{"id":"https://openalex.org/W2023155196","doi":"https://doi.org/10.1109/tcad.2012.2201481","title":"On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment","display_name":"On X-Variable Filling and Flipping for Capture-Power Reduction in Linear Decompressor-Based Test Compression Environment","publication_year":2012,"publication_date":"2012-10-16","ids":{"openalex":"https://openalex.org/W2023155196","doi":"https://doi.org/10.1109/tcad.2012.2201481","mag":"2023155196"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2012.2201481","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2012.2201481","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100441094","display_name":"Xiao Liu","orcid":"https://orcid.org/0000-0002-9226-4569"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Xiao Liu","raw_affiliation_strings":["Department of Computer Science and Engineering, Chinese University of Hong Kong, Sha Tin, Hong Kong, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Chinese University of Hong Kong, Sha Tin, Hong Kong, China","institution_ids":["https://openalex.org/I177725633"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088556682","display_name":"Qiang Xu","orcid":"https://orcid.org/0000-0001-6747-126X"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"HK","type":"education","lineage":["https://openalex.org/I177725633"]},{"id":"https://openalex.org/I4210145761","display_name":"Shenzhen Institutes of Advanced Technology","ror":"https://ror.org/04gh4er46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210145761"]}],"countries":["CN","HK"],"is_corresponding":false,"raw_author_name":"Qiang Xu","raw_affiliation_strings":["Department of Computer Science and Engineering, Chinese University of Hong Kong, Sha Tin, Hong Kong, China","Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Chinese University of Hong Kong, Sha Tin, Hong Kong, China","institution_ids":["https://openalex.org/I177725633"]},{"raw_affiliation_string":"Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China","institution_ids":["https://openalex.org/I4210145761"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.3433,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.8813636,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"31","issue":"11","first_page":"1743","last_page":"1753"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.8309645652770996},{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.7305360436439514},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.579200267791748},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5339969396591187},{"id":"https://openalex.org/keywords/exploit","display_name":"Exploit","score":0.533231794834137},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5255502462387085},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.4787677824497223},{"id":"https://openalex.org/keywords/test-data","display_name":"Test data","score":0.4736917018890381},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.4659233093261719},{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.4642430543899536},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.45662248134613037},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.44976386427879333},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.40250036120414734},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.3977906107902527},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.39399462938308716},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16735577583312988},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.13871455192565918},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.1271527111530304}],"concepts":[{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.8309645652770996},{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.7305360436439514},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.579200267791748},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5339969396591187},{"id":"https://openalex.org/C165696696","wikidata":"https://www.wikidata.org/wiki/Q11287","display_name":"Exploit","level":2,"score":0.533231794834137},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5255502462387085},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.4787677824497223},{"id":"https://openalex.org/C16910744","wikidata":"https://www.wikidata.org/wiki/Q7705759","display_name":"Test data","level":2,"score":0.4736917018890381},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.4659233093261719},{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.4642430543899536},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.45662248134613037},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.44976386427879333},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.40250036120414734},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.3977906107902527},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.39399462938308716},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16735577583312988},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.13871455192565918},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.1271527111530304},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2012.2201481","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2012.2201481","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5199999809265137,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":48,"referenced_works":["https://openalex.org/W1557977552","https://openalex.org/W1582825744","https://openalex.org/W1966348745","https://openalex.org/W1979305473","https://openalex.org/W1999775506","https://openalex.org/W2001352955","https://openalex.org/W2080510479","https://openalex.org/W2095779147","https://openalex.org/W2096852695","https://openalex.org/W2101818740","https://openalex.org/W2101900253","https://openalex.org/W2105028194","https://openalex.org/W2105913179","https://openalex.org/W2109043970","https://openalex.org/W2111569953","https://openalex.org/W2114165504","https://openalex.org/W2119691242","https://openalex.org/W2120246395","https://openalex.org/W2121466258","https://openalex.org/W2124082527","https://openalex.org/W2124638590","https://openalex.org/W2125014350","https://openalex.org/W2126872604","https://openalex.org/W2128921091","https://openalex.org/W2134702967","https://openalex.org/W2135077553","https://openalex.org/W2135627440","https://openalex.org/W2140283778","https://openalex.org/W2154471868","https://openalex.org/W2160621850","https://openalex.org/W2165516518","https://openalex.org/W2166163625","https://openalex.org/W2168419390","https://openalex.org/W2169451209","https://openalex.org/W2169854732","https://openalex.org/W4232226371","https://openalex.org/W4232755754","https://openalex.org/W4254056430","https://openalex.org/W6675519197","https://openalex.org/W6677086231","https://openalex.org/W6678171689","https://openalex.org/W6678356202","https://openalex.org/W6678766341","https://openalex.org/W6678897769","https://openalex.org/W6679849835","https://openalex.org/W6682699350","https://openalex.org/W6684123354","https://openalex.org/W6685002992"],"related_works":["https://openalex.org/W4285708951","https://openalex.org/W2147986372","https://openalex.org/W2786111245","https://openalex.org/W1979305473","https://openalex.org/W3009953521","https://openalex.org/W1606802855","https://openalex.org/W1895064253","https://openalex.org/W2035832568","https://openalex.org/W3121464923","https://openalex.org/W2025078381"],"abstract_inverted_index":{"Excessive":[0],"test":[1,6,22,46,73],"power":[2,69],"consumption":[3],"and":[4,21,52,82],"growing":[5],"data":[7,23],"volume":[8],"are":[9],"both":[10],"serious":[11],"concerns":[12],"for":[13],"the":[14,31,39,45,87],"semiconductor":[15],"industry.":[16],"Various":[17],"low-power":[18],"X-filling":[19],"techniques":[20,64,99],"compression":[24,74],"schemes":[25],"were":[26],"developed":[27],"accordingly":[28],"to":[29,48,65,80,86],"address":[30],"above":[32],"problems.":[33],"These":[34],"methods,":[35],"however,":[36],"often":[37],"exploit":[38],"very":[40],"same":[41],"\u201cdon't-care\u201d":[42],"bits":[43],"in":[44,70],"cubes":[47],"achieve":[49],"different":[50],"objectives":[51],"hence":[53],"may":[54],"contradict":[55],"each":[56],"other.":[57],"In":[58],"this":[59],"paper,":[60],"we":[61],"propose":[62],"novel":[63],"reduce":[66],"scan":[67],"capture":[68],"linear":[71,88],"decompressor-based":[72],"environment,":[75],"by":[76],"employing":[77],"algorithmic":[78],"solutions":[79],"fill":[81],"flip":[83],"X-variables":[84],"supplied":[85],"decompressor.":[89],"Experimental":[90],"results":[91],"on":[92],"benchmark":[93],"circuits":[94],"demonstrate":[95],"that":[96],"our":[97],"proposed":[98],"significantly":[100],"outperform":[101],"existing":[102],"solutions.":[103]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":5},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}