{"id":"https://openalex.org/W3006089892","doi":"https://doi.org/10.1109/tcad.2020.3015469","title":"From IC Layout to Die Photograph: A CNN-Based Data-Driven Approach","display_name":"From IC Layout to Die Photograph: A CNN-Based Data-Driven Approach","publication_year":2020,"publication_date":"2020-08-10","ids":{"openalex":"https://openalex.org/W3006089892","doi":"https://doi.org/10.1109/tcad.2020.3015469","mag":"3006089892"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2020.3015469","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3015469","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["arxiv","crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://arxiv.org/pdf/2002.04967","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089025176","display_name":"Hao-Chiang Shao","orcid":"https://orcid.org/0000-0002-3749-234X"},"institutions":[{"id":"https://openalex.org/I114150738","display_name":"Fu Jen Catholic University","ror":"https://ror.org/04je98850","country_code":"TW","type":"education","lineage":["https://openalex.org/I114150738"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Hao-Chiang Shao","raw_affiliation_strings":["Fu Jen Catholic University, New Taipei City, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-3749-234X","affiliations":[{"raw_affiliation_string":"Fu Jen Catholic University, New Taipei City, Taiwan","institution_ids":["https://openalex.org/I114150738"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008992315","display_name":"Chao-Yi Peng","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chao-Yi Peng","raw_affiliation_strings":["Image Signal Processing Team, Altek Corporation, Hsinchu, Taiwan","National Tsing Hua University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Image Signal Processing Team, Altek Corporation, Hsinchu, Taiwan","institution_ids":[]},{"raw_affiliation_string":"National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090263406","display_name":"Jun-Rei Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]},{"id":"https://openalex.org/I2724335451","display_name":"HTC (Taiwan)","ror":"https://ror.org/02nfvrd33","country_code":"TW","type":"company","lineage":["https://openalex.org/I2724335451"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jun-Rei Wu","raw_affiliation_strings":["Advanced Creativity Team, HTC VIVE, New Taipei City, Taiwan","National Tsing Hua University, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Creativity Team, HTC VIVE, New Taipei City, Taiwan","institution_ids":["https://openalex.org/I2724335451"]},{"raw_affiliation_string":"National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051264473","display_name":"Chia\u2010Wen Lin","orcid":"https://orcid.org/0000-0002-9097-2318"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chia-Wen Lin","raw_affiliation_strings":["Institute of Communications Engineering, National Tsing Hua University, Hsinchu, Taiwan","National Tsing Hua University, Hsinchu, Taiwan"],"raw_orcid":"https://orcid.org/0000-0002-9097-2318","affiliations":[{"raw_affiliation_string":"Institute of Communications Engineering, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065439030","display_name":"Shao\u2010Yun Fang","orcid":"https://orcid.org/0000-0001-6675-2676"},"institutions":[{"id":"https://openalex.org/I154864474","display_name":"National Taiwan University of Science and Technology","ror":"https://ror.org/00q09pe49","country_code":"TW","type":"education","lineage":["https://openalex.org/I154864474"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shao-Yun Fang","raw_affiliation_strings":["National Taiwan University of Science and Technology, Taipei, Taiwan"],"raw_orcid":"https://orcid.org/0000-0001-6675-2676","affiliations":[{"raw_affiliation_string":"National Taiwan University of Science and Technology, Taipei, Taiwan","institution_ids":["https://openalex.org/I154864474"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025185915","display_name":"Pin-Yian Tsai","orcid":null},"institutions":[{"id":"https://openalex.org/I4210161555","display_name":"United Microelectronics (Taiwan)","ror":"https://ror.org/0580qje17","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210161555"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pin-Yian Tsai","raw_affiliation_strings":["Product Engineering Division, United Microelectronics Corporation, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Product Engineering Division, United Microelectronics Corporation, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210161555"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5022423896","display_name":"Yan-Hsiu Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210161555","display_name":"United Microelectronics (Taiwan)","ror":"https://ror.org/0580qje17","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210161555"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yan-Hsiu Liu","raw_affiliation_strings":["Smart Manufacturing Division, United Microelectronics Corporation, Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Smart Manufacturing Division, United Microelectronics Corporation, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210161555"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5089025176"],"corresponding_institution_ids":["https://openalex.org/I114150738"],"apc_list":null,"apc_paid":null,"fwci":1.5605,"has_fulltext":false,"cited_by_count":36,"citation_normalized_percentile":{"value":0.8271389,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":100},"biblio":{"volume":"40","issue":"5","first_page":"957","last_page":"970"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12039","display_name":"Electron and X-Ray Spectroscopy Techniques","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/photomask","display_name":"Photomask","score":0.8614194393157959},{"id":"https://openalex.org/keywords/optical-proximity-correction","display_name":"Optical proximity correction","score":0.7563886642456055},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6293535828590393},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6096271872520447},{"id":"https://openalex.org/keywords/integrated-circuit-layout","display_name":"Integrated circuit layout","score":0.592319130897522},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.4997568130493164},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4942021667957306},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4897487163543701},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.46326425671577454},{"id":"https://openalex.org/keywords/parametric-statistics","display_name":"Parametric statistics","score":0.4516443908214569},{"id":"https://openalex.org/keywords/ic-layout-editor","display_name":"IC layout editor","score":0.45140254497528076},{"id":"https://openalex.org/keywords/consistency","display_name":"Consistency (knowledge bases)","score":0.4292662739753723},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.39468955993652344},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.3741087019443512},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3386896848678589},{"id":"https://openalex.org/keywords/circuit-extraction","display_name":"Circuit extraction","score":0.21917620301246643},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.19522345066070557},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18909767270088196},{"id":"https://openalex.org/keywords/resist","display_name":"Resist","score":0.12569108605384827},{"id":"https://openalex.org/keywords/equivalent-circuit","display_name":"Equivalent circuit","score":0.12093889713287354},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.1078958511352539},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09738418459892273},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.09700086712837219},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.0902688205242157}],"concepts":[{"id":"https://openalex.org/C14737013","wikidata":"https://www.wikidata.org/wiki/Q1319657","display_name":"Photomask","level":4,"score":0.8614194393157959},{"id":"https://openalex.org/C78371743","wikidata":"https://www.wikidata.org/wiki/Q1672829","display_name":"Optical proximity correction","level":3,"score":0.7563886642456055},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6293535828590393},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6096271872520447},{"id":"https://openalex.org/C2765594","wikidata":"https://www.wikidata.org/wiki/Q2624187","display_name":"Integrated circuit layout","level":3,"score":0.592319130897522},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.4997568130493164},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4942021667957306},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4897487163543701},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.46326425671577454},{"id":"https://openalex.org/C117251300","wikidata":"https://www.wikidata.org/wiki/Q1849855","display_name":"Parametric statistics","level":2,"score":0.4516443908214569},{"id":"https://openalex.org/C5546195","wikidata":"https://www.wikidata.org/wiki/Q5969842","display_name":"IC layout editor","level":5,"score":0.45140254497528076},{"id":"https://openalex.org/C2776436953","wikidata":"https://www.wikidata.org/wiki/Q5163215","display_name":"Consistency (knowledge bases)","level":2,"score":0.4292662739753723},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.39468955993652344},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.3741087019443512},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3386896848678589},{"id":"https://openalex.org/C26490066","wikidata":"https://www.wikidata.org/wiki/Q17006835","display_name":"Circuit extraction","level":4,"score":0.21917620301246643},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.19522345066070557},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18909767270088196},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.12569108605384827},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.12093889713287354},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.1078958511352539},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09738418459892273},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.09700086712837219},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0902688205242157},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/tcad.2020.3015469","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3015469","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},{"id":"pmh:oai:arXiv.org:2002.04967","is_oa":true,"landing_page_url":"http://arxiv.org/abs/2002.04967","pdf_url":"https://arxiv.org/pdf/2002.04967","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"}],"best_oa_location":{"id":"pmh:oai:arXiv.org:2002.04967","is_oa":true,"landing_page_url":"http://arxiv.org/abs/2002.04967","pdf_url":"https://arxiv.org/pdf/2002.04967","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G2846541167","display_name":null,"funder_award_id":"MOST 108-2634-F-007-009","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"}],"funders":[{"id":"https://openalex.org/F4320322795","display_name":"Ministry of Science and Technology, Taiwan","ror":"https://ror.org/02kv4zf79"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":50,"referenced_works":["https://openalex.org/W21269541","https://openalex.org/W603908379","https://openalex.org/W1570895503","https://openalex.org/W1585125160","https://openalex.org/W1901129140","https://openalex.org/W1959608418","https://openalex.org/W1993999542","https://openalex.org/W1995125212","https://openalex.org/W2062456486","https://openalex.org/W2082891189","https://openalex.org/W2090843874","https://openalex.org/W2099471712","https://openalex.org/W2103559027","https://openalex.org/W2122017330","https://openalex.org/W2127070222","https://openalex.org/W2129996279","https://openalex.org/W2133059825","https://openalex.org/W2133665775","https://openalex.org/W2134560790","https://openalex.org/W2147973445","https://openalex.org/W2149602086","https://openalex.org/W2474531669","https://openalex.org/W2507812949","https://openalex.org/W2584009249","https://openalex.org/W2732931556","https://openalex.org/W2736295327","https://openalex.org/W2769833683","https://openalex.org/W2809203443","https://openalex.org/W2809465272","https://openalex.org/W2909499127","https://openalex.org/W2945764596","https://openalex.org/W2962753688","https://openalex.org/W2962793481","https://openalex.org/W2962947361","https://openalex.org/W2963073614","https://openalex.org/W2963444790","https://openalex.org/W2963800363","https://openalex.org/W2963890275","https://openalex.org/W3123509264","https://openalex.org/W4243901659","https://openalex.org/W4289665802","https://openalex.org/W4320013936","https://openalex.org/W6600890727","https://openalex.org/W6618372016","https://openalex.org/W6639824700","https://openalex.org/W6734074887","https://openalex.org/W6741078862","https://openalex.org/W6746305658","https://openalex.org/W6750298367","https://openalex.org/W6752645571"],"related_works":["https://openalex.org/W2068691156","https://openalex.org/W2167248162","https://openalex.org/W2044082676","https://openalex.org/W2080426739","https://openalex.org/W1977619209","https://openalex.org/W2034587154","https://openalex.org/W2028605186","https://openalex.org/W2062796777","https://openalex.org/W4297824436","https://openalex.org/W2036121598"],"abstract_inverted_index":{"We":[0],"propose":[1],"a":[2,21,90,116,119,135,148,158,171,181],"deep":[3],"learning-based":[4],"data-driven":[5],"framework":[6,163],"consisting":[7],"of":[8,48,59,147,170,206],"two":[9],"convolutional":[10],"neural":[11],"networks:":[12],"1)":[13],"LithoNet":[14,69,82,141],"that":[15,30,99],"predicts":[16],"the":[17,43,60,72,85,95,129,145,160,168,186,189,193,204,207],"shape":[18,39,44,146,169,191],"deformations":[19],"on":[20,103,118],"circuit":[22,79,150],"due":[23],"to":[24,35,75,93,114,142,185],"IC":[25,32,66,173],"fabrication":[26,73,87],"and":[27,52,132,192],"2)":[28],"OPCNet":[29,127],"suggests":[31,180],"layout":[33,49,67,155,176,182,201],"corrections":[34],"compensate":[36],"for":[37],"such":[38],"deformations.":[40],"By":[41],"learning":[42],"correspondences":[45],"between":[46,188],"pairs":[47],"design":[50],"patterns":[51,202],"their":[53],"scanning":[54],"electron":[55],"microscope":[56],"(SEM)":[57],"images":[58],"product":[61,97],"wafer":[62,86],"thereof,":[63],"given":[64,194],"an":[65],"pattern,":[68],"can":[70,83,100,164],"mimic":[71],"process":[74],"predict":[76,167],"its":[77,153,175],"fabricated":[78,149,172],"shape.":[80],"Furthermore,":[81],"take":[84],"parameters":[88],"as":[89],"latent":[91],"vector":[92],"model":[94],"parametric":[96],"variations":[98],"be":[101],"inspected":[102],"SEM":[104],"images.":[105],"Besides,":[106],"traditional":[107],"optical":[108],"proximity":[109],"correction":[110,117,183],"(OPC)":[111],"methods":[112],"used":[113],"suggest":[115],"lithographic":[120],"photomask":[121,137],"is":[122],"computationally":[123],"expensive.":[124],"Our":[125],"proposed":[126,161,208],"mimics":[128],"OPC":[130],"procedure":[131],"efficiently":[133],"generates":[134],"corrected":[136],"by":[138],"collaborating":[139],"with":[140,198],"examine":[143],"if":[144],"optimally":[151],"matches":[152],"original":[154],"design.":[156],"As":[157],"result,":[159],"LithoNet-OPCNet":[162],"not":[165],"only":[166],"from":[174],"pattern":[177],"but":[178],"also":[179],"according":[184],"consistency":[187],"predicted":[190],"layout.":[195],"Experimental":[196],"results":[197],"several":[199],"benchmark":[200],"demonstrate":[203],"effectiveness":[205],"method.":[209]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":14},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":6},{"year":2022,"cited_by_count":5},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2020-02-24T00:00:00"}