{"id":"https://openalex.org/W4402830624","doi":"https://doi.org/10.1109/tcad.2024.3468011","title":"Efficient Automatic Design of IGBT Structural Parameters Using Differential Evolution and Machine Learning Model","display_name":"Efficient Automatic Design of IGBT Structural Parameters Using Differential Evolution and Machine Learning Model","publication_year":2024,"publication_date":"2024-09-25","ids":{"openalex":"https://openalex.org/W4402830624","doi":"https://doi.org/10.1109/tcad.2024.3468011"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2024.3468011","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2024.3468011","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101925830","display_name":"Qing Yao","orcid":"https://orcid.org/0000-0002-2069-1588"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qing Yao","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0002-2069-1588","affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101588524","display_name":"Jing Chen","orcid":"https://orcid.org/0000-0001-9008-3556"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jing Chen","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0001-9008-3556","affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088124575","display_name":"Kemeng Yang","orcid":"https://orcid.org/0000-0003-2970-993X"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kemeng Yang","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082761917","display_name":"Jiafei Yao","orcid":"https://orcid.org/0000-0002-1469-0677"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiafei Yao","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0002-1469-0677","affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065489475","display_name":"Jun Zhang","orcid":"https://orcid.org/0000-0002-5688-295X"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun Zhang","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0002-5688-295X","affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057222957","display_name":"Yuxuan Dai","orcid":"https://orcid.org/0000-0002-7420-9347"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuxuan Dai","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008356565","display_name":"Weihua Tang","orcid":"https://orcid.org/0000-0002-8771-3120"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Weihua Tang","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0002-8771-3120","affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100320398","display_name":"Bo Zhang","orcid":"https://orcid.org/0000-0003-1288-1549"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]},{"id":"https://openalex.org/I4210124847","display_name":"National Engineering Research Center of Electromagnetic Radiation Control Materials","ror":"https://ror.org/02k4dcs46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210124847"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Zhang","raw_affiliation_strings":["State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China"],"raw_orcid":"https://orcid.org/0000-0003-1288-1549","affiliations":[{"raw_affiliation_string":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711","https://openalex.org/I4210124847"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100750282","display_name":"Yufeng Guo","orcid":"https://orcid.org/0000-0002-1490-986X"},"institutions":[{"id":"https://openalex.org/I41198531","display_name":"Nanjing University of Posts and Telecommunications","ror":"https://ror.org/043bpky34","country_code":"CN","type":"education","lineage":["https://openalex.org/I41198531"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yufeng Guo","raw_affiliation_strings":["College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China"],"raw_orcid":"https://orcid.org/0000-0002-1490-986X","affiliations":[{"raw_affiliation_string":"College of Integrated Circuit Science and Engineering and the National and Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, Nanjing, China","institution_ids":["https://openalex.org/I41198531"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3724,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.53110239,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"44","issue":"3","first_page":"1059","last_page":"1069"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9932000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11201","display_name":"Metallurgy and Material Forming","score":0.9782999753952026,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12898","display_name":"Induction Heating and Inverter Technology","score":0.9721999764442444,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insulated-gate-bipolar-transistor","display_name":"Insulated-gate bipolar transistor","score":0.6904116868972778},{"id":"https://openalex.org/keywords/differential","display_name":"Differential (mechanical device)","score":0.6280369758605957},{"id":"https://openalex.org/keywords/differential-evolution","display_name":"Differential evolution","score":0.540644645690918},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4753403663635254},{"id":"https://openalex.org/keywords/machine-learning","display_name":"Machine learning","score":0.3212050497531891},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3070545792579651},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2461976408958435},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11999779939651489}],"concepts":[{"id":"https://openalex.org/C28285623","wikidata":"https://www.wikidata.org/wiki/Q176110","display_name":"Insulated-gate bipolar transistor","level":3,"score":0.6904116868972778},{"id":"https://openalex.org/C93226319","wikidata":"https://www.wikidata.org/wiki/Q193137","display_name":"Differential (mechanical device)","level":2,"score":0.6280369758605957},{"id":"https://openalex.org/C74750220","wikidata":"https://www.wikidata.org/wiki/Q2662197","display_name":"Differential evolution","level":2,"score":0.540644645690918},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4753403663635254},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.3212050497531891},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3070545792579651},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2461976408958435},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11999779939651489},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2024.3468011","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2024.3468011","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2057938805","display_name":null,"funder_award_id":"U23B2042","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G2752410276","display_name":null,"funder_award_id":"BK 20230357","funder_id":"https://openalex.org/F4320322769","funder_display_name":"Natural Science Foundation of Jiangsu Province"},{"id":"https://openalex.org/G7297007497","display_name":null,"funder_award_id":"BE2022126","funder_id":"https://openalex.org/F4320327777","funder_display_name":"Jiangsu Provincial Key Research and Development Program"},{"id":"https://openalex.org/G7562793436","display_name":null,"funder_award_id":"BK20230357","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320322769","display_name":"Natural Science Foundation of Jiangsu Province","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320327777","display_name":"Jiangsu Provincial Key Research and Development Program","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W267840210","https://openalex.org/W1977253746","https://openalex.org/W2113862478","https://openalex.org/W2152195021","https://openalex.org/W2809890364","https://openalex.org/W2921134108","https://openalex.org/W2943200667","https://openalex.org/W2947934605","https://openalex.org/W2964137095","https://openalex.org/W2964573196","https://openalex.org/W2980921441","https://openalex.org/W3005062380","https://openalex.org/W3047171578","https://openalex.org/W3047608619","https://openalex.org/W3078521982","https://openalex.org/W3094910443","https://openalex.org/W3097308268","https://openalex.org/W3110873423","https://openalex.org/W3111831826","https://openalex.org/W3124031675","https://openalex.org/W3146366485","https://openalex.org/W3166009481","https://openalex.org/W3171758355","https://openalex.org/W3180930580","https://openalex.org/W3187389359","https://openalex.org/W3198728542","https://openalex.org/W4200219845","https://openalex.org/W4205792523","https://openalex.org/W4206901022","https://openalex.org/W4313639540","https://openalex.org/W4364322602"],"related_works":["https://openalex.org/W2961085424","https://openalex.org/W4306674287","https://openalex.org/W4387369504","https://openalex.org/W3046775127","https://openalex.org/W4394896187","https://openalex.org/W3170094116","https://openalex.org/W4386462264","https://openalex.org/W3107602296","https://openalex.org/W4364306694","https://openalex.org/W4312192474"],"abstract_inverted_index":{"Insulated":[0],"gate":[1,100],"bipolar":[2],"transistors":[3],"(IGBTs)":[4],"are":[5,132],"the":[6,13,27,44,53,61,73,82,92,105,114,120,125,129,136,139,144,149,161,168,172,186],"key":[7],"component":[8],"in":[9,26,91],"power":[10],"electronics,":[11],"and":[12,19,77,98,104,146,164,191],"intricate":[14],"relationship":[15],"between":[16,75],"their":[17],"performance":[18,80,84,106],"structural":[20,40,69],"parameters":[21,41,70],"poses":[22],"a":[23],"formidable":[24],"challenge":[25],"design":[28,36,93,110,174,184],"process.":[29],"This":[30],"article":[31],"proposes":[32],"an":[33],"automatic":[34],"optimal":[35],"method":[37,88,181],"for":[38,188],"IGBT":[39,55,183],"to":[42,50,66,119,135],"leverage":[43],"pretrained":[45],"machine":[46],"learning":[47],"(ML)":[48],"model":[49],"efficiently":[51],"predict":[52],"initial":[54],"device\u2019s":[56],"performance,":[57],"followed":[58],"by":[59],"utilizing":[60],"differential":[62],"evolution":[63],"(DE)":[64],"algorithm":[65],"automatically":[67],"adjust":[68],"based":[71],"on":[72],"disparity":[74],"predicted":[76],"expected":[78,83],"device":[79,116],"until":[81],"is":[85,89,117],"achieved.":[86],"The":[87,180],"validated":[90],"of":[94,107,113,128,138,148],"punch-through":[95],"IGBTs":[96,102],"(PT-IGBTs)":[97],"trench":[99],"field-stop":[101],"(FS-IGBTs),":[103],"technology":[108],"computer-aided":[109],"(TCAD)":[111],"simulation":[112,126],"designed":[115,130],"similar":[118],"target":[121],"performance.":[122],"In":[123,151],"particular,":[124],"results":[127],"FS-IGBT":[131],"highly":[133],"fitted":[134],"datasheet":[137],"commercial":[140],"device,":[141],"which":[142],"verifies":[143],"generalizability":[145],"effectiveness":[147],"method.":[150],"addition,":[152],"comparative":[153],"analyses":[154],"with":[155,177],"various":[156],"algorithms":[157],"show":[158],"DE":[159],"provides":[160],"fastest":[162],"optimization":[163],"extraordinary":[165],"robustness":[166],"under":[167],"exact":[169],"specifications.":[170],"Crucially,":[171],"proposed":[173],"scheme":[175],"aligns":[176],"semiconductor":[178],"physics.":[179],"simplifies":[182],"without":[185],"need":[187],"manual":[189],"tuning":[190],"TCAD":[192],"tool":[193],"simulation.":[194]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2026-08-01T09:00:35.917206","created_date":"2025-10-10T00:00:00"}