{"id":"https://openalex.org/W3184052279","doi":"https://doi.org/10.1109/tbme.2021.3098567","title":"Optimized Backing Layers Design for High Frequency Broad Bandwidth Ultrasonic Transducer","display_name":"Optimized Backing Layers Design for High Frequency Broad Bandwidth Ultrasonic Transducer","publication_year":2021,"publication_date":"2021-07-21","ids":{"openalex":"https://openalex.org/W3184052279","doi":"https://doi.org/10.1109/tbme.2021.3098567","mag":"3184052279","pmid":"https://pubmed.ncbi.nlm.nih.gov/34288870"},"language":"en","primary_location":{"id":"doi:10.1109/tbme.2021.3098567","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tbme.2021.3098567","pdf_url":null,"source":{"id":"https://openalex.org/S5240358","display_name":"IEEE Transactions on Biomedical Engineering","issn_l":"0018-9294","issn":["0018-9294","1558-2531"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Biomedical Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5015152146","display_name":"Chenxue Hou","orcid":"https://orcid.org/0009-0008-1419-3022"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chenxue Hou","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047595803","display_name":"Chunlong Fei","orcid":"https://orcid.org/0000-0001-5460-7092"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]},{"id":"https://openalex.org/I4210145761","display_name":"Shenzhen Institutes of Advanced Technology","ror":"https://ror.org/04gh4er46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210145761"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chunlong Fei","raw_affiliation_strings":["School of Microelectronics, Xidian University, Xi'an, China","Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"],"raw_orcid":"https://orcid.org/0000-0001-5460-7092","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, Xi'an, China","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China","institution_ids":["https://openalex.org/I4210145761"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102028263","display_name":"Zhaoxi Li","orcid":"https://orcid.org/0000-0001-5808-1876"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhaoxi Li","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052312440","display_name":"Shuxiao Zhang","orcid":"https://orcid.org/0000-0002-2539-4689"},"institutions":[{"id":"https://openalex.org/I4210145761","display_name":"Shenzhen Institutes of Advanced Technology","ror":"https://ror.org/04gh4er46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210145761"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shuxiao Zhang","raw_affiliation_strings":["Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China","institution_ids":["https://openalex.org/I4210145761"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012129357","display_name":"Jiujing Man","orcid":null},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiujing Man","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100364589","display_name":"Dongdong Chen","orcid":"https://orcid.org/0000-0002-5065-4374"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongdong Chen","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":"https://orcid.org/0000-0002-5065-4374","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110787049","display_name":"Runcong Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Runcong Wu","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100446349","display_name":"Di Li","orcid":"https://orcid.org/0000-0001-6118-7401"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Di Li","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":"https://orcid.org/0000-0001-6118-7401","affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100402361","display_name":"Yintang Yang","orcid":"https://orcid.org/0000-0001-9745-5404"},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yintang Yang","raw_affiliation_strings":["School of Microelectronics, Xidian University, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics, Xidian University, China","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052037779","display_name":"Wei Feng","orcid":"https://orcid.org/0000-0002-9845-999X"},"institutions":[{"id":"https://openalex.org/I4210145761","display_name":"Shenzhen Institutes of Advanced Technology","ror":"https://ror.org/04gh4er46","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210145761"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Feng","raw_affiliation_strings":["Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China"],"raw_orcid":"https://orcid.org/0000-0002-9845-999X","affiliations":[{"raw_affiliation_string":"Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China","institution_ids":["https://openalex.org/I4210145761"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.5317,"has_fulltext":false,"cited_by_count":35,"citation_normalized_percentile":{"value":0.89675976,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":97,"max":100},"biblio":{"volume":"69","issue":"1","first_page":"475","last_page":"481"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10727","display_name":"Ultrasound Imaging and Elastography","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2741","display_name":"Radiology, Nuclear Medicine and Imaging"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}},"topics":[{"id":"https://openalex.org/T10727","display_name":"Ultrasound Imaging and Elastography","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2741","display_name":"Radiology, Nuclear Medicine and Imaging"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}},{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10958","display_name":"Ultrasound and Hyperthermia Applications","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transducer","display_name":"Transducer","score":0.8447445034980774},{"id":"https://openalex.org/keywords/ultrasonic-sensor","display_name":"Ultrasonic sensor","score":0.8069247007369995},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.7833248972892761},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.631371259689331},{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.6301202774047852},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6239359974861145},{"id":"https://openalex.org/keywords/impedance-matching","display_name":"Impedance matching","score":0.5344283580780029},{"id":"https://openalex.org/keywords/acoustic-impedance","display_name":"Acoustic impedance","score":0.4879710078239441},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.4487622082233429},{"id":"https://openalex.org/keywords/ultrasound","display_name":"Ultrasound","score":0.4206937253475189},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.360331654548645},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2000843584537506},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18679633736610413},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12765443325042725},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08382442593574524}],"concepts":[{"id":"https://openalex.org/C56318395","wikidata":"https://www.wikidata.org/wiki/Q215928","display_name":"Transducer","level":2,"score":0.8447445034980774},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.8069247007369995},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.7833248972892761},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.631371259689331},{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.6301202774047852},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6239359974861145},{"id":"https://openalex.org/C612350","wikidata":"https://www.wikidata.org/wiki/Q1761108","display_name":"Impedance matching","level":3,"score":0.5344283580780029},{"id":"https://openalex.org/C98937189","wikidata":"https://www.wikidata.org/wiki/Q975684","display_name":"Acoustic impedance","level":3,"score":0.4879710078239441},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.4487622082233429},{"id":"https://openalex.org/C143753070","wikidata":"https://www.wikidata.org/wiki/Q162564","display_name":"Ultrasound","level":2,"score":0.4206937253475189},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.360331654548645},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2000843584537506},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18679633736610413},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12765443325042725},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08382442593574524},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[{"descriptor_ui":"D002516","descriptor_name":"Ceramics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D002516","descriptor_name":"Ceramics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D002516","descriptor_name":"Ceramics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014159","descriptor_name":"Transducers","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D014159","descriptor_name":"Transducers","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D014159","descriptor_name":"Transducers","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D014463","descriptor_name":"Ultrasonography","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014463","descriptor_name":"Ultrasonography","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014463","descriptor_name":"Ultrasonography","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D014465","descriptor_name":"Ultrasonics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D014465","descriptor_name":"Ultrasonics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D014465","descriptor_name":"Ultrasonics","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true}],"locations_count":2,"locations":[{"id":"doi:10.1109/tbme.2021.3098567","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tbme.2021.3098567","pdf_url":null,"source":{"id":"https://openalex.org/S5240358","display_name":"IEEE Transactions on Biomedical Engineering","issn_l":"0018-9294","issn":["0018-9294","1558-2531"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Biomedical Engineering","raw_type":"journal-article"},{"id":"pmid:34288870","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/34288870","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE transactions on bio-medical engineering","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3601947552","display_name":null,"funder_award_id":"2017YFC0109703","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G4317073258","display_name":null,"funder_award_id":"61974110","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":38,"referenced_works":["https://openalex.org/W1963793887","https://openalex.org/W1979805538","https://openalex.org/W2048530414","https://openalex.org/W2053932431","https://openalex.org/W2058599322","https://openalex.org/W2060681298","https://openalex.org/W2071169168","https://openalex.org/W2107758958","https://openalex.org/W2107889204","https://openalex.org/W2112235416","https://openalex.org/W2122285378","https://openalex.org/W2125399104","https://openalex.org/W2155572071","https://openalex.org/W2159179746","https://openalex.org/W2170625771","https://openalex.org/W2566415696","https://openalex.org/W2766815780","https://openalex.org/W2780520944","https://openalex.org/W2790685303","https://openalex.org/W2804870110","https://openalex.org/W2890936046","https://openalex.org/W2901019409","https://openalex.org/W2913380765","https://openalex.org/W2924201123","https://openalex.org/W2962875652","https://openalex.org/W2990606006","https://openalex.org/W2997826228","https://openalex.org/W3006168331","https://openalex.org/W3006376905","https://openalex.org/W3010153802","https://openalex.org/W3014245777","https://openalex.org/W3015418145","https://openalex.org/W3017377309","https://openalex.org/W3033196946","https://openalex.org/W3038931241","https://openalex.org/W3090611308","https://openalex.org/W3091979435","https://openalex.org/W3170917767"],"related_works":["https://openalex.org/W3210581393","https://openalex.org/W2087608731","https://openalex.org/W4213306779","https://openalex.org/W2136824598","https://openalex.org/W2145437567","https://openalex.org/W2966927189","https://openalex.org/W4299563398","https://openalex.org/W2743647425","https://openalex.org/W2162562713","https://openalex.org/W2744035308"],"abstract_inverted_index":{"Ultrasonic":[0],"transducers":[1],"with":[2,127,143,158,170,177],"broad":[3,54],"bandwidth":[4,28,55,72,114,145],"are":[5,29],"considered":[6],"to":[7,27,52,69,100],"have":[8],"high":[9,57,175],"axial":[10],"resolution":[11,25],"and":[12,47,56,88,109],"good":[13,156,178],"ultrasound":[14,34],"scanning":[15],"flexibility":[16],"for":[17],"the":[18,44,71,85,89,102,105,113,116,124,128,133,141,159,166],"clinical":[19],"applications.":[20],"The":[21,37,93,118,151,161],"limitations":[22],"of":[23,30,39,81,104,115,146],"spatial":[24],"due":[26],"great":[31],"concern":[32],"in":[33,155],"medical":[35],"imaging.":[36],"method":[38,97,126],"acoustic":[40,77],"impedance":[41,78],"matching":[42,79],"between":[43,84],"piezoelectric":[45,90],"element":[46],"medium":[48],"is":[49],"commonly":[50],"used":[51,99],"obtain":[53],"resolution.":[58],"In":[59],"this":[60],"study,":[61],"an":[62,171],"optimized":[63,119],"backing":[64,82,86,106],"layer":[65,80,87],"design":[66],"was":[67,98,121,149],"proposed":[68],"broaden":[70],"by":[73],"adding":[74],"a":[75,136,144],"tunable":[76],"(AIMLB)":[83],"ceramic":[91],"element.":[92],"Mason":[94],"equivalent":[95],"circuit":[96],"analyze":[101],"effect":[103],"material":[107],"composition":[108],"its":[110],"structure":[111],"on":[112,132],"transducer.":[117],"transducer":[120,139,169],"simulated":[122],"using":[123,140],"finite-element":[125],"PZFlex":[129,134],"software.":[130],"Based":[131],"simulations,":[135],"20-MHz":[137],"ultrasonic":[138,162,168],"AIMLB":[142,173],"approximately":[147],"92.29%":[148],"fabricated.":[150],"experimental":[152],"results":[153],"were":[154],"agreement":[157],"simulations.":[160],"imaging":[163,179],"indicated":[164],"that":[165],"designed":[167],"additional":[172],"had":[174],"performance":[176],"capability.":[180]},"counts_by_year":[{"year":2026,"cited_by_count":9},{"year":2025,"cited_by_count":8},{"year":2024,"cited_by_count":8},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":6}],"updated_date":"2026-03-27T05:58:40.876381","created_date":"2025-10-10T00:00:00"}