{"id":"https://openalex.org/W4413212655","doi":"https://doi.org/10.1109/tcad.2025.3597570","title":"CATCH: A Cost Analysis Tool for Co-Optimization of Chiplet-Based Heterogeneous Systems","display_name":"CATCH: A Cost Analysis Tool for Co-Optimization of Chiplet-Based Heterogeneous Systems","publication_year":2025,"publication_date":"2025-08-11","ids":{"openalex":"https://openalex.org/W4413212655","doi":"https://doi.org/10.1109/tcad.2025.3597570"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2025.3597570","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2025.3597570","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5039211292","display_name":"Alexander Graening","orcid":null},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alexander Graening","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Los Angeles, Los Angeles, CA, USA","Department of Electrical and Computer Engineering University of California, Los Angeles, USA"],"raw_orcid":"https://orcid.org/0009-0008-2150-3738","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Los Angeles, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I161318765"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering University of California, Los Angeles, USA","institution_ids":["https://openalex.org/I161318765"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017274857","display_name":"Jonti Talukdar","orcid":"https://orcid.org/0000-0001-7079-5281"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]},{"id":"https://openalex.org/I36194607","display_name":"Duke Energy (United States)","ror":"https://ror.org/030r69d22","country_code":"US","type":"company","lineage":["https://openalex.org/I36194607"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jonti Talukdar","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Duke University, Durham, NC, USA","Department of Electrical and Computer Engineering Duke University, USA"],"raw_orcid":"https://orcid.org/0000-0001-7079-5281","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Duke University, Durham, NC, USA","institution_ids":["https://openalex.org/I170897317"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering Duke University, USA","institution_ids":["https://openalex.org/I170897317","https://openalex.org/I36194607"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036103216","display_name":"Saptadeep Pal","orcid":"https://orcid.org/0000-0002-8777-8573"},"institutions":[{"id":"https://openalex.org/I51504820","display_name":"San Jose State University","ror":"https://ror.org/04qyvz380","country_code":"US","type":"education","lineage":["https://openalex.org/I51504820"]},{"id":"https://openalex.org/I72689128","display_name":"Aino University","ror":"https://ror.org/043223922","country_code":"JP","type":"education","lineage":["https://openalex.org/I72689128"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Saptadeep Pal","raw_affiliation_strings":["Etched, San Jose, CA, USA","Etched.ai, Cupertino, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Etched, San Jose, CA, USA","institution_ids":["https://openalex.org/I51504820"]},{"raw_affiliation_string":"Etched.ai, Cupertino, CA, USA","institution_ids":["https://openalex.org/I72689128"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033880864","display_name":"Krishnendu Chakrabarty","orcid":"https://orcid.org/0000-0003-4475-6435"},"institutions":[{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishnendu Chakrabarty","raw_affiliation_strings":["School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ, USA","School of Electrical, Computer and Energy Engineering Arizona State University, USA"],"raw_orcid":"https://orcid.org/0000-0003-4475-6435","affiliations":[{"raw_affiliation_string":"School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ, USA","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"School of Electrical, Computer and Energy Engineering Arizona State University, USA","institution_ids":["https://openalex.org/I55732556"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084229134","display_name":"Puneet Gupta","orcid":"https://orcid.org/0000-0002-6188-1134"},"institutions":[{"id":"https://openalex.org/I161318765","display_name":"University of California, Los Angeles","ror":"https://ror.org/046rm7j60","country_code":"US","type":"education","lineage":["https://openalex.org/I161318765"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Puneet Gupta","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Los Angeles, Los Angeles, CA, USA","Department of Electrical and Computer Engineering University of California, Los Angeles, USA"],"raw_orcid":"https://orcid.org/0000-0002-6188-1134","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Los Angeles, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I161318765"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering University of California, Los Angeles, USA","institution_ids":["https://openalex.org/I161318765"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.0515,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.75034826,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":98},"biblio":{"volume":"45","issue":"3","first_page":"1091","last_page":"1104"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11407","display_name":"Innovative Microfluidic and Catalytic Techniques Innovation","score":0.7566999793052673,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11407","display_name":"Innovative Microfluidic and Catalytic Techniques Innovation","score":0.7566999793052673,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.7064999938011169,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.6685000061988831,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.485405296087265}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.485405296087265}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2025.3597570","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2025.3597570","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"With":[0],"the":[1,11,72,76,79,90,120,151],"increasing":[2],"prevalence":[3],"of":[4,13,20,57,74,119],"chiplet":[5],"systems":[6],"in":[7,40,89],"high-performance":[8],"computing":[9],"applications,":[10],"number":[12,73],"design":[14,77,110],"options":[15,35],"has":[16],"increased":[17],"dramatically.":[18],"Instead":[19],"chips":[21],"defaulting":[22],"to":[23,36,106],"a":[24,41,51,55,155,160],"single":[25],"die":[26],"per":[27],"package,":[28],"now":[29],"there":[30],"are":[31],"viable":[32],"3D":[33],"stacking":[34,46],"integrate":[37],"multiple":[38],"dies":[39],"package":[42],"either":[43],"through":[44],"vertical":[45],"or":[47],"horizontal":[48],"integration":[49],"on":[50,134,159],"substrate":[52],"along":[53],"with":[54],"plethora":[56],"choices":[58],"regarding":[59,71],"configurations":[60],"and":[61,82,146],"processes.":[62],"For":[63],"chiplet-based":[64],"designs,":[65],"high-impact":[66],"decisions":[67],"such":[68],"as":[69],"those":[70],"chiplets,":[75],"partitions,":[78],"interconnect":[80],"types,":[81,143],"other":[83],"factors":[84],"must":[85],"be":[86,104],"made":[87],"early":[88,109],"development":[91],"process.":[92],"In":[93],"this":[94,127],"work,":[95],"we":[96,122,149],"describe":[97],"an":[98],"open-source":[99],"tool,":[100],"CATCH,":[101],"that":[102],"can":[103,123],"used":[105],"guide":[107],"these":[108],"choices.":[111],"We":[112,129],"also":[113],"present":[114],"case":[115,132,157],"studies":[116,133],"showing":[117],"some":[118],"insights":[121],"draw":[124],"by":[125],"using":[126],"tool.":[128],"look":[130],"at":[131],"optimal":[135],"chip":[136],"size,":[137],"defect":[138],"density,":[139],"test":[140],"cost,":[141],"IO":[142],"assembly":[144],"processes,":[145],"substrates.":[147],"Additionally,":[148],"include":[150],"cost":[152],"breakdown":[153],"for":[154],"specific":[156],"based":[158],"prior":[161],"work.":[162]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}