{"id":"https://openalex.org/W2979746556","doi":"https://doi.org/10.1109/tcad.2019.2946243","title":"LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults","display_name":"LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults","publication_year":2019,"publication_date":"2019-10-08","ids":{"openalex":"https://openalex.org/W2979746556","doi":"https://doi.org/10.1109/tcad.2019.2946243","mag":"2979746556"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2019.2946243","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2019.2946243","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085987622","display_name":"Tianming Ni","orcid":"https://orcid.org/0000-0001-6272-8660"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianming Ni","raw_affiliation_strings":["Key Laboratory of Advanced Perception and Intelligent Control of High-End Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China"],"raw_orcid":"https://orcid.org/0000-0001-6272-8660","affiliations":[{"raw_affiliation_string":"Key Laboratory of Advanced Perception and Intelligent Control of High-End Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100389416","display_name":"Yao Yao","orcid":"https://orcid.org/0000-0001-9699-3569"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yao Yao","raw_affiliation_strings":["School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101887840","display_name":"Hao Chang","orcid":"https://orcid.org/0000-0002-6106-9613"},"institutions":[{"id":"https://openalex.org/I188935350","display_name":"Anhui University of Finance and Economics","ror":"https://ror.org/0152zzg30","country_code":"CN","type":"education","lineage":["https://openalex.org/I188935350"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hao Chang","raw_affiliation_strings":["Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, China"],"raw_orcid":"https://orcid.org/0000-0002-6106-9613","affiliations":[{"raw_affiliation_string":"Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu, China","institution_ids":["https://openalex.org/I188935350"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101483507","display_name":"Lin Lu","orcid":"https://orcid.org/0000-0003-2289-4984"},"institutions":[{"id":"https://openalex.org/I70908550","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284","country_code":"CN","type":"education","lineage":["https://openalex.org/I70908550"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lin Lu","raw_affiliation_strings":["Key Laboratory of Advanced Perception and Intelligent Control of High-End Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of Advanced Perception and Intelligent Control of High-End Equipment, Ministry of Education, College of Electrical Engineering, Anhui Polytechnic University, Wuhu, China","institution_ids":["https://openalex.org/I70908550"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100736309","display_name":"Huaguo Liang","orcid":"https://orcid.org/0000-0002-0307-7236"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huaguo Liang","raw_affiliation_strings":["School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0002-0307-7236","affiliations":[{"raw_affiliation_string":"School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072439444","display_name":"Aibin Yan","orcid":"https://orcid.org/0000-0003-0024-987X"},"institutions":[{"id":"https://openalex.org/I143868143","display_name":"Anhui University","ror":"https://ror.org/05th6yx34","country_code":"CN","type":"education","lineage":["https://openalex.org/I143868143"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Aibin Yan","raw_affiliation_strings":["School of Computer Science and Technology, Anhui University, Hefei, China"],"raw_orcid":"https://orcid.org/0000-0003-0024-987X","affiliations":[{"raw_affiliation_string":"School of Computer Science and Technology, Anhui University, Hefei, China","institution_ids":["https://openalex.org/I143868143"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073810494","display_name":"Zhengfeng Huang","orcid":"https://orcid.org/0000-0001-8695-4478"},"institutions":[{"id":"https://openalex.org/I16365422","display_name":"Hefei University of Technology","ror":"https://ror.org/02czkny70","country_code":"CN","type":"education","lineage":["https://openalex.org/I16365422"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhengfeng Huang","raw_affiliation_strings":["School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Applied Physics, Hefei University of Technology, Hefei, China","institution_ids":["https://openalex.org/I16365422"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5084697545","display_name":"Xiaoqing Wen","orcid":"https://orcid.org/0000-0001-8305-604X"},"institutions":[{"id":"https://openalex.org/I207014233","display_name":"Kyushu Institute of Technology","ror":"https://ror.org/02278tr80","country_code":"JP","type":"education","lineage":["https://openalex.org/I207014233"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Xiaoqing Wen","raw_affiliation_strings":["Department of Creative Informatics, Kyushu Institute of Technology, Fukuoka, Japan","Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan"],"raw_orcid":"https://orcid.org/0000-0001-8305-604X","affiliations":[{"raw_affiliation_string":"Department of Creative Informatics, Kyushu Institute of Technology, Fukuoka, Japan","institution_ids":["https://openalex.org/I207014233"]},{"raw_affiliation_string":"Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan","institution_ids":["https://openalex.org/I207014233"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":5.8379,"has_fulltext":false,"cited_by_count":69,"citation_normalized_percentile":{"value":0.96844555,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":"39","issue":"10","first_page":"2938","last_page":"2951"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9922999739646912,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9824000000953674,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/router","display_name":"Router","score":0.7750768661499023},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.5891358852386475},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.5246589183807373},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4967852234840393},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.45550796389579773},{"id":"https://openalex.org/keywords/failure-rate","display_name":"Failure rate","score":0.4502996802330017},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4391981065273285},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41079550981521606},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37493351101875305},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3440191149711609},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3295454978942871},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.24987870454788208},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.20057204365730286},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.1510922610759735},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.06140419840812683}],"concepts":[{"id":"https://openalex.org/C2775896111","wikidata":"https://www.wikidata.org/wiki/Q642560","display_name":"Router","level":2,"score":0.7750768661499023},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.5891358852386475},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.5246589183807373},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4967852234840393},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.45550796389579773},{"id":"https://openalex.org/C163164238","wikidata":"https://www.wikidata.org/wiki/Q2737027","display_name":"Failure rate","level":2,"score":0.4502996802330017},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4391981065273285},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41079550981521606},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37493351101875305},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3440191149711609},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3295454978942871},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.24987870454788208},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.20057204365730286},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.1510922610759735},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.06140419840812683}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2019.2946243","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2019.2946243","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3909525237","display_name":null,"funder_award_id":"61974001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G4507329490","display_name":null,"funder_award_id":"61704001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6260214469","display_name":null,"funder_award_id":"61874156","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G6403611338","display_name":null,"funder_award_id":"2018YQQ007","funder_id":"https://openalex.org/F4320328637","funder_display_name":"Anhui Polytechnic University"},{"id":"https://openalex.org/G6637131806","display_name":null,"funder_award_id":"61674048","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G744300498","display_name":"\u96c6\u6210\u7535\u8def\u8fd1\u4f3c\u8ba1\u7b97\u57fa\u7840\u7406\u8bba\u4e0e\u8bbe\u8ba1\u65b9\u6cd5","funder_award_id":"61834006","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8259609370","display_name":null,"funder_award_id":"1808085QF196","funder_id":"https://openalex.org/F4320334897","funder_display_name":"Natural Science Foundation of Anhui Province"},{"id":"https://openalex.org/G8556797422","display_name":"Shift-Power-Safe Scan Test Methodology for High-Quality Low-Power LSI Circuits","funder_award_id":"17H01716","funder_id":"https://openalex.org/F4320334764","funder_display_name":"Japan Society for the Promotion of Science"},{"id":"https://openalex.org/G875980750","display_name":null,"funder_award_id":"61904001","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G98675533","display_name":null,"funder_award_id":"1908085QF272","funder_id":"https://openalex.org/F4320334897","funder_display_name":"Natural Science Foundation of Anhui Province"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320328637","display_name":"Anhui Polytechnic University","ror":"https://ror.org/041sj0284"},{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"},{"id":"https://openalex.org/F4320334897","display_name":"Natural Science Foundation of Anhui Province","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W1535622131","https://openalex.org/W1965451131","https://openalex.org/W1965459844","https://openalex.org/W2010009884","https://openalex.org/W2019989040","https://openalex.org/W2029390138","https://openalex.org/W2050816113","https://openalex.org/W2062899780","https://openalex.org/W2064712157","https://openalex.org/W2097634964","https://openalex.org/W2099463627","https://openalex.org/W2106780604","https://openalex.org/W2107304970","https://openalex.org/W2108521064","https://openalex.org/W2138951112","https://openalex.org/W2146843106","https://openalex.org/W2151755625","https://openalex.org/W2158323053","https://openalex.org/W2318606705","https://openalex.org/W2397543037","https://openalex.org/W2603758940","https://openalex.org/W2773038018","https://openalex.org/W2794806694","https://openalex.org/W2900334641","https://openalex.org/W2920892930","https://openalex.org/W3143398174","https://openalex.org/W3144072891","https://openalex.org/W4253117434","https://openalex.org/W4255435342","https://openalex.org/W6632127416","https://openalex.org/W6676171840"],"related_works":["https://openalex.org/W2122026593","https://openalex.org/W1588358165","https://openalex.org/W2582203024","https://openalex.org/W4237683758","https://openalex.org/W2370711413","https://openalex.org/W2052038519","https://openalex.org/W2375932043","https://openalex.org/W2841075164","https://openalex.org/W1980506749","https://openalex.org/W1843313465"],"abstract_inverted_index":{"Due":[0],"to":[1,58,113,124],"the":[2,6,10,16,24,39,46,49,54,64,72,88,94,115,133,165],"winding":[3],"level":[4],"of":[5,13,18,41,66,160,176],"thinned":[7],"wafers":[8],"and":[9,26,79,93,117,144,168,173,184],"surface":[11],"roughness":[12],"silicon":[14],"dies,":[15],"quality":[17],"through-silicon":[19],"vias":[20],"(TSVs)":[21],"varies":[22],"during":[23,35],"fabrication":[25],"bonding":[27],"process.":[28],"If":[29],"one":[30],"TSV":[31,51,55,74,82],"exhibits":[32],"a":[33,109,137,157,169],"defect":[34],"its":[36],"manufacturing":[37],"process,":[38],"probability":[40],"multiple":[42],"defects":[43,56],"occurring":[44],"in":[45],"TSVs":[47],"neighboring":[48],"faulty":[50],"increases,":[52],"i.e.,":[53],"tend":[57],"be":[59],"clustered,":[60],"which":[61],"significantly":[62],"reduces":[63],"yield":[65],"3-D":[67],"integrated":[68],"circuit.":[69],"To":[70],"resolve":[71],"clustered":[73,151],"faults,":[75],"router-based,":[76,182],"ring-based,":[77,181],"group-based,":[78,183],"cellular-based":[80,185],"redundant":[81],"(RTSV)":[83],"architectures":[84],"were":[85],"proposed.":[86],"However,":[87],"repair":[89,139,147],"rate":[90,140,148],"is":[91,102],"low":[92],"hardware":[95,161],"overhead":[96,101,162],"as":[97,99,121,123],"well":[98,122],"delay":[100,118,178],"high.":[103],"In":[104],"this":[105],"article,":[106],"we":[107],"propose":[108],"honeycomb-based":[110],"RTSV":[111],"architecture":[112,135],"utilize":[114],"area":[116],"more":[119],"efficiently":[120],"maintain":[125],"high":[126],"yield.":[127],"The":[128,153],"simulation":[129],"results":[130],"show":[131],"that":[132],"proposed":[134,154],"has":[136],"99.84%":[138],"for":[141,149],"uniform":[142],"faults":[143],"an":[145],"81.42%":[146],"highly":[150],"faults.":[152],"design":[155,167],"achieves":[156],"51.66%":[158],"reduction":[159,175],"compared":[163,179],"with":[164,180],"router-based":[166],"20.69%,":[170],"46.93%,":[171],"34.17%,":[172],"11.15%":[174],"total":[177],"methods,":[186],"respectively.":[187]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":11},{"year":2021,"cited_by_count":32},{"year":2020,"cited_by_count":6},{"year":2019,"cited_by_count":1}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}
