{"id":"https://openalex.org/W2063609613","doi":"https://doi.org/10.1109/tcad.2014.2359578","title":"Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling","display_name":"Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling","publication_year":2014,"publication_date":"2014-11-26","ids":{"openalex":"https://openalex.org/W2063609613","doi":"https://doi.org/10.1109/tcad.2014.2359578","mag":"2063609613"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2014.2359578","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2014.2359578","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070766006","display_name":"Yarui Peng","orcid":"https://orcid.org/0000-0002-8550-2063"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yarui Peng","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032455044","display_name":"Taigon Song","orcid":"https://orcid.org/0000-0001-5243-4132"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Taigon Song","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052446669","display_name":"Dusan Petranovic","orcid":null},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dusan Petranovic","raw_affiliation_strings":["Mentor Graphics Corporation, Fremont, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, CA, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052950521","display_name":"Sung Kyu Lim","orcid":"https://orcid.org/0000-0002-2267-5282"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sung Kyu Lim","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"[School of Electrical & Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA]","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.2623,"has_fulltext":false,"cited_by_count":39,"citation_normalized_percentile":{"value":0.88927671,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":"33","issue":"12","first_page":"1900","last_page":"1913"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11853","display_name":"Semiconductor materials and interfaces","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7718533873558044},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.617617130279541},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5388023853302002},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.506780207157135},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.49169737100601196},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.464969664812088},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.464609295129776},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.42736589908599854},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.3504960536956787},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33016785979270935},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2750359773635864},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27162063121795654},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2544623017311096}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7718533873558044},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.617617130279541},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5388023853302002},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.506780207157135},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.49169737100601196},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.464969664812088},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.464609295129776},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.42736589908599854},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.3504960536956787},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33016785979270935},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2750359773635864},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27162063121795654},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2544623017311096},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2014.2359578","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2014.2359578","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G6259110876","display_name":"SHF: Small: 3D Integration of Sub-Threshold Multi-core Co-processor for Ultra Lower Power Computing","funder_award_id":"0917000","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"},{"id":"https://openalex.org/G7230818325","display_name":null,"funder_award_id":"ICSS-1836.075","funder_id":"https://openalex.org/F4320306087","funder_display_name":"Semiconductor Research Corporation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1575111222","https://openalex.org/W1974392394","https://openalex.org/W1977655281","https://openalex.org/W1982098977","https://openalex.org/W2003872487","https://openalex.org/W2006424711","https://openalex.org/W2015122410","https://openalex.org/W2043843580","https://openalex.org/W2045511903","https://openalex.org/W2059612698","https://openalex.org/W2066064691","https://openalex.org/W2074141932","https://openalex.org/W2090292040","https://openalex.org/W2093602647","https://openalex.org/W2106997452","https://openalex.org/W2121007654","https://openalex.org/W2131916012","https://openalex.org/W2133279383","https://openalex.org/W2144693711","https://openalex.org/W2155707315","https://openalex.org/W2160837841","https://openalex.org/W2161180338","https://openalex.org/W2167539582","https://openalex.org/W2171990275","https://openalex.org/W2543796540","https://openalex.org/W4230375614","https://openalex.org/W4252118812"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2046139226","https://openalex.org/W2513353273","https://openalex.org/W2549021975","https://openalex.org/W2333804548","https://openalex.org/W1968957853","https://openalex.org/W2310189477","https://openalex.org/W3093450488"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,101],"silicon":[4,12],"effect-aware":[5],"multiTSV":[6],"model.":[7],"Through-silicon-via":[8],"(TSV)":[9],"depletion":[10],"region,":[11],"substrate":[13],"discharging":[14,103],"path":[15],"and":[16,25,34,44,53],"electrical":[17],"field":[18,32],"distribution":[19],"around":[20,93],"TSV":[21,78,96],"neighbor":[22],"are":[23,84,140],"modeled":[24],"studied":[26],"in":[27,39,142],"full-chip":[28,35],"design.":[29],"Verification":[30],"with":[31,127,145],"solver":[33],"TSV-to-TSV":[36,70],"coupling":[37,75],"analysis":[38,134],"both":[40],"the":[41,45,94],"worst":[42],"case":[43,47],"average":[46],"show":[48,136],"this":[49,74],"model":[50],"is":[51,56,88,108],"accurate":[52],"efficient.":[54],"It":[55],"found":[57],"that":[58,137],"3-D":[59,124],"nets":[60],"receive":[61],"more":[62],"noise":[63,76,116,143],"than":[64],"their":[65],"2-D":[66],"counterparts":[67],"due":[68],"to":[69,89,99,109,114],"coupling.":[71],"To":[72],"alleviate":[73],"on":[77,123],"nets,":[79],"two":[80],"new":[81],"optimization":[82],"methods":[83],"investigated.":[85],"One":[86],"way":[87],"utilize":[90],"guard":[91],"rings":[92],"victim":[95],"so":[97],"as":[98],"form":[100],"stronger":[102],"path,":[104],"an":[105],"alternative":[106],"approach":[107],"adopt":[110],"differential":[111],"signal":[112],"transmission":[113],"improve":[115],"immunity.":[117],"These":[118],"techniques":[119],"have":[120],"been":[121],"implemented":[122],"IC":[125],"designs":[126],"TSVs":[128],"placed":[129],"regularly":[130],"or":[131],"irregularly.":[132],"Full-chip":[133],"results":[135],"our":[138],"approaches":[139],"effective":[141],"reduction":[144],"small":[146],"area":[147],"overhead.":[148]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":8},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":4}],"updated_date":"2026-08-06T08:24:18.245995","created_date":"2025-10-10T00:00:00"}