{"id":"https://openalex.org/W2131035379","doi":"https://doi.org/10.1109/tcsii.2009.2020925","title":"Robust CMOS Micromachined Inductors With Structure Supports for Gilbert Mixer Matching Circuits","display_name":"Robust CMOS Micromachined Inductors With Structure Supports for Gilbert Mixer Matching Circuits","publication_year":2009,"publication_date":"2009-05-19","ids":{"openalex":"https://openalex.org/W2131035379","doi":"https://doi.org/10.1109/tcsii.2009.2020925","mag":"2131035379"},"language":"en","primary_location":{"id":"doi:10.1109/tcsii.2009.2020925","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2009.2020925","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032407932","display_name":"Jingtao Wu","orcid":"https://orcid.org/0009-0009-9844-4753"},"institutions":[{"id":"https://openalex.org/I193531525","display_name":"George Washington University","ror":"https://ror.org/00y4zzh67","country_code":"US","type":"education","lineage":["https://openalex.org/I193531525"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.C. Wu","raw_affiliation_strings":["George Washington University, Washington D.C., DC, USA","George Washington University  Washington, DC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"George Washington University, Washington D.C., DC, USA","institution_ids":["https://openalex.org/I193531525"]},{"raw_affiliation_string":"George Washington University  Washington, DC","institution_ids":["https://openalex.org/I193531525"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016036076","display_name":"Mona Zaghloul","orcid":"https://orcid.org/0000-0003-1089-5138"},"institutions":[{"id":"https://openalex.org/I193531525","display_name":"George Washington University","ror":"https://ror.org/00y4zzh67","country_code":"US","type":"education","lineage":["https://openalex.org/I193531525"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.E. Zaghloul","raw_affiliation_strings":["George Washington University, Washington D.C., DC, USA","George Washington University  Washington, DC"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"George Washington University, Washington D.C., DC, USA","institution_ids":["https://openalex.org/I193531525"]},{"raw_affiliation_string":"George Washington University  Washington, DC","institution_ids":["https://openalex.org/I193531525"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.6103,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.73214296,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"56","issue":"6","first_page":"429","last_page":"433"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.9429256319999695},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7298030853271484},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5347371101379395},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.44895896315574646},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.44408535957336426},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.44240665435791016},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4362047612667084},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3779042661190033},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3455091118812561},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3330637216567993},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07675802707672119},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.06217929720878601},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.05351972579956055}],"concepts":[{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.9429256319999695},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7298030853271484},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5347371101379395},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.44895896315574646},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.44408535957336426},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.44240665435791016},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4362047612667084},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3779042661190033},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3455091118812561},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3330637216567993},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07675802707672119},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.06217929720878601},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.05351972579956055},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcsii.2009.2020925","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcsii.2009.2020925","pdf_url":null,"source":{"id":"https://openalex.org/S93916849","display_name":"IEEE Transactions on Circuits & Systems II Express Briefs","issn_l":"1549-7747","issn":["1549-7747","1558-3791"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Circuits and Systems II: Express Briefs","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8700000047683716,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1572046421","https://openalex.org/W1877985840","https://openalex.org/W2006748967","https://openalex.org/W2034055560","https://openalex.org/W2044326050","https://openalex.org/W2099415942","https://openalex.org/W2100635908","https://openalex.org/W2160428624","https://openalex.org/W2160509477","https://openalex.org/W2164888389","https://openalex.org/W6634144576"],"related_works":["https://openalex.org/W2027630214","https://openalex.org/W2082914599","https://openalex.org/W2756570351","https://openalex.org/W2048093852","https://openalex.org/W2798896958","https://openalex.org/W2229772108","https://openalex.org/W2044340481","https://openalex.org/W2367582941","https://openalex.org/W2389800961","https://openalex.org/W1995389502"],"abstract_inverted_index":{"In":[0],"this":[1],"brief,":[2],"three":[3],"novel":[4],"structure":[5],"supports":[6],"for":[7,36,65],"on-chip":[8],"CMOS-based":[9],"micromachined":[10,73],"inductors":[11,19,41,46,75],"are":[12,20,47,76],"proposed":[13,45],"to":[14,58],"improve":[15,59],"mechanical":[16,63],"stability.":[17],"The":[18,44,68,83],"fabricated":[21,77],"using":[22],"a":[23,79,94,104],"two-step":[24],"maskless":[25],"post-CMOS":[26],"process.":[27,82],"A":[28],"3-D":[29],"electromagnetic":[30],"inductor":[31],"simulation":[32],"model":[33],"is":[34],"established":[35],"performance":[37,61],"analysis":[38],"of":[39,53],"the":[40,50,54,60,91,98,108],"before":[42],"fabrication.":[43],"applied":[48],"in":[49,78,90,97,107],"matching":[51],"network":[52],"double-balanced":[55],"Gilbert":[56],"mixer":[57],"and":[62,71,103],"reliability":[64],"mobile":[66],"communication.":[67],"mixers":[69],"with":[70],"without":[72],"process":[74],"0.5-mum":[80],"CMOS":[81],"measurement":[84],"results":[85],"show":[86],"an":[87],"18.6%":[88],"increase":[89],"conversion":[92],"gain,":[93],"31.7%":[95],"improvement":[96],"third":[99],"intercept":[100],"point":[101],"(IIP3),":[102],"25.3%":[105],"reduction":[106],"noise":[109],"figure.":[110]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}