{"id":"https://openalex.org/W4415444107","doi":"https://doi.org/10.1109/tcad.2025.3624685","title":"Multiscenario Coupled Model of GaN-on-Si HEMTs Epitaxial Design and Performance Improvement Based on Multiobjective Optimization Method","display_name":"Multiscenario Coupled Model of GaN-on-Si HEMTs Epitaxial Design and Performance Improvement Based on Multiobjective Optimization Method","publication_year":2025,"publication_date":"2025-10-22","ids":{"openalex":"https://openalex.org/W4415444107","doi":"https://doi.org/10.1109/tcad.2025.3624685"},"language":null,"primary_location":{"id":"doi:10.1109/tcad.2025.3624685","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2025.3624685","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5059415152","display_name":"Borui Deng","orcid":null},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Borui Deng","raw_affiliation_strings":["School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026196460","display_name":"He Guan","orcid":"https://orcid.org/0000-0001-7194-2810"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]},{"id":"https://openalex.org/I4210160974","display_name":"Hebei Semiconductor Research Institute","ror":"https://ror.org/050777m95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210160974"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yulong Fang","raw_affiliation_strings":["Hebei Semiconductor Research Institute, Shijiazhuang, Hebei, China","School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hebei Semiconductor Research Institute, Shijiazhuang, Hebei, China","institution_ids":["https://openalex.org/I4210160974"]},{"raw_affiliation_string":"School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, P. R. China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079466497","display_name":"Ziqiang Zeng","orcid":"https://orcid.org/0000-0002-3491-5618"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"He Guan","raw_affiliation_strings":["School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China"],"raw_orcid":"https://orcid.org/0000-0001-7194-2810","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072248611","display_name":"Yulong Fang","orcid":null},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]},{"id":"https://openalex.org/I4210160974","display_name":"Hebei Semiconductor Research Institute","ror":"https://ror.org/050777m95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210160974"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ziqiang Zeng","raw_affiliation_strings":["School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China","HeBei Semiconductor Research Institute, Shijiazhuang, Hebei, China"],"raw_orcid":"https://orcid.org/0000-0002-3491-5618","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China","institution_ids":["https://openalex.org/I17145004"]},{"raw_affiliation_string":"HeBei Semiconductor Research Institute, Shijiazhuang, Hebei, China","institution_ids":["https://openalex.org/I4210160974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055630362","display_name":"Yongchuan Tang","orcid":"https://orcid.org/0000-0003-2568-9628"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yongchuan Tang","raw_affiliation_strings":["School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China"],"raw_orcid":"https://orcid.org/0000-0003-2568-9628","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5066501519","display_name":"Ying Wang","orcid":"https://orcid.org/0000-0001-7576-816X"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ying Wang","raw_affiliation_strings":["School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China"],"raw_orcid":"https://orcid.org/0000-0001-7576-816X","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Northwestern Polytechnical University (NWPU), Xi&#x2019;an, China","institution_ids":["https://openalex.org/I17145004"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1596515,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"45","issue":"6","first_page":"2718","last_page":"2724"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10022","display_name":"Semiconductor Quantum Structures and Devices","score":0.9646999835968018,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.961899995803833,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/epitaxy","display_name":"Epitaxy","score":0.8108999729156494},{"id":"https://openalex.org/keywords/gallium-nitride","display_name":"Gallium nitride","score":0.6147000193595886},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.43380001187324524},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.41769999265670776},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.4077000021934509},{"id":"https://openalex.org/keywords/thermal-expansion","display_name":"Thermal expansion","score":0.39719998836517334},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.3799000084400177},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.3668999969959259}],"concepts":[{"id":"https://openalex.org/C110738630","wikidata":"https://www.wikidata.org/wiki/Q1135540","display_name":"Epitaxy","level":3,"score":0.8108999729156494},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7017999887466431},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.6452999711036682},{"id":"https://openalex.org/C2778871202","wikidata":"https://www.wikidata.org/wiki/Q411713","display_name":"Gallium nitride","level":3,"score":0.6147000193595886},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4745999872684479},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.43380001187324524},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.41769999265670776},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.4077000021934509},{"id":"https://openalex.org/C47463417","wikidata":"https://www.wikidata.org/wiki/Q6583695","display_name":"Thermal expansion","level":2,"score":0.39719998836517334},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.3799000084400177},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.3668999969959259},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.3582000136375427},{"id":"https://openalex.org/C195065555","wikidata":"https://www.wikidata.org/wiki/Q214881","display_name":"Curvature","level":2,"score":0.3366999924182892},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.3253999948501587},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.31029999256134033},{"id":"https://openalex.org/C145598152","wikidata":"https://www.wikidata.org/wiki/Q176097","display_name":"Field-effect transistor","level":4,"score":0.30640000104904175},{"id":"https://openalex.org/C194760766","wikidata":"https://www.wikidata.org/wiki/Q410851","display_name":"Nitride","level":3,"score":0.3019999861717224},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3001999855041504},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.2752000093460083},{"id":"https://openalex.org/C162057924","wikidata":"https://www.wikidata.org/wiki/Q1617706","display_name":"High-electron-mobility transistor","level":4,"score":0.2685999870300293},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.2612999975681305},{"id":"https://openalex.org/C2781204021","wikidata":"https://www.wikidata.org/wiki/Q6497091","display_name":"Lattice (music)","level":2,"score":0.2506999969482422}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2025.3624685","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2025.3624685","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2704626325","display_name":null,"funder_award_id":"No.6210199","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G5024821458","display_name":null,"funder_award_id":"6210199","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6016718302","display_name":null,"funder_award_id":"62471402","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G7404706492","display_name":null,"funder_award_id":"2023GXLH-084","funder_id":"https://openalex.org/F4320336350","funder_display_name":"Key Research and Development Projects of Shaanxi Province"},{"id":"https://openalex.org/G8646562435","display_name":null,"funder_award_id":"No. 62471402","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320336350","display_name":"Key Research and Development Projects of Shaanxi Province","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"Gallium":[0],"Nitride":[1],"High":[2],"Electron":[3],"Mobility":[4],"Transistors":[5],"(GaN-on-Si":[6],"HEMTs)":[7],"on":[8,111,135],"silicon":[9],"substrates":[10],"exhibit":[11],"significant":[12],"potential":[13],"in":[14,37,64],"the":[15,30,35,41,47,55,60,78,87,158,167,173,181,198,205,218],"field":[16],"of":[17,43,90,114,166,207,220],"radio-frequency":[18],"devices":[19],"due":[20],"to":[21,59,178,189],"its":[22],"high":[23],"frequency,":[24],"high-speed,":[25],"and":[26,40,50,83,107,118,152,162,211],"low-cost":[27],"advantages.":[28],"Nevertheless,":[29],"thermal":[31,44,98,146,160,164],"stress":[32,99,147],"caused":[33],"by":[34],"mismatch":[36],"lattice":[38],"parameters":[39,185],"coefficient":[42],"expansion":[45],"between":[46,80],"Si":[48],"substrate":[49],"GaN":[51,104,208],"epitaxial":[52,81,93,105,130,153,168,183,209],"layer":[53],"constrains":[54],"device":[56,84,108,150],"performance.":[57],"Due":[58],"different":[61,65],"temperature":[62],"distributions":[63],"scenarios,":[66],"there":[67],"is":[68],"an":[69,213],"urgent":[70],"need":[71],"for":[72,86,103,216],"a":[73,125,141],"model":[74,133,139,174,202],"that":[75],"can":[76,195,203],"balance":[77],"contradiction":[79],"growth":[82,106],"operation":[85,151],"joint":[88],"design":[89,132,210],"GaN-on-Si":[91,128,221],"HEMTs":[92,129],"structures.":[94],"This":[95,201],"work":[96,122],"presents":[97],"formulas":[100],"specifically":[101],"designed":[102],"operation,":[109],"based":[110,134],"Townsend\u2019s":[112],"theory":[113],"multilayer":[115],"film":[116],"curvature":[117],"stress.":[119],"Furthermore,":[120],"our":[121],"innovatively":[123],"proposes":[124],"multi-scenario":[126],"coupled":[127],"structure":[131,184],"multi-objective":[136],"optimization.":[137],"The":[138],"represents":[140],"combined":[142],"objective":[143],"function":[144],"incorporating":[145],"experienced":[148],"during":[149],"growth,":[154],"as":[155,157],"well":[156],"total":[159],"resistance":[161],"bulk":[163],"conductivity":[165],"layer.":[169],"Through":[170],"simulation":[171],"validation,":[172],"has":[175],"been":[176],"proved":[177],"effectively":[179,196],"calculate":[180],"optimized":[182],"across":[186],"multiple":[187],"scenarios":[188],"meet":[190],"diverse":[191],"requirements.":[192],"And":[193],"it":[194],"reduce":[197],"operating":[199],"temperature.":[200],"accelerate":[204],"process":[206],"provide":[212],"effective":[214],"method":[215],"enhancing":[217],"performance":[219],"HEMTs.":[222]},"counts_by_year":[],"updated_date":"2026-05-21T06:26:12.895304","created_date":"2025-10-24T00:00:00"}
