{"id":"https://openalex.org/W2104884563","doi":"https://doi.org/10.1109/tc.2003.1244945","title":"Concurrent application of compaction and compression for test time and data volume reduction in scan designs","display_name":"Concurrent application of compaction and compression for test time and data volume reduction in scan designs","publication_year":2003,"publication_date":"2003-11-01","ids":{"openalex":"https://openalex.org/W2104884563","doi":"https://doi.org/10.1109/tc.2003.1244945","mag":"2104884563"},"language":"en","primary_location":{"id":"doi:10.1109/tc.2003.1244945","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tc.2003.1244945","pdf_url":null,"source":{"id":"https://openalex.org/S157670870","display_name":"IEEE Transactions on Computers","issn_l":"0018-9340","issn":["0018-9340","1557-9956","2326-3814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computers","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5024209595","display_name":"I. Bayraktaroglu","orcid":null},"institutions":[{"id":"https://openalex.org/I1342911587","display_name":"Oracle (United States)","ror":"https://ror.org/006c77m33","country_code":"US","type":"company","lineage":["https://openalex.org/I1342911587"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"I. Bayraktaroglu","raw_affiliation_strings":["MS: USUN03-315, 430 N.Mary Ave., Sun Microsystems, Sunnyvale, CA, USA"],"affiliations":[{"raw_affiliation_string":"MS: USUN03-315, 430 N.Mary Ave., Sun Microsystems, Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I1342911587"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006811625","display_name":"Alex Orailo\u011flu","orcid":"https://orcid.org/0000-0002-6104-3923"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California, San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Orailoglu","raw_affiliation_strings":["Computer Science and Engineering Department, University of California, San Diego, CA, USA"],"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, University of California, San Diego, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5024209595"],"corresponding_institution_ids":["https://openalex.org/I1342911587"],"apc_list":null,"apc_paid":null,"fwci":2.5154,"has_fulltext":false,"cited_by_count":49,"citation_normalized_percentile":{"value":0.89537263,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"52","issue":"11","first_page":"1480","last_page":"1489"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/test-compression","display_name":"Test compression","score":0.7993389368057251},{"id":"https://openalex.org/keywords/volume","display_name":"Volume (thermodynamics)","score":0.6800262928009033},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6190962195396423},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5694152116775513},{"id":"https://openalex.org/keywords/data-compression","display_name":"Data compression","score":0.5686736106872559},{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.5682838559150696},{"id":"https://openalex.org/keywords/scan-chain","display_name":"Scan chain","score":0.5431349873542786},{"id":"https://openalex.org/keywords/test-set","display_name":"Test set","score":0.5161367654800415},{"id":"https://openalex.org/keywords/compression-ratio","display_name":"Compression ratio","score":0.5036496520042419},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4776138961315155},{"id":"https://openalex.org/keywords/compaction","display_name":"Compaction","score":0.47482118010520935},{"id":"https://openalex.org/keywords/automatic-test-pattern-generation","display_name":"Automatic test pattern generation","score":0.47208094596862793},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.4288023114204407},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.42723989486694336},{"id":"https://openalex.org/keywords/test-data","display_name":"Test data","score":0.4270452857017517},{"id":"https://openalex.org/keywords/data-compression-ratio","display_name":"Data compression ratio","score":0.4147361218929291},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.4122456908226013},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3541939854621887},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3297201991081238},{"id":"https://openalex.org/keywords/image-compression","display_name":"Image compression","score":0.1940402388572693},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.1757635772228241},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.16669633984565735},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.15033116936683655},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14209595322608948},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.09646838903427124},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08634147047996521},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.07300147414207458}],"concepts":[{"id":"https://openalex.org/C29652920","wikidata":"https://www.wikidata.org/wiki/Q7705757","display_name":"Test compression","level":4,"score":0.7993389368057251},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.6800262928009033},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6190962195396423},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5694152116775513},{"id":"https://openalex.org/C78548338","wikidata":"https://www.wikidata.org/wiki/Q2493","display_name":"Data compression","level":2,"score":0.5686736106872559},{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.5682838559150696},{"id":"https://openalex.org/C150012182","wikidata":"https://www.wikidata.org/wiki/Q225990","display_name":"Scan chain","level":3,"score":0.5431349873542786},{"id":"https://openalex.org/C169903167","wikidata":"https://www.wikidata.org/wiki/Q3985153","display_name":"Test set","level":2,"score":0.5161367654800415},{"id":"https://openalex.org/C25797200","wikidata":"https://www.wikidata.org/wiki/Q828137","display_name":"Compression ratio","level":3,"score":0.5036496520042419},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4776138961315155},{"id":"https://openalex.org/C196715460","wikidata":"https://www.wikidata.org/wiki/Q1414356","display_name":"Compaction","level":2,"score":0.47482118010520935},{"id":"https://openalex.org/C17626397","wikidata":"https://www.wikidata.org/wiki/Q837455","display_name":"Automatic test pattern generation","level":3,"score":0.47208094596862793},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.4288023114204407},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.42723989486694336},{"id":"https://openalex.org/C16910744","wikidata":"https://www.wikidata.org/wiki/Q7705759","display_name":"Test data","level":2,"score":0.4270452857017517},{"id":"https://openalex.org/C94835093","wikidata":"https://www.wikidata.org/wiki/Q3113333","display_name":"Data compression ratio","level":5,"score":0.4147361218929291},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4122456908226013},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3541939854621887},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3297201991081238},{"id":"https://openalex.org/C13481523","wikidata":"https://www.wikidata.org/wiki/Q412438","display_name":"Image compression","level":4,"score":0.1940402388572693},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.1757635772228241},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.16669633984565735},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.15033116936683655},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14209595322608948},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.09646838903427124},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08634147047996521},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.07300147414207458},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C187320778","wikidata":"https://www.wikidata.org/wiki/Q1349130","display_name":"Geotechnical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C511840579","wikidata":"https://www.wikidata.org/wiki/Q12757","display_name":"Internal combustion engine","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tc.2003.1244945","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tc.2003.1244945","pdf_url":null,"source":{"id":"https://openalex.org/S157670870","display_name":"IEEE Transactions on Computers","issn_l":"0018-9340","issn":["0018-9340","1557-9956","2326-3814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Computers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320309622","display_name":"Harvard University","ror":"https://ror.org/03vek6s52"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":29,"referenced_works":["https://openalex.org/W1763985980","https://openalex.org/W1829756786","https://openalex.org/W1838570031","https://openalex.org/W1854778394","https://openalex.org/W1897664708","https://openalex.org/W1899662483","https://openalex.org/W1908802429","https://openalex.org/W1964801859","https://openalex.org/W1986645364","https://openalex.org/W2057934715","https://openalex.org/W2097270518","https://openalex.org/W2099814124","https://openalex.org/W2100366218","https://openalex.org/W2107800433","https://openalex.org/W2126721444","https://openalex.org/W2127079967","https://openalex.org/W2133595845","https://openalex.org/W2135622428","https://openalex.org/W2138530143","https://openalex.org/W2146594632","https://openalex.org/W2147588475","https://openalex.org/W2160621850","https://openalex.org/W2164719222","https://openalex.org/W2168044122","https://openalex.org/W2168873569","https://openalex.org/W2427394675","https://openalex.org/W2587271961","https://openalex.org/W4239144429","https://openalex.org/W6638804629"],"related_works":["https://openalex.org/W2789883751","https://openalex.org/W2147986372","https://openalex.org/W1979305473","https://openalex.org/W2274367941","https://openalex.org/W2075356617","https://openalex.org/W2074302528","https://openalex.org/W2092894550","https://openalex.org/W1588361197","https://openalex.org/W2408214455","https://openalex.org/W2134369540"],"abstract_inverted_index":{"A":[0],"test":[1,6,18,35,77],"pattern":[2,78],"compression":[3,16],"scheme":[4],"for":[5],"data":[7,19],"volume":[8],"and":[9,53],"application":[10,36],"time":[11,37],"reduction":[12],"is":[13,65],"proposed.":[14],"While":[15],"reduces":[17,34],"volume,":[20],"the":[21,43,51,54,57,69,76],"increased":[22],"number":[23,44],"of":[24,45,56,75],"internal":[25],"scan":[26,47],"chains":[27,48],"due":[28],"to":[29,50],"an":[30],"on-chip,":[31],"fixed-rate":[32],"decompressor":[33],"proportionately.":[38],"Through":[39],"on-chip":[40],"decompression,":[41],"both":[42],"virtual":[46],"visible":[49],"ATE":[52,58],"functionality":[55],"are":[59],"retained":[60],"intact.":[61],"Complete":[62],"fault":[63],"coverage":[64],"guaranteed":[66],"by":[67],"constructing":[68],"decompression":[70],"hardware":[71],"deterministically":[72],"through":[73],"analysis":[74],"set.":[79]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":2},{"year":2012,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}