{"id":"https://openalex.org/W1965459844","doi":"https://doi.org/10.1109/tcad.2013.2252056","title":"Programmable Leakage Test and Binning for TSVs With Self-Timed Timing Control","display_name":"Programmable Leakage Test and Binning for TSVs With Self-Timed Timing Control","publication_year":2013,"publication_date":"2013-07-15","ids":{"openalex":"https://openalex.org/W1965459844","doi":"https://doi.org/10.1109/tcad.2013.2252056","mag":"1965459844"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2013.2252056","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2013.2252056","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085636078","display_name":"Shi\u2010Yu Huang","orcid":"https://orcid.org/0000-0002-3721-987X"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shi-Yu Huang","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan","[Electr. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"[Electr. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan]","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110832349","display_name":"Yu-Hsiang Lin","orcid":"https://orcid.org/0000-0003-0581-257X"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Hsiang Lin","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan","[Electr. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"[Electr. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan]","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009579444","display_name":"Li-Ren Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Li-Ren Huang","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan","[Electr. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"[Electr. Eng. Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan]","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064587514","display_name":"Kun-Han Tsai","orcid":"https://orcid.org/0000-0001-8919-8663"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kun-Han Tsai","raw_affiliation_strings":["Mentor Graphics Corporation, Wilsonville, OR, USA","Mentor Graphics, Wilsonville, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020407423","display_name":"Wu-Tung Cheng","orcid":"https://orcid.org/0000-0001-6327-2394"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wu-Tung Cheng","raw_affiliation_strings":["Mentor Graphics Corporation, Wilsonville, OR, USA","Mentor Graphics, Wilsonville, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics, Wilsonville, OR, USA","institution_ids":["https://openalex.org/I4210156212"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.1603,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.88035984,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"32","issue":"8","first_page":"1265","last_page":"1273"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/leakage","display_name":"Leakage (economics)","score":0.7634021043777466},{"id":"https://openalex.org/keywords/skew","display_name":"Skew","score":0.6876869201660156},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.596781313419342},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5302424430847168},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.47766193747520447},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.4503360092639923},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25501179695129395},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10682955384254456}],"concepts":[{"id":"https://openalex.org/C2777042071","wikidata":"https://www.wikidata.org/wiki/Q6509304","display_name":"Leakage (economics)","level":2,"score":0.7634021043777466},{"id":"https://openalex.org/C43711488","wikidata":"https://www.wikidata.org/wiki/Q7534783","display_name":"Skew","level":2,"score":0.6876869201660156},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.596781313419342},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5302424430847168},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47766193747520447},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.4503360092639923},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25501179695129395},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10682955384254456},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2013.2252056","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2013.2252056","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1985664729","https://openalex.org/W1987638749","https://openalex.org/W2013679798","https://openalex.org/W2023976101","https://openalex.org/W2055841712","https://openalex.org/W2095790208","https://openalex.org/W2102304175","https://openalex.org/W2107304970","https://openalex.org/W2116426145","https://openalex.org/W2123145598","https://openalex.org/W2132155220","https://openalex.org/W2143502515","https://openalex.org/W2150113875","https://openalex.org/W2158323053","https://openalex.org/W2160994299","https://openalex.org/W3148506408","https://openalex.org/W4230104114","https://openalex.org/W6656539271","https://openalex.org/W6676317001"],"related_works":["https://openalex.org/W4290802965","https://openalex.org/W97789383","https://openalex.org/W2727156679","https://openalex.org/W3087516072","https://openalex.org/W4289406402","https://openalex.org/W2067997904","https://openalex.org/W2364071303","https://openalex.org/W1483053255","https://openalex.org/W2896097814","https://openalex.org/W20221657"],"abstract_inverted_index":{"Leakage":[0],"tests":[1],"have":[2],"been":[3],"a":[4,11,54,58,69,114],"challenge":[5],"for":[6,53,85],"through-silicon":[7],"vias":[8],"(TSVs)":[9],"in":[10,20,138],"3-D":[12],"IC.":[13],"Most":[14],"existing":[15],"methods":[16],"are":[17],"still":[18],"inadequate":[19],"terms":[21],"of":[22,25,36,72,101],"the":[23,34,37,121,132,148],"range":[24,71],"testable":[26],"leakage":[27,39,73,91],"currents.":[28],"In":[29],"this":[30,95],"paper,":[31],"we":[32,48,67,97],"borrow":[33],"wisdom":[35],"IO-pin":[38],"test":[40,74,87],"while":[41],"enhancing":[42],"it":[43,50,143],"with":[44,113],"two":[45,99],"features.":[46],"First,":[47],"make":[49],"more":[51],"suitable":[52],"TSV,":[55],"which":[56],"has":[57],"much":[59],"smaller":[60],"capacitance":[61],"than":[62],"an":[63],"IO":[64],"pin.":[65],"Second,":[66],"support":[68],"wide":[70],"(e.g.,":[75],"from":[76],"0.125":[77],"\u03bcA":[78],"to":[79,119,126,145],"16":[80],"\u03bcA),":[81],"and":[82,90,109],"thereby":[83],"allowing":[84],"flexible":[86],"threshold":[88],"setting":[89],"characterization.":[92],"To":[93],"achieve":[94],"goal,":[96],"present":[98],"sets":[100],"techniques-1)":[102],"wait-time":[103,111],"generation":[104],"by":[105],"programmable":[106],"delay":[107],"line,":[108],"2)":[110],"propagation":[112],"self-timed":[115],"timing":[116,122],"control":[117],"scheme":[118,134],"overcome":[120],"skew":[123],"problem":[124],"due":[125],"signal":[127],"routing.":[128],"We":[129],"demonstrate":[130],"that":[131],"entire":[133],"can":[135],"be":[136],"done":[137],"only":[139],"logic":[140],"gates,":[141],"making":[142],"easy":[144],"integrate":[146],"into":[147],"common":[149],"design":[150],"flow.":[151]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":5},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}