid":null,"fwci":1.0467,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.79686544,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"61","issue":"9","first_page":"706","last_page":"710"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9926999807357788,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.9078752994537354},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.67781001329422},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6519631743431091},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.626943826675415},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.6062371134757996},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.5715146064758301},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5306640863418579},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.49846720695495605},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.46650806069374084},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4537345767021179},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.44763362407684326},{"id":"https://openalex.org/keywords/parasitic-capacitance","display_name":"Parasitic capacitance","score":0.43502023816108704},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3366798162460327},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.31432345509529114},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2888444662094116},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.16730964183807373},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.16143950819969177},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.06610795855522156}],"concepts":[{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.9078752994537354},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.67781001329422},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6519631743431091},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.626943826675415},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.6062371134757996},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.5715146064758301},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5306640863418579},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.49846720695495605},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.46650806069374084},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4537345767021179},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.44763362407684326},{"id":"https://openalex.org/C154318817","wikidata":"https://www.wikidata.org/wiki/Q2157249","display_name":"Parasitic capacitance","level":4,"score":0.43502023816108704},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3366798162460327},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.31432345509529114},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2888444662094116},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.16730964183807373},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.16143950819969177},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.06610795855522156},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcsii.2014.2335426","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2014.2335426","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7400000095367432}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1489597939","https://openalex.org/W1497106493","https://openalex.org/W1524885163","https://openalex.org/W1554123512","https://openalex.org/W1971966678","https://openalex.org/W1982845048","https://openalex.org/W2021366471","https://openalex.org/W2023264348","https://openalex.org/W2033733155","https://openalex.org/W2041082417","https://openalex.org/W2058227699","https://openalex.org/W2103992263","https://openalex.org/W2108484437","https://openalex.org/W2109549227","https://openalex.org/W2120427739","https://openalex.org/W2121527752","https://openalex.org/W2150283660","https://openalex.org/W2161399456","https://openalex.org/W2170305090","https://openalex.org/W2175000298","https://openalex.org/W2295688064","https://openalex.org/W3022359323","https://openalex.org/W4245434926","https://openalex.org/W6629435839","https://openalex.org/W6629742018","https://openalex.org/W6655550748","https://openalex.org/W6661051383","https://openalex.org/W6676200568"],"related_works":["https://openalex.org/W2768092448","https://openalex.org/W2895758062","https://openalex.org/W2048683560","https://openalex.org/W2044770004","https://openalex.org/W1966070768","https://openalex.org/W2587186717","https://openalex.org/W1994341348","https://openalex.org/W2990105670","https://openalex.org/W1970914845","https://openalex.org/W2153484902"],"abstract_inverted_index":{"This":[0],"brief":[1],"presents":[2],"a":[3,74],"simultaneous":[4],"bidirectional":[5],"capacitive":[6,18],"coupling":[7,19],"transceiver":[8,61],"for":[9,30],"intertier":[10],"communication":[11],"in":[12,55,73],"3-D":[13],"integrated":[14],"circuits.":[15],"A":[16],"novel":[17],"interconnect":[20,28],"structure":[21,29],"is":[22,53],"proposed.":[23],"Optimization":[24],"of":[25,39,50],"the":[26,35,43,56],"proposed":[27,60],"minimizing":[31],"parasitic":[32],"capacitance":[33],"achieves":[34],"voltage":[36,44],"swing":[37],"VSW":[38],"200":[40],"mV":[41],"at":[42,65],"sensing":[45],"nodes.":[46],"The":[47,59,68],"data":[48],"rate":[49],"3":[51,66],"Gb/s/ch":[52],"demonstrated":[54],"emulated-3D":[57],"interconnect.":[58],"consumes":[62],"140":[63],"\u03bcW":[64],"Gb/s/ch.":[67],"test":[69],"chip":[70],"was":[71],"fabricated":[72],"65-nm":[75],"CMOS":[76],"technology.":[77]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}