{"id":"https://openalex.org/W4412375120","doi":"https://doi.org/10.1109/tcad.2025.3587523","title":"An Equivalent Multiphysics Circuit Framework for Electro-Thermal-Mechanical Coupling Simulation in Integrated Circuits by Proposing a SPICE Compatible Equivalent Mechanical Circuit Method","display_name":"An Equivalent Multiphysics Circuit Framework for Electro-Thermal-Mechanical Coupling Simulation in Integrated Circuits by Proposing a SPICE Compatible Equivalent Mechanical Circuit Method","publication_year":2025,"publication_date":"2025-07-09","ids":{"openalex":"https://openalex.org/W4412375120","doi":"https://doi.org/10.1109/tcad.2025.3587523"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2025.3587523","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2025.3587523","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073298558","display_name":"Yizhang Liu","orcid":"https://orcid.org/0009-0008-7756-867X"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]},{"id":"https://openalex.org/I4210158570","display_name":"Zhejiang University-University of Edinburgh Institute","ror":"https://ror.org/04jth1r26","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210158570","https://openalex.org/I76130692","https://openalex.org/I98677209"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"Yizhang Liu","raw_affiliation_strings":["Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","institution_ids":["https://openalex.org/I4210158570"]},{"raw_affiliation_string":"International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China","institution_ids":["https://openalex.org/I4210158570","https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051298876","display_name":"Liang Tian","orcid":"https://orcid.org/0000-0002-4356-7491"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]},{"id":"https://openalex.org/I4210158570","display_name":"Zhejiang University-University of Edinburgh Institute","ror":"https://ror.org/04jth1r26","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210158570","https://openalex.org/I76130692","https://openalex.org/I98677209"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Liang Tian","raw_affiliation_strings":["Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","institution_ids":["https://openalex.org/I4210158570"]},{"raw_affiliation_string":"International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China","institution_ids":["https://openalex.org/I4210158570","https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101761045","display_name":"Yiqun Niu","orcid":"https://orcid.org/0000-0003-4364-7018"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]},{"id":"https://openalex.org/I4210158570","display_name":"Zhejiang University-University of Edinburgh Institute","ror":"https://ror.org/04jth1r26","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210158570","https://openalex.org/I76130692","https://openalex.org/I98677209"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Yiqun Niu","raw_affiliation_strings":["Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","institution_ids":["https://openalex.org/I4210158570"]},{"raw_affiliation_string":"International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China","institution_ids":["https://openalex.org/I4210158570","https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070614875","display_name":"Yinshui Xia","orcid":"https://orcid.org/0000-0002-3831-3876"},"institutions":[{"id":"https://openalex.org/I109935558","display_name":"Ningbo University","ror":"https://ror.org/03et85d35","country_code":"CN","type":"education","lineage":["https://openalex.org/I109935558"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yinshui Xia","raw_affiliation_strings":["Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China"],"affiliations":[{"raw_affiliation_string":"Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China","institution_ids":["https://openalex.org/I109935558"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100651075","display_name":"Wenchao Chen","orcid":"https://orcid.org/0000-0001-7613-1734"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]},{"id":"https://openalex.org/I4210158570","display_name":"Zhejiang University-University of Edinburgh Institute","ror":"https://ror.org/04jth1r26","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210158570","https://openalex.org/I76130692","https://openalex.org/I98677209"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Wenchao Chen","raw_affiliation_strings":["Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University/University of Illinois Urbana–Champaign Institute (ZJUUIUC Institute), International Campus, Zhejiang University, Haining, China","institution_ids":["https://openalex.org/I4210158570"]},{"raw_affiliation_string":"International Campus, Zhejiang University, Zhejiang University/University of Illinois Urbana-Champaign Institute (ZJU-UIUC Institute), Haining, China","institution_ids":["https://openalex.org/I4210158570","https://openalex.org/I157725225"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5073298558"],"corresponding_institution_ids":["https://openalex.org/I157725225","https://openalex.org/I4210158570"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14997576,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"45","issue":"2","first_page":"756","last_page":"763"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9891999959945679,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9891999959945679,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9850999712944031,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9829999804496765,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/spice","display_name":"Spice","score":0.7974563837051392},{"id":"https://openalex.org/keywords/multiphysics","display_name":"Multiphysics","score":0.7959576845169067},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.6712824106216431},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5163077712059021},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.48274344205856323},{"id":"https://openalex.org/keywords/discrete-circuit","display_name":"Discrete circuit","score":0.4804525077342987},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.47108590602874756},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.44664791226387024},{"id":"https://openalex.org/keywords/short-circuit","display_name":"Short circuit","score":0.4218995273113251},{"id":"https://openalex.org/keywords/network-analysis","display_name":"Network analysis","score":0.4126723110675812},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3938184082508087},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3798280358314514},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2989828586578369},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2807236313819885},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2654125690460205},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.18271887302398682},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.1431785523891449},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.14091870188713074}],"concepts":[{"id":"https://openalex.org/C2780077345","wikidata":"https://www.wikidata.org/wiki/Q16891888","display_name":"Spice","level":2,"score":0.7974563837051392},{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.7959576845169067},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.6712824106216431},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5163077712059021},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48274344205856323},{"id":"https://openalex.org/C188058453","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Discrete circuit","level":4,"score":0.4804525077342987},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.47108590602874756},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.44664791226387024},{"id":"https://openalex.org/C68583231","wikidata":"https://www.wikidata.org/wiki/Q206907","display_name":"Short circuit","level":3,"score":0.4218995273113251},{"id":"https://openalex.org/C32946077","wikidata":"https://www.wikidata.org/wiki/Q618079","display_name":"Network analysis","level":2,"score":0.4126723110675812},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3938184082508087},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3798280358314514},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2989828586578369},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2807236313819885},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2654125690460205},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.18271887302398682},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1431785523891449},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.14091870188713074}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2025.3587523","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2025.3587523","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.44999998807907104,"display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G172023877","display_name":null,"funder_award_id":"62122067","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6573488942","display_name":null,"funder_award_id":"LDT23F0402","funder_id":"https://openalex.org/F4320338464","funder_display_name":"Natural Science Foundation of Zhejiang Province"},{"id":"https://openalex.org/G7019623190","display_name":null,"funder_award_id":"LDT23F04021F04","funder_id":"https://openalex.org/F4320338464","funder_display_name":"Natural Science Foundation of Zhejiang Province"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320338464","display_name":"Natural Science Foundation of Zhejiang Province","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W2064333398","https://openalex.org/W2921384035","https://openalex.org/W3010289507","https://openalex.org/W3048551761","https://openalex.org/W3191601965","https://openalex.org/W3207655436","https://openalex.org/W3212003096","https://openalex.org/W4239343005","https://openalex.org/W4282034869","https://openalex.org/W4293371112","https://openalex.org/W4294090785","https://openalex.org/W4317793282","https://openalex.org/W4380303639","https://openalex.org/W4380839996","https://openalex.org/W4385413316","https://openalex.org/W4385525510","https://openalex.org/W4387319178","https://openalex.org/W4387757720","https://openalex.org/W4387757760","https://openalex.org/W4389169209","https://openalex.org/W4389880065","https://openalex.org/W4391547529","https://openalex.org/W4391941586","https://openalex.org/W4392701490","https://openalex.org/W4401879022","https://openalex.org/W4403758733","https://openalex.org/W4407763583","https://openalex.org/W4407898327","https://openalex.org/W4408058557"],"related_works":["https://openalex.org/W2378047323","https://openalex.org/W4210538510","https://openalex.org/W2383057801","https://openalex.org/W2155273351","https://openalex.org/W3168248250","https://openalex.org/W1972185800","https://openalex.org/W2392422499","https://openalex.org/W4390750158","https://openalex.org/W2376235459","https://openalex.org/W4387146045"],"abstract_inverted_index":{"Modeling":[0],"and":[1,42,108,118,130],"analyzing":[2],"multiphysics":[3,114,149],"effects":[4,129,159],"has":[5],"become":[6],"one":[7,22],"of":[8,23,65,116],"the":[9,24,34,94,109,126,137,156],"most":[10,25],"challenging":[11],"issues":[12],"in":[13,29,162],"integrated":[14,163],"circuit":[15,19,30,59,68,82,99,102,105,115,150],"design.":[16],"Equivalent":[17],"thermal":[18],"method":[20,28,60,83,140],"is":[21,40,48,84,152],"commonly":[26],"used":[27],"design":[31],"to":[32,51,62,73,124,154],"simulate":[33,125,155],"electrothermal":[35],"coupling":[36,54,128,158],"effects,":[37],"since":[38],"it":[39,47],"fast":[41],"compatible":[43],"with":[44,132],"SPICE.":[45,78],"However,":[46],"still":[49],"difficult":[50],"realize":[52],"electro-thermalmechanical":[53],"simulation":[55,133],"based":[56,86],"on":[57,87],"equivalent":[58,66,80,96,98,101,104,113,148],"due":[61],"a":[63],"lack":[64],"mechanical":[67,81],"method,":[69],"which":[70],"brings":[71],"difficulties":[72],"do":[74],"electro-thermal-mechanical":[75,127,157],"analysis":[76],"by":[77,92,160],"The":[79,112,142],"proposed":[85,147],"solid":[88],"mechanics":[89],"equilibrium":[90],"equation":[91],"deriving":[93],"electro-mechanical":[95],"relation,":[97],"elements,":[100],"structure,":[103],"boundary":[106],"condition,":[107],"solving":[110],"algorithm.":[111],"TSV":[117],"FinFET":[119],"are":[120],"then":[121],"further":[122],"constructed":[123],"verified":[131],"results":[134,143],"obtained":[135],"from":[136],"finite":[138],"element":[139],"(FEM).":[141],"show":[144],"that":[145],"our":[146],"framework":[151],"able":[153],"SPICE":[161],"circuits.":[164]},"counts_by_year":[],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}