{"id":"https://openalex.org/W3035722655","doi":"https://doi.org/10.1109/tcad.2020.3001259","title":"Defect-Oriented Test: Effectiveness in High Volume Manufacturing","display_name":"Defect-Oriented Test: Effectiveness in High Volume Manufacturing","publication_year":2020,"publication_date":"2020-06-10","ids":{"openalex":"https://openalex.org/W3035722655","doi":"https://doi.org/10.1109/tcad.2020.3001259","mag":"3035722655"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2020.3001259","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3001259","pdf_url":"https://ieeexplore.ieee.org/ielx7/43/9358030/09113500.pdf","source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://ieeexplore.ieee.org/ielx7/43/9358030/09113500.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065187948","display_name":"Friedrich Hapke","orcid":"https://orcid.org/0000-0001-8744-3039"},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Friedrich Hapke","raw_affiliation_strings":["IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany"],"raw_orcid":"https://orcid.org/0000-0001-8744-3039","affiliations":[{"raw_affiliation_string":"IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany","institution_ids":["https://openalex.org/I1325886976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035108727","display_name":"W.D. Howell","orcid":null},"institutions":[{"id":"https://openalex.org/I131781684","display_name":"Intel (Ireland)","ror":"https://ror.org/02r5scg33","country_code":"IE","type":"company","lineage":["https://openalex.org/I131781684","https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["IE","US"],"is_corresponding":false,"raw_author_name":"Will Howell","raw_affiliation_strings":["Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","Intel Corporation, Leixlip, CA, Ireland"],"raw_orcid":"https://orcid.org/0000-0002-8113-1533","affiliations":[{"raw_affiliation_string":"Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corporation, Leixlip, CA, Ireland","institution_ids":["https://openalex.org/I131781684"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Peter Maxwell","orcid":null},"institutions":[{"id":"https://openalex.org/I100625452","display_name":"ON Semiconductor (United States)","ror":"https://ror.org/03nw6pt28","country_code":"US","type":"company","lineage":["https://openalex.org/I100625452"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Peter Maxwell","raw_affiliation_strings":["Intelligent Sensing Group, ON Semiconductor, Santa Clara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intelligent Sensing Group, ON Semiconductor, Santa Clara, CA, USA","institution_ids":["https://openalex.org/I100625452"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044685907","display_name":"Edward Brazil","orcid":null},"institutions":[{"id":"https://openalex.org/I131781684","display_name":"Intel (Ireland)","ror":"https://ror.org/02r5scg33","country_code":"IE","type":"company","lineage":["https://openalex.org/I131781684","https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["IE","US"],"is_corresponding":false,"raw_author_name":"Edward Brazil","raw_affiliation_strings":["Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","Intel Corporation, Leixlip, CA, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corporation, Leixlip, CA, Ireland","institution_ids":["https://openalex.org/I131781684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100896813","display_name":"Srikanth Venkataraman","orcid":null},"institutions":[{"id":"https://openalex.org/I131781684","display_name":"Intel (Ireland)","ror":"https://ror.org/02r5scg33","country_code":"IE","type":"company","lineage":["https://openalex.org/I131781684","https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["IE","US"],"is_corresponding":false,"raw_author_name":"Srikanth Venkataraman","raw_affiliation_strings":["Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","Intel Corporation, Leixlip, CA, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corporation, Leixlip, CA, Ireland","institution_ids":["https://openalex.org/I131781684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046035570","display_name":"Rudrajit Dutta","orcid":null},"institutions":[{"id":"https://openalex.org/I131781684","display_name":"Intel (Ireland)","ror":"https://ror.org/02r5scg33","country_code":"IE","type":"company","lineage":["https://openalex.org/I131781684","https://openalex.org/I1343180700"]},{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["IE","US"],"is_corresponding":false,"raw_author_name":"Rudrajit Dutta","raw_affiliation_strings":["Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","Intel Corporation, Leixlip, CA, Ireland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Manufacturing and Product Engineering Department, Intel Corporation, Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corporation, Leixlip, CA, Ireland","institution_ids":["https://openalex.org/I131781684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066282637","display_name":"Andreas Glowatz","orcid":"https://orcid.org/0000-0002-8086-6220"},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Andreas Glowatz","raw_affiliation_strings":["IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany"],"raw_orcid":"https://orcid.org/0000-0002-8086-6220","affiliations":[{"raw_affiliation_string":"IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany","institution_ids":["https://openalex.org/I1325886976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006600824","display_name":"Anja Fast","orcid":null},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Anja Fast","raw_affiliation_strings":["IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany","institution_ids":["https://openalex.org/I1325886976"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080960636","display_name":"Janusz Rajski","orcid":"https://orcid.org/0000-0003-2124-447X"},"institutions":[{"id":"https://openalex.org/I1325886976","display_name":"Siemens (Germany)","ror":"https://ror.org/059mq0909","country_code":"DE","type":"company","lineage":["https://openalex.org/I1325886976"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Janusz Rajski","raw_affiliation_strings":["IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany"],"raw_orcid":"https://orcid.org/0000-0003-2124-447X","affiliations":[{"raw_affiliation_string":"IC EDA/Tessent Department, Mentor, A Siemens Business, Hamburg, Germany","institution_ids":["https://openalex.org/I1325886976"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":3.4117,"has_fulltext":true,"cited_by_count":32,"citation_normalized_percentile":{"value":0.93001624,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"40","issue":"3","first_page":"584","last_page":"597"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.8614866733551025},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6295915842056274},{"id":"https://openalex.org/keywords/fault-coverage","display_name":"Fault coverage","score":0.5973496437072754},{"id":"https://openalex.org/keywords/automotive-industry","display_name":"Automotive industry","score":0.5825079679489136},{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.5625801682472229},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5311744809150696},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.5025761127471924},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4571329355239868},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.4466802179813385},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.44109150767326355},{"id":"https://openalex.org/keywords/test","display_name":"Test (biology)","score":0.4161011278629303},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.4121227562427521},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3681294918060303},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3357023000717163},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.33116012811660767},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3216840922832489},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.221624493598938},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.1876460313796997},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09341850876808167}],"concepts":[{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.8614866733551025},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6295915842056274},{"id":"https://openalex.org/C126953365","wikidata":"https://www.wikidata.org/wiki/Q5438152","display_name":"Fault coverage","level":3,"score":0.5973496437072754},{"id":"https://openalex.org/C526921623","wikidata":"https://www.wikidata.org/wiki/Q190117","display_name":"Automotive industry","level":2,"score":0.5825079679489136},{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.5625801682472229},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5311744809150696},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.5025761127471924},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4571329355239868},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.4466802179813385},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.44109150767326355},{"id":"https://openalex.org/C2777267654","wikidata":"https://www.wikidata.org/wiki/Q3519023","display_name":"Test (biology)","level":2,"score":0.4161011278629303},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.4121227562427521},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3681294918060303},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3357023000717163},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.33116012811660767},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3216840922832489},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.221624493598938},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.1876460313796997},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09341850876808167},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2020.3001259","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3001259","pdf_url":"https://ieeexplore.ieee.org/ielx7/43/9358030/09113500.pdf","source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1109/tcad.2020.3001259","is_oa":true,"landing_page_url":"https://doi.org/10.1109/tcad.2020.3001259","pdf_url":"https://ieeexplore.ieee.org/ielx7/43/9358030/09113500.pdf","source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":40,"referenced_works":["https://openalex.org/W1519290835","https://openalex.org/W1652447308","https://openalex.org/W1775604791","https://openalex.org/W1961775031","https://openalex.org/W1969497584","https://openalex.org/W1987736596","https://openalex.org/W1998976901","https://openalex.org/W2008990681","https://openalex.org/W2014719900","https://openalex.org/W2037926253","https://openalex.org/W2041090186","https://openalex.org/W2061946964","https://openalex.org/W2096007426","https://openalex.org/W2098112833","https://openalex.org/W2107973438","https://openalex.org/W2112559786","https://openalex.org/W2117312779","https://openalex.org/W2119277411","https://openalex.org/W2120349980","https://openalex.org/W2129555080","https://openalex.org/W2132188866","https://openalex.org/W2133505378","https://openalex.org/W2136231728","https://openalex.org/W2139098916","https://openalex.org/W2147029025","https://openalex.org/W2151628041","https://openalex.org/W2162442179","https://openalex.org/W2165162946","https://openalex.org/W2169375167","https://openalex.org/W2170026220","https://openalex.org/W2170907629","https://openalex.org/W2467390465","https://openalex.org/W2486078890","https://openalex.org/W2616575701","https://openalex.org/W2735572146","https://openalex.org/W2911433171","https://openalex.org/W2911724039","https://openalex.org/W3147331103","https://openalex.org/W6720122413","https://openalex.org/W6738309793"],"related_works":["https://openalex.org/W2786111245","https://openalex.org/W3009953521","https://openalex.org/W4285708951","https://openalex.org/W1991935474","https://openalex.org/W2021253405","https://openalex.org/W2323083271","https://openalex.org/W2091533492","https://openalex.org/W2570882127","https://openalex.org/W2802691720","https://openalex.org/W2940545572"],"abstract_inverted_index":{"This":[0],"article":[1],"describes":[2],"a":[3,10,110,116,123],"defect-oriented":[4],"test":[5,15,90,96,134,143],"(DOT)":[6],"approach,":[7],"which":[8,156],"enables":[9],"complete":[11,46],"physical":[12,58],"defect-based":[13],"automatic":[14],"pattern":[16],"generation":[17,36,44],"(ATPG)":[18],"for":[19,34,49],"the":[20,35,43,73,160],"digital":[21],"logic":[22],"area":[23,29],"of":[24,37,45,63,76],"CMOS-based":[25],"designs.":[26],"Total":[27],"critical":[28],"(TCA)-based":[30],"methods":[31,66],"are":[32],"presented":[33],"needed":[38],"DOT":[39],"views":[40],"to":[41,70,81,118,152],"enable":[42],"DOT-based":[47],"patterns":[48,68],"detecting":[50],"all":[51,56],"cell-internal":[52],"and":[53,67,88,140],"as":[54,159],"well":[55],"cell-external":[57],"defects.":[59],"The":[60],"major":[61],"aim":[62],"these":[64],"new":[65],"is":[69,83,157],"further":[71],"reduce":[72],"defect":[74,100],"rate":[75,101],"manufactured":[77],"ICs,":[78],"in":[79,103,138],"addition":[80],"what":[82],"already":[84],"achieved":[85,99],"with":[86],"traditional":[87],"cell-aware":[89],"(CAT)":[91],"fault":[92],"models.":[93],"We":[94],"present":[95,131],"results,":[97,135],"including":[98,115],"reduction":[102],"defective":[104],"parts":[105],"per":[106],"million":[107],"(DPPM),":[108],"from":[109,148],"large":[111],"14-nm":[112],"FinFET":[113],"design,":[114],"correlation":[117],"system-level-test":[119],"(SLT)":[120],"fails.":[121],"For":[122],"second,":[124],"mature":[125],"160-nm":[126],"automotive":[127],"mixed-signal":[128],"sensor":[129],"we":[130,141],"high-volume":[132],"production":[133],"again":[136],"measured":[137],"DPPM,":[139],"provide":[142],"coverage":[144],"figures":[145],"moving":[146],"away":[147],"counting":[149],"detected":[150,154],"faults":[151],"calculating":[153],"TCA":[155,163],"reported":[158],"chip":[161],"level":[162],"coverage.":[164]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":7},{"year":2024,"cited_by_count":7},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1}],"updated_date":"2026-05-19T21:40:30.786675","created_date":"2025-10-10T00:00:00"}