{"id":"https://openalex.org/W2143734108","doi":"https://doi.org/10.1109/tcad.2008.2003275","title":"Rapid Detailed Temperature Estimation for Highly Coupled IC Interconnect","display_name":"Rapid Detailed Temperature Estimation for Highly Coupled IC Interconnect","publication_year":2008,"publication_date":"2008-09-24","ids":{"openalex":"https://openalex.org/W2143734108","doi":"https://doi.org/10.1109/tcad.2008.2003275","mag":"2143734108"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2008.2003275","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2008.2003275","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083707893","display_name":"A. H. Labun","orcid":null},"institutions":[{"id":"https://openalex.org/I141945490","display_name":"University of British Columbia","ror":"https://ror.org/03rmrcq20","country_code":"CA","type":"education","lineage":["https://openalex.org/I141945490"]},{"id":"https://openalex.org/I4405260628","display_name":"University of British Columbia, Okanagan Campus","ror":"https://ror.org/04241wz75","country_code":"CA","type":"education","lineage":["https://openalex.org/I141945490","https://openalex.org/I4405260628"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"A. Labun","raw_affiliation_strings":["School of Engineering, University of British Columbia, Kelowna, BC, Canada","Sch. of Eng., Univ. of British Columbia Okanagan, Kelowna, BC#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Engineering, University of British Columbia, Kelowna, BC, Canada","institution_ids":["https://openalex.org/I141945490","https://openalex.org/I4405260628"]},{"raw_affiliation_string":"Sch. of Eng., Univ. of British Columbia Okanagan, Kelowna, BC#TAB#","institution_ids":["https://openalex.org/I141945490","https://openalex.org/I4405260628"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040979240","display_name":"K. Jagjitkumar","orcid":null},"institutions":[{"id":"https://openalex.org/I141945490","display_name":"University of British Columbia","ror":"https://ror.org/03rmrcq20","country_code":"CA","type":"education","lineage":["https://openalex.org/I141945490"]},{"id":"https://openalex.org/I4405260628","display_name":"University of British Columbia, Okanagan Campus","ror":"https://ror.org/04241wz75","country_code":"CA","type":"education","lineage":["https://openalex.org/I141945490","https://openalex.org/I4405260628"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"K. Jagjitkumar","raw_affiliation_strings":["School of Engineering, University of British Columbia, Kelowna, BC, Canada","Sch. of Eng., Univ. of British Columbia Okanagan, Kelowna, BC#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Engineering, University of British Columbia, Kelowna, BC, Canada","institution_ids":["https://openalex.org/I141945490","https://openalex.org/I4405260628"]},{"raw_affiliation_string":"Sch. of Eng., Univ. of British Columbia Okanagan, Kelowna, BC#TAB#","institution_ids":["https://openalex.org/I141945490","https://openalex.org/I4405260628"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3756,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.63441688,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":"27","issue":"10","first_page":"1840","last_page":"1851"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.8163870573043823},{"id":"https://openalex.org/keywords/joule-heating","display_name":"Joule heating","score":0.7739979028701782},{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.748651385307312},{"id":"https://openalex.org/keywords/heat-equation","display_name":"Heat equation","score":0.5752389430999756},{"id":"https://openalex.org/keywords/convergence","display_name":"Convergence (economics)","score":0.5561745166778564},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5554441809654236},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4806436598300934},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45805394649505615},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.45237764716148376},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.4495576024055481},{"id":"https://openalex.org/keywords/net","display_name":"Net (polyhedron)","score":0.4192759394645691},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.3576505780220032},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27337828278541565},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.25202953815460205},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.23424717783927917},{"id":"https://openalex.org/keywords/mathematical-analysis","display_name":"Mathematical analysis","score":0.21309363842010498},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.1733698844909668},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16497695446014404},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08806589245796204}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8163870573043823},{"id":"https://openalex.org/C117926987","wikidata":"https://www.wikidata.org/wiki/Q210009","display_name":"Joule heating","level":2,"score":0.7739979028701782},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.748651385307312},{"id":"https://openalex.org/C202787564","wikidata":"https://www.wikidata.org/wiki/Q6510488","display_name":"Heat equation","level":2,"score":0.5752389430999756},{"id":"https://openalex.org/C2777303404","wikidata":"https://www.wikidata.org/wiki/Q759757","display_name":"Convergence (economics)","level":2,"score":0.5561745166778564},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5554441809654236},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4806436598300934},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45805394649505615},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.45237764716148376},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.4495576024055481},{"id":"https://openalex.org/C14166107","wikidata":"https://www.wikidata.org/wiki/Q253829","display_name":"Net (polyhedron)","level":2,"score":0.4192759394645691},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.3576505780220032},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27337828278541565},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.25202953815460205},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.23424717783927917},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.21309363842010498},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.1733698844909668},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16497695446014404},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08806589245796204},{"id":"https://openalex.org/C50522688","wikidata":"https://www.wikidata.org/wiki/Q189833","display_name":"Economic growth","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2008.2003275","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2008.2003275","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5099999904632568}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1548443848","https://openalex.org/W1826768222","https://openalex.org/W1904660840","https://openalex.org/W1953858171","https://openalex.org/W1989695743","https://openalex.org/W1990333732","https://openalex.org/W1993631148","https://openalex.org/W2099960755","https://openalex.org/W2106778083","https://openalex.org/W2117656819","https://openalex.org/W2125629498","https://openalex.org/W2126924619","https://openalex.org/W2132816157","https://openalex.org/W2137163909","https://openalex.org/W2142917139","https://openalex.org/W2156327154","https://openalex.org/W2160936920","https://openalex.org/W2161784643","https://openalex.org/W2168138998","https://openalex.org/W2172246717","https://openalex.org/W2394961855","https://openalex.org/W2543134928","https://openalex.org/W2546163117","https://openalex.org/W4243380698","https://openalex.org/W4244658250","https://openalex.org/W4252509993","https://openalex.org/W6632833294","https://openalex.org/W6640984452","https://openalex.org/W6683090901","https://openalex.org/W6712018044"],"related_works":["https://openalex.org/W2519127495","https://openalex.org/W3094583181","https://openalex.org/W1679696056","https://openalex.org/W2065574865","https://openalex.org/W2122281731","https://openalex.org/W2134587448","https://openalex.org/W3100076864","https://openalex.org/W2045918764","https://openalex.org/W2028182849","https://openalex.org/W2039178962"],"abstract_inverted_index":{"Steady-state":[0],"temperature":[1,119,127,155,168,189],"due":[2],"to":[3,44,83,92,110,115,210],"Joule":[4,96],"self-heating":[5],"for":[6,199],"highly":[7],"coupled":[8],"integrated-circuit":[9],"interconnect":[10,17,36,113,174],"can":[11],"be":[12,42,135],"found":[13,136],"rapidly":[14],"on":[15,34,123,160],"individual":[16,173],"segments":[18,122],"during":[19],"electromigration":[20],"reliability":[21],"verification.":[22],"It":[23],"has":[24],"previously":[25],"been":[26],"shown":[27],"that":[28,166,179],"the":[29,46,50,56,63,76,85,94,116,121,129,154,161,164,167,196],"dc":[30],"electric":[31],"current":[32],"solution":[33,48,61,106,206],"each":[35,112,172],"segment":[37,114,175],"of":[38,49,62,78,120,132,153,163,190,195],"a":[39,145,200],"net":[40],"may":[41,134],"modified":[43],"form":[45],"analytical":[47],"1-D":[51],"time-independent":[52],"heat":[53,97,182],"equation":[54],"along":[55,184],"entire":[57,130],"net.":[58],"A":[59],"symbolic":[60,105],"network":[64],"equations":[65],"(requiring":[66],"O(P":[67],"<sup":[68],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[69],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">3</sup>":[70],")":[71],"operations,":[72],"where":[73],"P":[74],"is":[75,80,107,157,176,193,207],"number":[77],"nodes)":[79],"first":[81],"evaluated":[82,90],"solve":[84,93],"electrical":[86],"problem":[87,98],"and":[88,178,213],"then":[89],"again":[91],"resulting":[95],"(each":[99],"evaluation":[100],"requiring":[101],"O(P)":[102],"operations).":[103],"The":[104,126,151,187,204],"extended":[108],"here":[109],"couple":[111],"weighted":[117],"average":[118],"neighboring":[124],"nets.":[125],"over":[128],"set":[131],"nets":[133,192],"by":[137,171],"iterating":[138],"until":[139],"convergence,":[140],"which":[141],"does":[142],"not":[143],"require":[144],"significant":[146],"overall":[147],"increase":[148],"in":[149],"operations.":[150],"accuracy":[152],"trajectories":[156],"principally":[158],"dependent":[159],"validity":[162],"assumptions":[165],"background":[169],"seen":[170],"uniform":[177],"vias":[180],"conduct":[181],"only":[183],"their":[185],"lengths.":[186],"estimated":[188],"self-heated":[191],"110%":[194],"finite-element":[197],"result":[198],"realistic":[201],"layout":[202],"example.":[203],"net-based":[205],"well":[208],"suited":[209],"distributed":[211],"processing":[212],"identifying":[214],"problematic":[215],"layout.":[216]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}