{"id":"https://openalex.org/W2176491826","doi":"https://doi.org/10.1109/tcad.2012.2224347","title":"Integrated Fluidic-Chip Co-Design Methodology for Digital Microfluidic Biochips","display_name":"Integrated Fluidic-Chip Co-Design Methodology for Digital Microfluidic Biochips","publication_year":2013,"publication_date":"2013-01-21","ids":{"openalex":"https://openalex.org/W2176491826","doi":"https://doi.org/10.1109/tcad.2012.2224347","mag":"2176491826"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2012.2224347","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2012.2224347","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113636011","display_name":"Jia-Wen Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Jia-Wen Chang","raw_affiliation_strings":["National Cheng-Kung University, Tainan, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Cheng-Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013872664","display_name":"Sheng-Han Yeh","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Sheng-Han Yeh","raw_affiliation_strings":["National Cheng-Kung University, Tainan, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Cheng-Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088685794","display_name":"Tsung\u2010Wei Huang","orcid":"https://orcid.org/0000-0001-9768-3378"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tsung-Wei Huang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Texas, Austin, TX, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Texas, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5062800747","display_name":"Tsung-Yi Ho","orcid":"https://orcid.org/0000-0001-7348-5625"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tsung-Yi Ho","raw_affiliation_strings":["National Cheng-Kung University, Tainan, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Cheng-Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5113636011"],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":null,"apc_paid":null,"fwci":1.6552,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.86166651,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"32","issue":"2","first_page":"216","last_page":"227"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9879999756813049,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9861999750137329,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/biochip","display_name":"Biochip","score":0.7992454767227173},{"id":"https://openalex.org/keywords/fluidics","display_name":"Fluidics","score":0.7236953973770142},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.6169155240058899},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5851511359214783},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.5413621664047241},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5404253005981445},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.5196800827980042},{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.49460455775260925},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.457193523645401},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.416239470243454},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33806711435317993},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.13636437058448792},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.09355217218399048}],"concepts":[{"id":"https://openalex.org/C87892846","wikidata":"https://www.wikidata.org/wiki/Q864256","display_name":"Biochip","level":2,"score":0.7992454767227173},{"id":"https://openalex.org/C132651336","wikidata":"https://www.wikidata.org/wiki/Q185571","display_name":"Fluidics","level":2,"score":0.7236953973770142},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.6169155240058899},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5851511359214783},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.5413621664047241},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5404253005981445},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.5196800827980042},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.49460455775260925},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.457193523645401},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.416239470243454},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33806711435317993},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13636437058448792},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.09355217218399048},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2012.2224347","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2012.2224347","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W584557018","https://openalex.org/W1603428277","https://openalex.org/W1902734869","https://openalex.org/W1909235131","https://openalex.org/W1925217107","https://openalex.org/W1973771164","https://openalex.org/W1997469988","https://openalex.org/W2013470780","https://openalex.org/W2022431046","https://openalex.org/W2090869660","https://openalex.org/W2108056720","https://openalex.org/W2113162124","https://openalex.org/W2115008041","https://openalex.org/W2119985798","https://openalex.org/W2124253086","https://openalex.org/W2130933259","https://openalex.org/W2131779785","https://openalex.org/W2134857074","https://openalex.org/W2142581655","https://openalex.org/W2145026225","https://openalex.org/W2148263702","https://openalex.org/W2151013793","https://openalex.org/W2166910382","https://openalex.org/W3151579412","https://openalex.org/W4249480953","https://openalex.org/W4253948146","https://openalex.org/W6636316424","https://openalex.org/W6676107280","https://openalex.org/W6684583538"],"related_works":["https://openalex.org/W2134857074","https://openalex.org/W2617828916","https://openalex.org/W2945007116","https://openalex.org/W2012541439","https://openalex.org/W2055762461","https://openalex.org/W4253948146","https://openalex.org/W2066225194","https://openalex.org/W2157038085","https://openalex.org/W2166639081","https://openalex.org/W2176491826"],"abstract_inverted_index":{"Recently,":[0],"digital":[1],"microfluidic":[2],"biochips":[3],"(DMFBs)":[4],"have":[5,40],"revolutionized":[6],"many":[7,18],"biochemical":[8],"laboratory":[9],"procedures":[10],"and":[11,26,68,98,117,124,165,173,181],"received":[12],"much":[13],"attention":[14],"due":[15],"to":[16,43,64,127,143,168],"their":[17],"advantages,":[19],"such":[20],"as":[21],"high":[22],"throughput,":[23],"automatic":[24],"control,":[25],"low":[27],"cost.":[28],"To":[29],"meet":[30],"the":[31,86,106,115,120,136,146,178],"challenges":[32],"of":[33,57,88,119,183,190],"increasing":[34],"design":[35,55,63,75,148,171],"complexity,":[36],"computer-aided-design":[37],"(CAD)":[38],"tools":[39,49],"been":[41],"used":[42],"build":[44],"DMFBs":[45,142],"efficiently.":[46],"Current":[47],"CAD":[48],"generally":[50],"conduct":[51],"a":[52,82,93,153,188],"two-stage":[53],"based":[54],"flow":[56],"fluidic-level":[58],"synthesis":[59],"followed":[60],"by":[61],"chip-level":[62],"optimize":[65],"fluidic":[66],"behaviors":[67],"chip":[69,159],"architecture":[70],"separately.":[71],"Nevertheless,":[72],"existing":[73],"fluidic-chip":[74,138,147],"gap":[76],"will":[77],"become":[78],"even":[79],"wider":[80],"with":[81],"rapid":[83],"escalation":[84],"in":[85,105],"number":[87],"assay":[89,101,192],"operations":[90],"incorporated":[91],"into":[92],"single":[94],"DMFB.":[95],"As":[96],"more":[97,99],"large-scale":[100],"protocols":[102],"are":[103],"delivered":[104],"current":[107],"emerging":[108],"marketplace,":[109],"this":[110,132],"problem":[111],"may":[112],"potentially":[113],"restrict":[114],"effectiveness":[116],"feasibility":[118],"entire":[121],"DMFB":[122],"realization":[123],"thus":[125],"needs":[126],"be":[128],"solved":[129],"quickly.":[130],"In":[131],"paper,":[133],"we":[134],"propose":[135],"first":[137],"co-design":[139,185],"methodology":[140,186],"for":[141],"effectively":[144],"bridge":[145],"gap.":[149],"Our":[150],"work":[151],"provides":[152],"comprehensive":[154],"integration":[155],"throughout":[156],"fluidic-operation":[157],"scheduling,":[158],"layout":[160],"generation,":[161],"control":[162],"pin":[163],"assignment,":[164],"wiring":[166],"solution":[167],"achieve":[169],"higher":[170],"performance":[172],"feasibility.":[174],"Experimental":[175],"results":[176],"show":[177],"effectiveness,":[179],"robustness,":[180],"scalability":[182],"our":[184],"on":[187],"set":[189],"real-life":[191],"applications.":[193]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":4},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}