{"id":"https://openalex.org/W2101631039","doi":"https://doi.org/10.1109/tcad.2006.882604","title":"Wafer Topography-Aware Optical Proximity Correction","display_name":"Wafer Topography-Aware Optical Proximity Correction","publication_year":2006,"publication_date":"2006-12-01","ids":{"openalex":"https://openalex.org/W2101631039","doi":"https://doi.org/10.1109/tcad.2006.882604","mag":"2101631039"},"language":"en","primary_location":{"id":"doi:10.1109/tcad.2006.882604","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2006.882604","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084229134","display_name":"Puneet Gupta","orcid":"https://orcid.org/0000-0002-6188-1134"},"institutions":[{"id":"https://openalex.org/I4210162461","display_name":"BlazeTech (United States)","ror":"https://ror.org/059y2we84","country_code":"US","type":"company","lineage":["https://openalex.org/I4210162461"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Puneet Gupta","raw_affiliation_strings":["Blaze DFM Inc., Sunnyvale, CA"],"affiliations":[{"raw_affiliation_string":"Blaze DFM Inc., Sunnyvale, CA","institution_ids":["https://openalex.org/I4210162461"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073558386","display_name":"Andrew B. Kahng","orcid":"https://orcid.org/0000-0002-4490-5018"},"institutions":[{"id":"https://openalex.org/I4210162461","display_name":"BlazeTech (United States)","ror":"https://ror.org/059y2we84","country_code":"US","type":"company","lineage":["https://openalex.org/I4210162461"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew B. Kahng","raw_affiliation_strings":["Blaze DFM, Inc., Sunnyvale, CA, USA","[Blaze DFM, Inc., Sunnyvale, CA, USA]"],"affiliations":[{"raw_affiliation_string":"Blaze DFM, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210162461"]},{"raw_affiliation_string":"[Blaze DFM, Inc., Sunnyvale, CA, USA]","institution_ids":["https://openalex.org/I4210162461"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011537016","display_name":"Chul\u2010Hong Park","orcid":"https://orcid.org/0000-0002-0476-8450"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chul-Hong Park","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA","Department of Electrical and Computer Engineering, University of California San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California San Diego, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025604916","display_name":"Kambiz Samadi","orcid":null},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kambiz Samadi","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA","Department of Electrical and Computer Engineering, University of California San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California San Diego, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100416688","display_name":"Xu Xu","orcid":"https://orcid.org/0000-0002-3934-9096"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xu Xu","raw_affiliation_strings":["Department of Computer Science and Engineering, University of California, San Diego, La Jolla, CA, USA","Dept. of Comput. Sci. & Eng., Univ. of California San Diego, La Jolla, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, University of California, San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"Dept. of Comput. Sci. & Eng., Univ. of California San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5084229134"],"corresponding_institution_ids":["https://openalex.org/I4210162461"],"apc_list":null,"apc_paid":null,"fwci":2.2566,"has_fulltext":false,"cited_by_count":32,"citation_normalized_percentile":{"value":0.88093728,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"25","issue":"12","first_page":"2747","last_page":"2756"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/chemical-mechanical-planarization","display_name":"Chemical-mechanical planarization","score":0.9201352596282959},{"id":"https://openalex.org/keywords/optical-proximity-correction","display_name":"Optical proximity correction","score":0.896274745464325},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.7140194773674011},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6724627614021301},{"id":"https://openalex.org/keywords/polishing","display_name":"Polishing","score":0.6180938482284546},{"id":"https://openalex.org/keywords/focus","display_name":"Focus (optics)","score":0.5748845338821411},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5690125226974487},{"id":"https://openalex.org/keywords/depth-of-focus","display_name":"Depth of focus (tectonics)","score":0.5120728611946106},{"id":"https://openalex.org/keywords/enhanced-data-rates-for-gsm-evolution","display_name":"Enhanced Data Rates for GSM Evolution","score":0.49761131405830383},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.4825660288333893},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.44812697172164917},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.43131375312805176},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4189513325691223},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.4189069867134094},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4105238616466522},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.24578002095222473},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.18005019426345825},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.13491249084472656},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11869731545448303},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.1071012020111084}],"concepts":[{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.9201352596282959},{"id":"https://openalex.org/C78371743","wikidata":"https://www.wikidata.org/wiki/Q1672829","display_name":"Optical proximity correction","level":3,"score":0.896274745464325},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7140194773674011},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6724627614021301},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.6180938482284546},{"id":"https://openalex.org/C192209626","wikidata":"https://www.wikidata.org/wiki/Q190909","display_name":"Focus (optics)","level":2,"score":0.5748845338821411},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5690125226974487},{"id":"https://openalex.org/C89002693","wikidata":"https://www.wikidata.org/wiki/Q1538481","display_name":"Depth of focus (tectonics)","level":4,"score":0.5120728611946106},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.49761131405830383},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.4825660288333893},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.44812697172164917},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.43131375312805176},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4189513325691223},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.4189069867134094},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4105238616466522},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.24578002095222473},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.18005019426345825},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.13491249084472656},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11869731545448303},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.1071012020111084},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C77928131","wikidata":"https://www.wikidata.org/wiki/Q193343","display_name":"Tectonics","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C58097730","wikidata":"https://www.wikidata.org/wiki/Q176318","display_name":"Subduction","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tcad.2006.882604","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tcad.2006.882604","pdf_url":null,"source":{"id":"https://openalex.org/S100835903","display_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","issn_l":"0278-0070","issn":["0278-0070","1937-4151"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.6299999952316284,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1556480701","https://openalex.org/W1560543304","https://openalex.org/W1998725559","https://openalex.org/W2022187398","https://openalex.org/W2034763686","https://openalex.org/W2061902717","https://openalex.org/W2119860317","https://openalex.org/W2119983229","https://openalex.org/W2132590208","https://openalex.org/W2143580744","https://openalex.org/W4247596845","https://openalex.org/W4285719527","https://openalex.org/W6650186143","https://openalex.org/W6666061429","https://openalex.org/W6679679438","https://openalex.org/W6681253871"],"related_works":["https://openalex.org/W2368784978","https://openalex.org/W4243976646","https://openalex.org/W2528005065","https://openalex.org/W2070687862","https://openalex.org/W2080347815","https://openalex.org/W2984480854","https://openalex.org/W2974001143","https://openalex.org/W2945016179","https://openalex.org/W2101631039","https://openalex.org/W2002682767"],"abstract_inverted_index":{"Depth":[0],"of":[1,12,16,22,37,57,81,123,125,194],"focus":[2,17,38],"is":[3,19,85,131,154,199],"the":[4,13,34,66,82,100,105,121,157,195],"major":[5,14],"contributor":[6],"to":[7,33,74,119,165,175,213],"lithographic":[8],"process":[9,214],"margin.":[10],"One":[11],"causes":[15],"variation":[18,39,215],"imperfect":[20],"planarization":[21],"fabrication":[23],"layers.":[24],"Presently,":[25],"optical":[26,116],"proximity":[27],"correction":[28],"(OPC)":[29],"methods":[30],"are":[31],"oblivious":[32],"predictable":[35],"nature":[36],"arising":[40],"from":[41,49],"wafer":[42,92],"topography.":[43],"As":[44],"a":[45,69,78,113,128],"result,":[46],"designers":[47],"suffer":[48],"manufacturing":[50],"yield":[51,163],"loss":[52,56],"as":[53,55],"well":[54],"design":[58],"quality":[59,122],"through":[60],"unnecessary":[61],"guardbanding.":[62],"In":[63,111],"this":[64,137],"paper,":[65],"authors":[67,101],"propose":[68],"novel":[70,114],"flow":[71],"and":[72,108,146,149,188],"method":[73,198],"drive":[75],"OPC":[76,106,126,148,160,189],"with":[77,142,182],"topography":[79,93,130],"map":[80],"layout":[83],"that":[84,156,204],"generated":[86],"by":[87],"chemical-mechanical":[88],"polishing":[89],"simulation.":[90],"The":[91,133,191,201],"variations":[94],"result":[95,124],"in":[96,104,136,168,178,185,211],"local":[97],"defocus,":[98],"which":[99],"explicitly":[102],"model":[103],"insertion":[107],"verification":[109],"flows.":[110],"addition,":[112],"topography-aware":[115,159],"rule":[117],"check":[118],"validate":[120],"for":[127],"given":[129],"presented.":[132],"experimental":[134],"validation":[135],"paper":[138],"uses":[139],"simulation-based":[140],"experiments":[141],"90-nm":[143],"foundry":[144],"libraries":[145],"industry-strength":[147],"scattering":[150],"bar":[151],"recipes.":[152],"It":[153],"found":[155],"proposed":[158,196],"(TOPC)":[161],"can":[162,206],"up":[164,174],"67%":[166],"reduction":[167,177],"edge":[169],"placement":[170],"errors.":[171],"TOPC":[172,197,205],"achieves":[173],"72%":[176],"worst":[179],"case":[180],"printability":[181],"little":[183],"increase":[184],"data":[186],"volume":[187],"runtime.":[190],"electrical":[192],"impact":[193],"investigated.":[200],"results":[202],"show":[203],"significantly":[207],"reduce":[208],"timing":[209],"uncertainty":[210],"addition":[212]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":4},{"year":2012,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}