{"id":"https://openalex.org/W7131079545","doi":"https://doi.org/10.1109/tc.2026.3666827","title":"CNN-Based Transistor Modeling Under Self-Heating Effects","display_name":"CNN-Based Transistor Modeling Under Self-Heating Effects","publication_year":2026,"publication_date":"2026-02-23","ids":{"openalex":"https://openalex.org/W7131079545","doi":"https://doi.org/10.1109/tc.2026.3666827"},"language":null,"primary_location":{"id":"doi:10.1109/tc.2026.3666827","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tc.2026.3666827","pdf_url":null,"source":{"id":"https://openalex.org/S157670870","display_name":"IEEE Transactions on Computers","issn_l":"0018-9340","issn":["0018-9340","0016-9340","1557-9956","2326-3814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034714621","display_name":"Tarek Mohamed","orcid":"https://orcid.org/0009-0003-4704-9274"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Tarek Mohamed","raw_affiliation_strings":["Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany"],"raw_orcid":"https://orcid.org/0009-0003-4704-9274","affiliations":[{"raw_affiliation_string":"Semiconductor Test and Reliability (STAR), University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059133190","display_name":"Hussam Amrouch","orcid":"https://orcid.org/0000-0002-5649-3102"},"institutions":[{"id":"https://openalex.org/I62916508","display_name":"Technical University of Munich","ror":"https://ror.org/02kkvpp62","country_code":"DE","type":"education","lineage":["https://openalex.org/I62916508"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hussam Amrouch","raw_affiliation_strings":["Chair of AI Processor Design, Technical University of Munich (TUM) and with Munich Institute of Robotics and Machine Intelligence (MIRMI), Munich, Germany"],"raw_orcid":"https://orcid.org/0000-0002-5649-3102","affiliations":[{"raw_affiliation_string":"Chair of AI Processor Design, Technical University of Munich (TUM) and with Munich Institute of Robotics and Machine Intelligence (MIRMI), Munich, Germany","institution_ids":["https://openalex.org/I62916508"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.16131572,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"75","issue":"5","first_page":"2095","last_page":"2105"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.6402000188827515,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.6402000188827515,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.031099999323487282,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12611","display_name":"Neural Networks and Reservoir Computing","score":0.022700000554323196,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.7182000279426575},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.527999997138977},{"id":"https://openalex.org/keywords/calibration","display_name":"Calibration","score":0.498199999332428},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.44620001316070557},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.43160000443458557},{"id":"https://openalex.org/keywords/technology-cad","display_name":"Technology CAD","score":0.37929999828338623},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.3781999945640564},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.3578000068664551}],"concepts":[{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.7182000279426575},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5598999857902527},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.527999997138977},{"id":"https://openalex.org/C165838908","wikidata":"https://www.wikidata.org/wiki/Q736777","display_name":"Calibration","level":2,"score":0.498199999332428},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47029998898506165},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.44620001316070557},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.43160000443458557},{"id":"https://openalex.org/C34929307","wikidata":"https://www.wikidata.org/wiki/Q845636","display_name":"Technology CAD","level":3,"score":0.37929999828338623},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.3781999945640564},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.3578000068664551},{"id":"https://openalex.org/C2777441419","wikidata":"https://www.wikidata.org/wiki/Q16969460","display_name":"Process window","level":3,"score":0.3379000127315521},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.32010000944137573},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.319599986076355},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.31520000100135803},{"id":"https://openalex.org/C4775677","wikidata":"https://www.wikidata.org/wiki/Q7449393","display_name":"Semiconductor device modeling","level":3,"score":0.3086000084877014},{"id":"https://openalex.org/C145598152","wikidata":"https://www.wikidata.org/wiki/Q176097","display_name":"Field-effect transistor","level":4,"score":0.3066999912261963},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.2976999878883362},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.29679998755455017},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.2822999954223633},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.27079999446868896},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.2689000070095062},{"id":"https://openalex.org/C150169584","wikidata":"https://www.wikidata.org/wiki/Q7834319","display_name":"Transistor model","level":4,"score":0.26429998874664307},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.2632000148296356},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.2574000060558319}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tc.2026.3666827","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tc.2026.3666827","pdf_url":null,"source":{"id":"https://openalex.org/S157670870","display_name":"IEEE Transactions on Computers","issn_l":"0018-9340","issn":["0018-9340","0016-9340","1557-9956","2326-3814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7287746071815491,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"Due":[0],"to":[1,78,132,187,222,278],"the":[2,15,26,38,64,79,104,107,175,181,184,199,232,239,289],"steady":[3],"shrinking":[4],"of":[5,17,25,67,85,183,192,227,252,259,265,272,305],"technology":[6],"node":[7],"sizes,":[8],"Self-Heating":[9],"Effect":[10],"(SHE)":[11],"has":[12],"become":[13],"at":[14,42,51,55,87],"forefront":[16],"reliability":[18,29],"and":[19,40,46,73,98,111,160,174,214,267,293,314],"longevity":[20],"concerns.":[21],"Without":[22],"careful":[23],"consideration":[24],"increased":[27],"temperatures,":[28,53,57],"effects":[30],"such":[31],"as":[32,54],"aging":[33],"will":[34],"be":[35,155],"underestimated,":[36],"putting":[37],"transistor":[39,110,125,161],"circuit":[41],"risk.":[43],"SHE":[44,86,105,126,143,211],"challenges":[45],"concerns":[47],"are":[48,118,276],"all":[49],"amplified":[50],"cryogenic":[52,88],"low":[56,80,294],"multiple":[58],"physical":[59],"changes":[60],"take":[61],"effect,":[62],"like":[63,95],"significant":[65],"decrease":[66],"thermal":[68,208,212,248,255,281],"conductivity,":[69],"carriers\u2019":[70],"mobility":[71],"increase,":[72],"lower":[74],"heat":[75],"dissipation":[76],"due":[77],"ambient":[81],"temperature.":[82],"The":[83,167],"study":[84],"temperatures":[89,159,230],"is":[90],"especially":[91],"important":[92],"in":[93],"applications":[94],"quantum":[96],"computing":[97],"space":[99],"electronics.":[100],"To":[101],"accurately":[102],"anticipate":[103],"on":[106,169,234],"transistor,":[108],"physics-based":[109,124],"semiconductor":[112],"simulation":[113,283],"tools,":[114],"Technology":[115],"CAD":[116],"(TCAD),":[117],"used.":[119],"TCAD":[120,137,207,280,298],"tools":[121,138,299],"offer":[122],"accurate,":[123],"results,":[127],"which":[128],"designers":[129,221],"can":[130,139,153],"use":[131],"make":[133],"informed":[134],"decisions.":[135],"However,":[136],"only":[140,154,188],"deliver":[141],"accurate":[142],"results":[144,275],"after":[145],"a":[146,189,224,247,254,302],"manual,":[147],"time-intensive":[148],"calibration":[149,152,173],"process.":[150],"This":[151],"done":[156],"for":[157,172,178,210,242,311],"operating":[158,229],"configurations":[162],"with":[163,297],"existing":[164],"experimental":[165,170,236],"data.":[166],"reliance":[168],"data":[171,237],"constant":[176,240],"need":[177,241],"recalibration":[179],"restrict":[180],"scope":[182],"design":[185],"process":[186],"limited":[190],"subset":[191],"configurations.":[193],"In":[194],"this":[195],"work,":[196],"we":[197],"propose":[198],"first":[200],"data-driven":[201],"surrogate":[202],"Convolutional":[203],"Neural":[204],"Network":[205],"(CNN)-based":[206],"model":[209,243,282,286],"profile":[213,249,256],"channel":[215],"hotspot":[216,261,268],"prediction.":[217],"Our":[218,285],"approach":[219],"enables":[220],"sweep":[223],"huge":[225],"amount":[226],"different":[228],"without":[231],"dependency":[233],"available":[235],"or":[238],"recalibration,":[244],"while":[245],"achieving":[246],"prediction":[250,262,313],"accuracy":[251,258],"99.91%,":[253],"extrapolation":[257,269,315],"96.88%,":[260],"average":[263,270],"error":[264,271],"0.127%,":[266],"1.65%.":[273],"All":[274],"compared":[277],"calibrated":[279],"results.":[284],"also":[287],"alleviates":[288],"high":[290],"computational":[291],"cost":[292],"throughput":[295],"associated":[296],"by":[300],"offering":[301],"time":[303],"speedup":[304],"more":[306],"than":[307],"13":[308],"000":[309],"x":[310],"both":[312],"tasks.":[316]},"counts_by_year":[],"updated_date":"2026-04-09T06:08:40.794217","created_date":"2026-02-24T00:00:00"}