{"id":"https://openalex.org/W2586080536","doi":"https://doi.org/10.1109/tc.2017.2664838","title":"Realizing Transparent OS/Apps Compression in Mobile Devices at Zero Latency Overhead","display_name":"Realizing Transparent OS/Apps Compression in Mobile Devices at Zero Latency Overhead","publication_year":2017,"publication_date":"2017-02-07","ids":{"openalex":"https://openalex.org/W2586080536","doi":"https://doi.org/10.1109/tc.2017.2664838","mag":"2586080536"},"language":"en","primary_location":{"id":"doi:10.1109/tc.2017.2664838","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tc.2017.2664838","pdf_url":null,"source":{"id":"https://openalex.org/S157670870","display_name":"IEEE Transactions on Computers","issn_l":"0018-9340","issn":["0018-9340","1557-9956","2326-3814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100387436","display_name":"Xuebin Zhang","orcid":"https://orcid.org/0000-0001-7869-3730"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Xuebin Zhang","raw_affiliation_strings":["Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103013700","display_name":"Jiangpeng Li","orcid":"https://orcid.org/0009-0000-1908-5057"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jiangpeng Li","raw_affiliation_strings":["Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100658894","display_name":"Hao Wang","orcid":"https://orcid.org/0000-0002-4933-5181"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hao Wang","raw_affiliation_strings":["Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013642341","display_name":"Danni Xiong","orcid":"https://orcid.org/0000-0001-6589-5472"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Danni Xiong","raw_affiliation_strings":["Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA","institution_ids":["https://openalex.org/I165799507"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084248224","display_name":"Jingkang Qu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Jerry Qu","raw_affiliation_strings":["Qualcomm Corporation, San Diego, CA","Qualcomm Corp., San Diego, CA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Corporation, San Diego, CA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I19268510"]},{"raw_affiliation_string":"Qualcomm Corp., San Diego, CA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000278060","display_name":"Hyunsuk Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Hyunsuk Shin","raw_affiliation_strings":["Qualcomm Corporation, San Diego, CA","Qualcomm Corp., San Diego, CA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Corporation, San Diego, CA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I19268510"]},{"raw_affiliation_string":"Qualcomm Corp., San Diego, CA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064984422","display_name":"Jung Pill Kim","orcid":null},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Jung Pill Kim","raw_affiliation_strings":["Qualcomm Corporation, San Diego, CA","Qualcomm Corp., San Diego, CA"],"affiliations":[{"raw_affiliation_string":"Qualcomm Corporation, San Diego, CA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I19268510"]},{"raw_affiliation_string":"Qualcomm Corp., San Diego, CA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100378820","display_name":"Tong Zhang","orcid":"https://orcid.org/0000-0003-2477-7140"},"institutions":[{"id":"https://openalex.org/I165799507","display_name":"Rensselaer Polytechnic Institute","ror":"https://ror.org/01rtyzb94","country_code":"US","type":"education","lineage":["https://openalex.org/I165799507"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tong Zhang","raw_affiliation_strings":["Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical, Computer and System Engineering, Rensselaer Polytechnic Institute (RPI), USA","institution_ids":["https://openalex.org/I165799507"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5100387436"],"corresponding_institution_ids":["https://openalex.org/I165799507"],"apc_list":null,"apc_paid":null,"fwci":1.8648,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.87154903,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"66","issue":"7","first_page":"1188","last_page":"1199"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11478","display_name":"Caching and Content Delivery","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.8386375308036804},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.6538494825363159},{"id":"https://openalex.org/keywords/latency","display_name":"Latency (audio)","score":0.6516982316970825},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.507398784160614},{"id":"https://openalex.org/keywords/android","display_name":"Android (operating system)","score":0.46328797936439514},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.44287508726119995},{"id":"https://openalex.org/keywords/mobile-device","display_name":"Mobile device","score":0.4372398257255554},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.4127427935600281},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.3054065704345703},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07886305451393127}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.8386375308036804},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.6538494825363159},{"id":"https://openalex.org/C82876162","wikidata":"https://www.wikidata.org/wiki/Q17096504","display_name":"Latency (audio)","level":2,"score":0.6516982316970825},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.507398784160614},{"id":"https://openalex.org/C557433098","wikidata":"https://www.wikidata.org/wiki/Q94","display_name":"Android (operating system)","level":2,"score":0.46328797936439514},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.44287508726119995},{"id":"https://openalex.org/C186967261","wikidata":"https://www.wikidata.org/wiki/Q5082128","display_name":"Mobile device","level":2,"score":0.4372398257255554},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.4127427935600281},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.3054065704345703},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07886305451393127}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tc.2017.2664838","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tc.2017.2664838","pdf_url":null,"source":{"id":"https://openalex.org/S157670870","display_name":"IEEE Transactions on Computers","issn_l":"0018-9340","issn":["0018-9340","1557-9956","2326-3814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W1478204837","https://openalex.org/W1604085341","https://openalex.org/W1900310282","https://openalex.org/W1961905000","https://openalex.org/W1964802076","https://openalex.org/W1969872520","https://openalex.org/W1975200978","https://openalex.org/W2039072801","https://openalex.org/W2060108852","https://openalex.org/W2066852894","https://openalex.org/W2098579796","https://openalex.org/W2104292367","https://openalex.org/W2107745473","https://openalex.org/W2113319082","https://openalex.org/W2123021129","https://openalex.org/W2132929952","https://openalex.org/W2138433591","https://openalex.org/W2140024209","https://openalex.org/W2209415352","https://openalex.org/W2221664041","https://openalex.org/W2247185367","https://openalex.org/W6636158174","https://openalex.org/W6639687893","https://openalex.org/W6643082366","https://openalex.org/W6675860932","https://openalex.org/W6680250025","https://openalex.org/W6688173420","https://openalex.org/W6688919879","https://openalex.org/W6691197194"],"related_works":["https://openalex.org/W2165367082","https://openalex.org/W1972641423","https://openalex.org/W611446063","https://openalex.org/W1967064512","https://openalex.org/W2388299947","https://openalex.org/W2139737941","https://openalex.org/W2382673458","https://openalex.org/W4206938017","https://openalex.org/W2361380273","https://openalex.org/W782612275"],"abstract_inverted_index":{"Motivated":[0],"by":[1,131],"the":[2,14,41,45,80,84,89,94,112,125,154,163],"significant":[3],"storage":[4],"footprint":[5,127],"of":[6,16,22,114],"OS/Apps":[7,17,126],"in":[8,33],"mobile":[9,35],"devices,":[10,36],"this":[11,26],"paper":[12,71],"studies":[13],"realization":[15,113],"transparent":[18,54,115],"compression.":[19],"In":[20,49],"spite":[21],"its":[23,100],"obvious":[24],"advantage,":[25],"feature":[27],"however":[28],"is":[29,38],"not":[30],"widely":[31],"available":[32],"commercial":[34],"which":[37],"due":[39],"to":[40,78,109,133],"justifiable":[42],"concern":[43],"on":[44,52,136],"read":[46,56,64,81,119],"latency":[47,57,91,165],"penalty.":[48],"conventional":[50],"practice":[51],"implementing":[53],"compression,":[55],"overhead":[58,92,166],"comes":[59],"from":[60],"two":[61],"aspects,":[62],"including":[63],"amplification":[65,82],"and":[66,87],"decompression":[67,164],"computational":[68,90],"latency.":[69],"This":[70],"presents":[72],"simple":[73],"yet":[74],"effective":[75],"design":[76,159],"solutions":[77],"eliminate":[79,88,162],"at":[83,93],"filesystem":[85,108],"level":[86,158],"computer":[95,156],"architecture":[96,157],"level.":[97],"To":[98],"demonstrate":[99],"practical":[101],"feasibility,":[102],"we":[103,151],"first":[104],"implemented":[105],"a":[106,137],"prototyping":[107],"empirically":[110],"verify":[111],"compression":[116],"with":[117,142,167],"zero":[118],"amplification.":[120],"We":[121],"further":[122],"demonstrated":[123],"that":[124,153],"can":[128,161],"be":[129],"reduced":[130],"up":[132],"39":[134],"percent":[135],"Nexus":[138],"7":[139],"tablet":[140],"installed":[141],"Android":[143],"5.0.":[144],"Through":[145],"application-specific":[146],"integrated":[147],"circuit":[148],"(ASIC)":[149],"synthesis,":[150],"show":[152],"proposed":[155],"solution":[160],"very":[168],"small":[169],"silicon":[170],"cost.":[171]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":5}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}