{"id":"https://openalex.org/W2338886077","doi":"https://doi.org/10.1109/tcad.2015.2488494","title":"An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits","display_name":"An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits","publication_year":2015,"publication_date":"2015-10-26","ids":{"openalex":"https://openalex.org/W2338886077","doi":"https://doi.org/10.1109/tcad.2015.2488494","mag":"2338886077"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2015.2488494","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2015.2488494","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034738563","display_name":"Qinggao Mei","orcid":null},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Qinggao Mei","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I889458895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087551675","display_name":"Wim Schoenmaker","orcid":"https://orcid.org/0000-0001-5165-8134"},"institutions":[{"id":"https://openalex.org/I4210140261","display_name":"Magwel (Belgium)","ror":"https://ror.org/03hg1yf12","country_code":"BE","type":"company","lineage":["https://openalex.org/I4210140261"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Wim Schoenmaker","raw_affiliation_strings":["Magwel NV, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Magwel NV, Leuven, Belgium","institution_ids":["https://openalex.org/I4210140261"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110262864","display_name":"Shih-Hung Weng","orcid":null},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shih-Hung Weng","raw_affiliation_strings":["Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100613970","display_name":"Hao Zhuang","orcid":"https://orcid.org/0000-0002-6233-7587"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hao Zhuang","raw_affiliation_strings":["Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039615312","display_name":"Chung\u2010Kuan Cheng","orcid":"https://orcid.org/0000-0002-9865-8390"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chung-Kuan Cheng","raw_affiliation_strings":["Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, University of California at San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5045656461","display_name":"Quan Chen","orcid":"https://orcid.org/0000-0001-5570-2462"},"institutions":[{"id":"https://openalex.org/I889458895","display_name":"University of Hong Kong","ror":"https://ror.org/02zhqgq86","country_code":"HK","type":"education","lineage":["https://openalex.org/I889458895"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Quan Chen","raw_affiliation_strings":["Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong","institution_ids":["https://openalex.org/I889458895"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.9435,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.87934957,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"35","issue":"5","first_page":"832","last_page":"843"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.7445504069328308},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.6480468511581421},{"id":"https://openalex.org/keywords/solver","display_name":"Solver","score":0.6396912336349487},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5998551249504089},{"id":"https://openalex.org/keywords/integrator","display_name":"Integrator","score":0.5599554181098938},{"id":"https://openalex.org/keywords/nonlinear-system","display_name":"Nonlinear system","score":0.5189428329467773},{"id":"https://openalex.org/keywords/electronic-circuit-simulation","display_name":"Electronic circuit simulation","score":0.4979884624481201},{"id":"https://openalex.org/keywords/parasitic-capacitance","display_name":"Parasitic capacitance","score":0.484722375869751},{"id":"https://openalex.org/keywords/power-electronics","display_name":"Power electronics","score":0.47232645750045776},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.4623023569583893},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4602144956588745},{"id":"https://openalex.org/keywords/thermal-mass","display_name":"Thermal mass","score":0.4280802309513092},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.42551150918006897},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.388581782579422},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.3790299594402313},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27899134159088135},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.26692160964012146},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.15690067410469055}],"concepts":[{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.7445504069328308},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.6480468511581421},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.6396912336349487},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5998551249504089},{"id":"https://openalex.org/C79518650","wikidata":"https://www.wikidata.org/wiki/Q2081431","display_name":"Integrator","level":3,"score":0.5599554181098938},{"id":"https://openalex.org/C158622935","wikidata":"https://www.wikidata.org/wiki/Q660848","display_name":"Nonlinear system","level":2,"score":0.5189428329467773},{"id":"https://openalex.org/C46205389","wikidata":"https://www.wikidata.org/wiki/Q1270401","display_name":"Electronic circuit simulation","level":3,"score":0.4979884624481201},{"id":"https://openalex.org/C154318817","wikidata":"https://www.wikidata.org/wiki/Q2157249","display_name":"Parasitic capacitance","level":4,"score":0.484722375869751},{"id":"https://openalex.org/C178911571","wikidata":"https://www.wikidata.org/wiki/Q593143","display_name":"Power electronics","level":3,"score":0.47232645750045776},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4623023569583893},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4602144956588745},{"id":"https://openalex.org/C128014804","wikidata":"https://www.wikidata.org/wiki/Q3150682","display_name":"Thermal mass","level":3,"score":0.4280802309513092},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.42551150918006897},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.388581782579422},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.3790299594402313},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27899134159088135},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.26692160964012146},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.15690067410469055},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/tcad.2015.2488494","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2015.2488494","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},{"id":"pmh:oai:hub.hku.hk:10722/216997","is_oa":false,"landing_page_url":"http://hdl.handle.net/10722/216997","pdf_url":null,"source":{"id":"https://openalex.org/S4377196271","display_name":"The HKU Scholars Hub (University of Hong Kong)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I889458895","host_organization_name":"University of Hong Kong","host_organization_lineage":["https://openalex.org/I889458895"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G886697108","display_name":null,"funder_award_id":"HKU710913E","funder_id":"https://openalex.org/F4320321592","funder_display_name":"Research Grants Council, University Grants Committee"}],"funders":[{"id":"https://openalex.org/F4320321019","display_name":"University Grants Committee","ror":"https://ror.org/00djwmt25"},{"id":"https://openalex.org/F4320321592","display_name":"Research Grants Council, University Grants Committee","ror":"https://ror.org/00djwmt25"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W425747987","https://openalex.org/W1988017223","https://openalex.org/W2001015971","https://openalex.org/W2016381827","https://openalex.org/W2016440587","https://openalex.org/W2026661414","https://openalex.org/W2028212620","https://openalex.org/W2039167131","https://openalex.org/W2049165066","https://openalex.org/W2055891331","https://openalex.org/W2067136705","https://openalex.org/W2086029911","https://openalex.org/W2092956681","https://openalex.org/W2106565812","https://openalex.org/W2139170159","https://openalex.org/W2150848828","https://openalex.org/W2159344399","https://openalex.org/W2963747658","https://openalex.org/W6671773055"],"related_works":["https://openalex.org/W2336366888","https://openalex.org/W1548819263","https://openalex.org/W2373864209","https://openalex.org/W2362290425","https://openalex.org/W2680358491","https://openalex.org/W3014491917","https://openalex.org/W2362768421","https://openalex.org/W2123299345","https://openalex.org/W2414741643","https://openalex.org/W2381679256"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,97],"new":[4],"transient":[5,120],"electro-thermal":[6],"simulation":[7,148],"method":[8,103],"for":[9,94],"fast":[10],"3-D":[11,31],"chip-level":[12],"analysis":[13],"of":[14,81],"power":[15,82],"electronics":[16],"with":[17,30,47,84,128],"field":[18,32],"solver":[19,33,121],"accuracy.":[20],"The":[21,118],"metallization":[22],"stack":[23],"and":[24,28,38,41,66,78,89,95,115,145],"substrate":[25],"are":[26,45,59,91],"meshed":[27],"solved":[29],"using":[34],"nonlinear":[35,85,99],"temperature-dependent":[36],"electrical":[37,114,124,144],"thermal":[39,116,147],"parameters,":[40],"the":[42,63,67,71,108,123,138,143,146],"active":[43],"transistors":[44],"modeled":[46],"table":[48],"models":[49],"to":[50,61,106,126],"avoid":[51],"time-consuming":[52],"technology":[53],"computer-aided":[54],"design":[55],"simulation.":[56],"Two":[57],"contributions":[58],"made":[60],"enhance":[62],"physical":[64],"relevance":[65],"computational":[68],"performance:":[69],"1)":[70],"capacitive":[72],"effects,":[73],"including":[74],"interconnect":[75],"parasitic":[76],"capacitance":[77,80],"gate":[79],"devices":[83],"dependence":[86],"on":[87],"bias":[88],"temperature,":[90],"explicitly":[92],"accounted":[93],"2)":[96],"specialized":[98],"exponential":[100],"integrator":[101],"(EI)":[102],"is":[104,149],"developed":[105],"address":[107],"considerably":[109],"different":[110],"time":[111,131,139],"scales":[112],"between":[113,142],"sectors.":[117],"EI-based":[119],"allows":[122],"system":[125],"step":[127,140],"much":[129],"larger":[130],"steps":[132],"than":[133],"in":[134],"conventional":[135],"methods,":[136],"thus":[137],"gap":[141],"largely":[150],"reduced.":[151]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":4}],"updated_date":"2026-07-09T07:52:08.696243","created_date":"2025-10-10T00:00:00"}