{"id":"https://openalex.org/W2946644905","doi":"https://doi.org/10.1109/tcad.2020.3033745","title":"Novel Guiding Template and Mask Assignment for DSA-MP Hybrid Lithography Using Multiple BCP Materials","display_name":"Novel Guiding Template and Mask Assignment for DSA-MP Hybrid Lithography Using Multiple BCP Materials","publication_year":2020,"publication_date":"2020-10-26","ids":{"openalex":"https://openalex.org/W2946644905","doi":"https://doi.org/10.1109/tcad.2020.3033745","mag":"2946644905"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2020.3033745","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3033745","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101577192","display_name":"Yi\u2010Ting Lin","orcid":"https://orcid.org/0000-0002-8745-8756"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi-Ting Lin","raw_affiliation_strings":["Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031004106","display_name":"Iris Hui-Ru Jiang","orcid":"https://orcid.org/0000-0002-4554-3442"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Iris Hui-Ru Jiang","raw_affiliation_strings":["Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-4554-3442","affiliations":[{"raw_affiliation_string":"Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan","institution_ids":["https://openalex.org/I16733864"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I16733864"],"apc_list":null,"apc_paid":null,"fwci":0.2442,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.47976936,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"40","issue":"9","first_page":"1909","last_page":"1919"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/template","display_name":"Template","score":0.7364603877067566},{"id":"https://openalex.org/keywords/backtracking","display_name":"Backtracking","score":0.6519778966903687},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6345932483673096},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.5894181728363037},{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.54996258020401},{"id":"https://openalex.org/keywords/heuristic","display_name":"Heuristic","score":0.4584992825984955},{"id":"https://openalex.org/keywords/graph","display_name":"Graph","score":0.44413483142852783},{"id":"https://openalex.org/keywords/multiple-patterning","display_name":"Multiple patterning","score":0.44298428297042847},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.44097089767456055},{"id":"https://openalex.org/keywords/integer-programming","display_name":"Integer programming","score":0.4394971430301666},{"id":"https://openalex.org/keywords/theoretical-computer-science","display_name":"Theoretical computer science","score":0.3043053150177002},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.14961275458335876},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.1306534707546234},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.12869754433631897},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12644198536872864},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.10647034645080566}],"concepts":[{"id":"https://openalex.org/C82714645","wikidata":"https://www.wikidata.org/wiki/Q438331","display_name":"Template","level":2,"score":0.7364603877067566},{"id":"https://openalex.org/C156884757","wikidata":"https://www.wikidata.org/wiki/Q798554","display_name":"Backtracking","level":2,"score":0.6519778966903687},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6345932483673096},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5894181728363037},{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.54996258020401},{"id":"https://openalex.org/C173801870","wikidata":"https://www.wikidata.org/wiki/Q201413","display_name":"Heuristic","level":2,"score":0.4584992825984955},{"id":"https://openalex.org/C132525143","wikidata":"https://www.wikidata.org/wiki/Q141488","display_name":"Graph","level":2,"score":0.44413483142852783},{"id":"https://openalex.org/C177409738","wikidata":"https://www.wikidata.org/wiki/Q1917460","display_name":"Multiple patterning","level":4,"score":0.44298428297042847},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.44097089767456055},{"id":"https://openalex.org/C56086750","wikidata":"https://www.wikidata.org/wiki/Q6042592","display_name":"Integer programming","level":2,"score":0.4394971430301666},{"id":"https://openalex.org/C80444323","wikidata":"https://www.wikidata.org/wiki/Q2878974","display_name":"Theoretical computer science","level":1,"score":0.3043053150177002},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.14961275458335876},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.1306534707546234},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.12869754433631897},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12644198536872864},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.10647034645080566},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2020.3033745","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3033745","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2344863027","display_name":"Ai Enhanced Timing Analysis and Optimization","funder_award_id":"MOST108-2221-E002-099-MY3","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"},{"id":"https://openalex.org/G4797563679","display_name":"Layout Decomposition and Compliance for Printability Enhancement at Advanced Technology Nodes","funder_award_id":"MOST106-2628-E002-019-MY3","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"},{"id":"https://openalex.org/G6852134079","display_name":"Intelligent Design Automation for 2.5/3d Heterogeneous Soc Integration( I )","funder_award_id":"MOST108-2218-E002-074","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"}],"funders":[{"id":"https://openalex.org/F4320309545","display_name":"Synopsys","ror":"https://ror.org/013by2m91"},{"id":"https://openalex.org/F4320322589","display_name":"Taiwan Semiconductor Manufacturing Company","ror":"https://ror.org/02wx79d08"},{"id":"https://openalex.org/F4320322795","display_name":"Ministry of Science and Technology, Taiwan","ror":"https://ror.org/02kv4zf79"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":34,"referenced_works":["https://openalex.org/W1517476027","https://openalex.org/W1769298637","https://openalex.org/W1995865561","https://openalex.org/W2005611546","https://openalex.org/W2034249953","https://openalex.org/W2069569817","https://openalex.org/W2083274833","https://openalex.org/W2084145289","https://openalex.org/W2161629461","https://openalex.org/W2213088056","https://openalex.org/W2292988356","https://openalex.org/W2293915858","https://openalex.org/W2299267913","https://openalex.org/W2335749086","https://openalex.org/W2397159571","https://openalex.org/W2526196797","https://openalex.org/W2594817995","https://openalex.org/W2599142871","https://openalex.org/W2753737674","https://openalex.org/W2757526385","https://openalex.org/W2770654744","https://openalex.org/W2772541697","https://openalex.org/W2895199396","https://openalex.org/W3038027991","https://openalex.org/W4233720897","https://openalex.org/W4247606811","https://openalex.org/W4248126276","https://openalex.org/W6631062882","https://openalex.org/W6651628870","https://openalex.org/W6667940717","https://openalex.org/W6671448402","https://openalex.org/W6671725258","https://openalex.org/W6697096587","https://openalex.org/W6735248961"],"related_works":["https://openalex.org/W2094969048","https://openalex.org/W1520032252","https://openalex.org/W2575916813","https://openalex.org/W2374431139","https://openalex.org/W2621496481","https://openalex.org/W2403265952","https://openalex.org/W1993189065","https://openalex.org/W2061371996","https://openalex.org/W2753737674","https://openalex.org/W1996145581"],"abstract_inverted_index":{"Directed":[0],"self-assembly":[1],"(DSA)":[2],"is":[3,58,130,164,192],"one":[4],"of":[5,13,33,71,104,181,200,217],"the":[6,11,29,50,69,123,155,178,213],"leading":[7],"candidates":[8],"for":[9],"extending":[10],"resolution":[12,32],"optical":[14],"lithography":[15,27],"to":[16,60,126,154,168,172,196],"sub-7":[17],"nm":[18],"and":[19,31,55,57,73,83,96,102,112,143,152,161,166,194,203,215],"beyond.":[20],"By":[21],"incorporating":[22],"DSA":[23],"in":[24,76],"multiple":[25,42,205],"patterning":[26,35,206],"(DSA-MP),":[28],"flexibility":[30],"contact/via":[34],"can":[36,109,116],"be":[37,110,117],"further":[38,121],"enhanced":[39],"by":[40,78,132],"using":[41],"block":[43],"copolymer":[44],"(BCP)":[45],"materials.":[46],"Prior":[47],"work":[48],"faces":[49],"dilemma":[51],"between":[52],"solution":[53,150],"quality":[54,151],"efficiency":[56,153,216],"unable":[59],"handle":[61],"2-D":[62],"templates.":[63],"In":[64],"this":[65],"article,":[66],"we":[67,184],"capture":[68],"essence":[70],"template":[72,97],"mask":[74],"assignment":[75,124],"DSA-MP":[77],"a":[79,84,133,186],"new":[80,85],"graph":[81,89,162],"model":[82,90],"problem":[86,125,160],"reduction:":[87],"Our":[88,136],"explicitly":[91],"represents":[92],"spacing":[93],"conflict":[94,187,197],"edges":[95,108],"hyperedges;":[98],"thus,":[99],"extra":[100],"enumeration":[101],"manipulation":[103],"incompatible":[105],"via":[106],"grouping":[107],"avoided,":[111],"arbitrary":[113],"1-D/2-D":[114],"templates":[115],"natively":[118],"handled.":[119],"We":[120],"reduce":[122],"exact":[127,201],"cover,":[128],"which":[129,191],"encoded":[131],"sparse":[134],"matrix.":[135],"concise":[137],"integer":[138],"linear":[139],"programming":[140],"(ILP)":[141],"formulation":[142],"fast":[144],"backtracking":[145],"heuristic":[146],"achieve":[147],"substantially":[148],"superior":[149],"state-of-the-art":[156],"work.":[157],"Moreover,":[158],"our":[159,218],"modelling":[163],"flexible":[165],"extensible":[167],"utilize":[169],"dummy":[170,182],"vias":[171],"improve":[173],"manufacturability.":[174],"To":[175],"narrow":[176],"down":[177],"search":[179],"region":[180],"vias,":[183],"devise":[185],"core":[188,198],"finding":[189],"technique,":[190],"general":[193],"applicable":[195],"analysis":[199],"cover":[202],"other":[204],"layout":[207],"decomposition":[208],"problems.":[209],"Experimental":[210],"results":[211],"show":[212],"effectiveness":[214],"approach.":[219]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2}],"updated_date":"2026-08-01T09:00:35.917206","created_date":"2025-10-10T00:00:00"}