{"id":"https://openalex.org/W3168096649","doi":"https://doi.org/10.1109/tcad.2021.3088081","title":"Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling","display_name":"Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling","publication_year":2021,"publication_date":"2021-06-10","ids":{"openalex":"https://openalex.org/W3168096649","doi":"https://doi.org/10.1109/tcad.2021.3088081","mag":"3168096649"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2021.3088081","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2021.3088081","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100392715","display_name":"Jinwei Zhang","orcid":"https://orcid.org/0000-0003-4396-4988"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jinwei Zhang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"raw_orcid":"https://orcid.org/0000-0003-4396-4988","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048992445","display_name":"Sheriff Sadiqbatcha","orcid":"https://orcid.org/0000-0001-7474-3366"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheriff Sadiqbatcha","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"raw_orcid":"https://orcid.org/0000-0001-7474-3366","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036717264","display_name":"Michael O\u2019Dea","orcid":null},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael O'Dea","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059133190","display_name":"Hussam Amrouch","orcid":"https://orcid.org/0000-0002-5649-3102"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hussam Amrouch","raw_affiliation_strings":["Institute of Computer Architecture and Engineering, University of Stuttgart, Stuttgart, Germany"],"raw_orcid":"https://orcid.org/0000-0002-5649-3102","affiliations":[{"raw_affiliation_string":"Institute of Computer Architecture and Engineering, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA"],"raw_orcid":"https://orcid.org/0000-0003-2119-6869","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California at Riverside, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.0418,"has_fulltext":false,"cited_by_count":22,"citation_normalized_percentile":{"value":0.73351801,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"41","issue":"5","first_page":"1453","last_page":"1466"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.7763402462005615},{"id":"https://openalex.org/keywords/power-density","display_name":"Power density","score":0.5685664415359497},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5343949198722839},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.509072482585907},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4699682891368866},{"id":"https://openalex.org/keywords/multiphysics","display_name":"Multiphysics","score":0.4602024257183075},{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.45177406072616577},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3726840019226074},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.357547402381897},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3470543622970581},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.32516932487487793},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.3198099732398987},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24799421429634094},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.20702505111694336},{"id":"https://openalex.org/keywords/meteorology","display_name":"Meteorology","score":0.1409120261669159},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.09479644894599915},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.08984711766242981}],"concepts":[{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.7763402462005615},{"id":"https://openalex.org/C21881925","wikidata":"https://www.wikidata.org/wiki/Q3503313","display_name":"Power density","level":3,"score":0.5685664415359497},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5343949198722839},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.509072482585907},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4699682891368866},{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.4602024257183075},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.45177406072616577},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3726840019226074},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.357547402381897},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3470543622970581},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.32516932487487793},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.3198099732398987},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24799421429634094},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.20702505111694336},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.1409120261669159},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.09479644894599915},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08984711766242981},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2021.3088081","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2021.3088081","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.75,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G1710458826","display_name":null,"funder_award_id":"CCF-1816361","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G4944600653","display_name":null,"funder_award_id":"CCF-2007135","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G542091280","display_name":null,"funder_award_id":"OISE-1854276","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1631448130","https://openalex.org/W1976120012","https://openalex.org/W1991005859","https://openalex.org/W2047957840","https://openalex.org/W2049247044","https://openalex.org/W2062360490","https://openalex.org/W2084169508","https://openalex.org/W2093521716","https://openalex.org/W2095858451","https://openalex.org/W2098228187","https://openalex.org/W2098335003","https://openalex.org/W2103245853","https://openalex.org/W2129960401","https://openalex.org/W2133804388","https://openalex.org/W2139626055","https://openalex.org/W2164681134","https://openalex.org/W2166083944","https://openalex.org/W2308963902","https://openalex.org/W2510850517","https://openalex.org/W2611989251","https://openalex.org/W2770195822","https://openalex.org/W2946349917","https://openalex.org/W3013100191","https://openalex.org/W3041101080","https://openalex.org/W3167204903","https://openalex.org/W4237018730","https://openalex.org/W4244593655","https://openalex.org/W4247546971"],"related_works":["https://openalex.org/W2010566957","https://openalex.org/W2336180455","https://openalex.org/W4313854556","https://openalex.org/W3005137437","https://openalex.org/W2035243309","https://openalex.org/W2947027802","https://openalex.org/W4310449551","https://openalex.org/W2077549623","https://openalex.org/W3194230057","https://openalex.org/W2968411144"],"abstract_inverted_index":{"In":[0],"this":[1,145],"article,":[2],"we":[3],"address":[4],"the":[5,32,69,79,92,98,112,136,158,163,182,189,192,198,220,225,230,244,262,265,270,274],"problem":[6,29],"of":[7,57,111,201],"accurate":[8,41],"full-chip":[9,42,159],"power":[10,44,82,94,100,138,170,232,276],"and":[11,141,156,177,197,224,257,264,283],"thermal":[12,71,109,122,126,142,151,160,184,194,202,222,226,267],"map":[13,46,277],"estimation":[14,47,278],"for":[15,49],"commercial":[16,50],"off-the-shelf":[17],"multicore":[18,51],"processors.":[19],"Processors":[20],"operating":[21],"with":[22,114,153,211,234],"heat":[23,75,154,164,178,241],"sink":[24,76,155,165,179,242],"cooling":[25,116,176,180,213],"remains":[26],"a":[27,58,85,148,252,293],"challenging":[28],"due":[30],"to":[31,77,90,134],"difficulty":[33],"in":[34,129],"direct":[35],"measurement.":[36],"We":[37],"first":[38],"propose":[39],"an":[40,118,206],"steady-state":[43],"density":[45,95,101,139],"method":[48,55,279],"microprocessors.":[52],"The":[53,103],"new":[54,104],"consists":[56],"few":[59],"steps.":[60],"First,":[61],"2-D":[62],"spatial":[63],"Laplace":[64],"operation":[65],"is":[66,88,106,132,166,248],"performed":[67],"on":[68,108,205],"measured":[70,221],"maps":[72,96,140,161,171,185,223,227,268],"(images)":[73],"without":[74],"obtain":[78],"so-called":[80],"<i>raw":[81],"maps</i>.":[83],"Then,":[84],"novel":[86],"scheme":[87],"developed":[89],"generate":[91],"true":[93],"from":[97,229],"raw":[99],"maps.":[102,203],"approach":[105],"based":[107],"measurements":[110],"processor":[113,210],"back-side":[115],"using":[117],"advanced":[119],"infrared":[120],"(IR)":[121],"imaging":[123],"system.":[124],"FEM":[125,150],"model":[127,152],"constructed":[128],"COMSOL":[130],"Multiphysics":[131],"used":[133],"validate":[135],"estimated":[137,231],"conductivity.":[143],"Later,":[144],"work":[146],"creates":[147],"high-fidelity":[149],"reconstructs":[157],"while":[162],"on.":[167],"Ensuring":[168],"that":[169],"are":[172,186],"similar":[173],"under":[174],"back":[175,212],"settings,":[181],"reconstructed":[183,228],"verified":[187],"by":[188],"matching":[190],"between":[191,219,261],"on-chip":[193],"sensor":[195,271],"readings":[196],"corresponding":[199],"elements":[200],"Experiments":[204],"Intel":[207],"i7-8650U":[208],"4-core":[209],"shows":[214],"96&#x0025;":[215],"similarity":[216],"(2-D":[217],"correlation)":[218],"maps,":[233],"1.3":[235],"&#x00B0;C":[236,250,254],"average":[237,245],"absolute":[238,246],"error.":[239],"Under":[240],"cooling,":[243],"error":[247,260],"2.2":[249],"over":[251],"56":[253],"temperature":[255],"range":[256],"about":[258],"3.9&#x0025;":[259],"computed":[263],"real":[266],"at":[269,284],"locations.":[272],"Furthermore,":[273],"proposed":[275,295],"achieves":[280],"higher":[281],"resolution":[282],"least":[285],"<inline-formula>":[286],"<tex-math":[287],"notation=\"LaTeX\">$100\\times":[288],"$":[289],"</tex-math></inline-formula>":[290],"speedup":[291],"than":[292],"recently":[294],"state-of-art":[296],"Blind":[297],"Power":[298],"Identification":[299],"method.":[300]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":8},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":3}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}