{"id":"https://openalex.org/W2155723826","doi":"https://doi.org/10.1109/tbme.2010.2041058","title":"Fully Wireless Implantable Cardiovascular Pressure Monitor Integrated with a Medical Stent","display_name":"Fully Wireless Implantable Cardiovascular Pressure Monitor Integrated with a Medical Stent","publication_year":2010,"publication_date":"2010-02-17","ids":{"openalex":"https://openalex.org/W2155723826","doi":"https://doi.org/10.1109/tbme.2010.2041058","mag":"2155723826","pmid":"https://pubmed.ncbi.nlm.nih.gov/20172781"},"language":"en","primary_location":{"id":"doi:10.1109/tbme.2010.2041058","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tbme.2010.2041058","pdf_url":null,"source":{"id":"https://openalex.org/S5240358","display_name":"IEEE Transactions on Biomedical Engineering","issn_l":"0018-9294","issn":["0018-9294","1558-2531"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Biomedical Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref","pubmed"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007184943","display_name":"Eric Y. Chow","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]},{"id":"https://openalex.org/I2802964274","display_name":"Interface (United States)","ror":"https://ror.org/04nvtmr42","country_code":"US","type":"company","lineage":["https://openalex.org/I2802964274"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric Y Chow","raw_affiliation_strings":["Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN 47907, USA. eychow@purdue.edu","Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering and School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN 47907, USA. eychow@purdue.edu","institution_ids":["https://openalex.org/I219193219","https://openalex.org/I2802964274"]},{"raw_affiliation_string":"Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering and School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219","https://openalex.org/I2802964274"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056206149","display_name":"Arthur L. Chlebowski","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]},{"id":"https://openalex.org/I2802964274","display_name":"Interface (United States)","ror":"https://ror.org/04nvtmr42","country_code":"US","type":"company","lineage":["https://openalex.org/I2802964274"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arthur L Chlebowski","raw_affiliation_strings":["Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219","https://openalex.org/I2802964274"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082289150","display_name":"Sudipto Chakraborty","orcid":"https://orcid.org/0000-0001-9884-5850"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sudipto Chakraborty","raw_affiliation_strings":["Communication Systems Laboratory, Texas Instruments, Inc., Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Communication Systems Laboratory, Texas Instruments, Inc., Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081784285","display_name":"William J. Chappell","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"William J Chappell","raw_affiliation_strings":["IDEAS Microwave Laboratory, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IDEAS Microwave Laboratory, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088246631","display_name":"Pedro P. Irazoqui","orcid":"https://orcid.org/0000-0002-4791-4593"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]},{"id":"https://openalex.org/I2802964274","display_name":"Interface (United States)","ror":"https://ror.org/04nvtmr42","country_code":"US","type":"company","lineage":["https://openalex.org/I2802964274"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pedro P Irazoqui","raw_affiliation_strings":["Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Brain Computer Interface Laboratory, Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219","https://openalex.org/I2802964274"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":14.7125,"has_fulltext":false,"cited_by_count":220,"citation_normalized_percentile":{"value":0.99230777,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":100},"biblio":{"volume":"57","issue":"6","first_page":"1487","last_page":"1496"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11392","display_name":"Energy Harvesting in Wireless Networks","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11932","display_name":"Wireless Body Area Networks","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.7191488742828369},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.6689258813858032},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.5648224949836731},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5515614748001099},{"id":"https://openalex.org/keywords/telemetry","display_name":"Telemetry","score":0.5452835559844971},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5078471302986145},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.4779351055622101},{"id":"https://openalex.org/keywords/pressure-measurement","display_name":"Pressure measurement","score":0.47416606545448303},{"id":"https://openalex.org/keywords/ism-band","display_name":"ISM band","score":0.4636894762516022},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4608857333660126},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.42164483666419983},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.40518829226493835},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.36998575925827026},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.30062925815582275},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1804540455341339},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.11173516511917114}],"concepts":[{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.7191488742828369},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.6689258813858032},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.5648224949836731},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5515614748001099},{"id":"https://openalex.org/C183121708","wikidata":"https://www.wikidata.org/wiki/Q209867","display_name":"Telemetry","level":2,"score":0.5452835559844971},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5078471302986145},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.4779351055622101},{"id":"https://openalex.org/C80264047","wikidata":"https://www.wikidata.org/wiki/Q7424019","display_name":"Pressure measurement","level":2,"score":0.47416606545448303},{"id":"https://openalex.org/C2780652538","wikidata":"https://www.wikidata.org/wiki/Q304545","display_name":"ISM band","level":3,"score":0.4636894762516022},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4608857333660126},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.42164483666419983},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.40518829226493835},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.36998575925827026},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.30062925815582275},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1804540455341339},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.11173516511917114},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0}],"mesh":[{"descriptor_ui":"D001795","descriptor_name":"Blood Pressure Determination","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":false},{"descriptor_ui":"D001795","descriptor_name":"Blood Pressure Determination","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":false},{"descriptor_ui":"D001795","descriptor_name":"Blood Pressure Determination","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":false},{"descriptor_ui":"D001807","descriptor_name":"Blood Vessel Prosthesis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D001807","descriptor_name":"Blood Vessel Prosthesis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D001807","descriptor_name":"Blood Vessel Prosthesis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D004867","descriptor_name":"Equipment Design","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012680","descriptor_name":"Sensitivity and Specificity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012680","descriptor_name":"Sensitivity and Specificity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D012680","descriptor_name":"Sensitivity and Specificity","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D013686","descriptor_name":"Telemetry","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":false},{"descriptor_ui":"D013686","descriptor_name":"Telemetry","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":false},{"descriptor_ui":"D013686","descriptor_name":"Telemetry","qualifier_ui":"Q000295","qualifier_name":"instrumentation","is_major_topic":false},{"descriptor_ui":"D015203","descriptor_name":"Reproducibility of Results","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D015203","descriptor_name":"Reproducibility of Results","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D015203","descriptor_name":"Reproducibility of Results","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D015607","descriptor_name":"Stents","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D015607","descriptor_name":"Stents","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D015607","descriptor_name":"Stents","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D019544","descriptor_name":"Equipment Failure Analysis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019544","descriptor_name":"Equipment Failure Analysis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019544","descriptor_name":"Equipment Failure Analysis","qualifier_ui":null,"qualifier_name":null,"is_major_topic":false},{"descriptor_ui":"D019736","descriptor_name":"Prostheses and Implants","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D019736","descriptor_name":"Prostheses and Implants","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true},{"descriptor_ui":"D019736","descriptor_name":"Prostheses and Implants","qualifier_ui":null,"qualifier_name":null,"is_major_topic":true}],"locations_count":2,"locations":[{"id":"doi:10.1109/tbme.2010.2041058","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tbme.2010.2041058","pdf_url":null,"source":{"id":"https://openalex.org/S5240358","display_name":"IEEE Transactions on Biomedical Engineering","issn_l":"0018-9294","issn":["0018-9294","1558-2531"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Biomedical Engineering","raw_type":"journal-article"},{"id":"pmid:20172781","is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/20172781","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE transactions on bio-medical engineering","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Good health and well-being","score":0.49000000953674316,"id":"https://metadata.un.org/sdg/3"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320312085","display_name":"Cook Medical","ror":"https://ror.org/03x705365"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":64,"referenced_works":["https://openalex.org/W121592720","https://openalex.org/W168717436","https://openalex.org/W613474241","https://openalex.org/W637151925","https://openalex.org/W659257988","https://openalex.org/W1524573041","https://openalex.org/W1569638374","https://openalex.org/W1589642053","https://openalex.org/W1597420946","https://openalex.org/W1602434886","https://openalex.org/W1605094682","https://openalex.org/W1906786069","https://openalex.org/W1944011242","https://openalex.org/W1964979261","https://openalex.org/W1983007888","https://openalex.org/W1983301330","https://openalex.org/W2004997323","https://openalex.org/W2005023552","https://openalex.org/W2007097220","https://openalex.org/W2011565562","https://openalex.org/W2012558437","https://openalex.org/W2015422285","https://openalex.org/W2018941122","https://openalex.org/W2020468542","https://openalex.org/W2022981781","https://openalex.org/W2040091737","https://openalex.org/W2044972415","https://openalex.org/W2053568769","https://openalex.org/W2058198922","https://openalex.org/W2058871194","https://openalex.org/W2069472142","https://openalex.org/W2072007987","https://openalex.org/W2074645827","https://openalex.org/W2086578266","https://openalex.org/W2088405320","https://openalex.org/W2093826454","https://openalex.org/W2099801150","https://openalex.org/W2100888062","https://openalex.org/W2104182514","https://openalex.org/W2110052350","https://openalex.org/W2117725352","https://openalex.org/W2119776705","https://openalex.org/W2124907472","https://openalex.org/W2144146676","https://openalex.org/W2148783699","https://openalex.org/W2153787766","https://openalex.org/W2165252707","https://openalex.org/W2166228848","https://openalex.org/W2167004581","https://openalex.org/W2172040442","https://openalex.org/W2172298832","https://openalex.org/W2173788200","https://openalex.org/W2283635835","https://openalex.org/W2409502388","https://openalex.org/W2418700433","https://openalex.org/W2538932430","https://openalex.org/W2709167953","https://openalex.org/W2799149586","https://openalex.org/W2912369719","https://openalex.org/W3139984197","https://openalex.org/W4230285344","https://openalex.org/W4298334616","https://openalex.org/W4300669342","https://openalex.org/W6716971744"],"related_works":["https://openalex.org/W4206804491","https://openalex.org/W1973127455","https://openalex.org/W4242883309","https://openalex.org/W2984836626","https://openalex.org/W3022118013","https://openalex.org/W2534267407","https://openalex.org/W2269051159","https://openalex.org/W818971998","https://openalex.org/W2093962749","https://openalex.org/W178109321"],"abstract_inverted_index":{"This":[0,65],"paper":[1,66],"presents":[2],"a":[3,59,79,86,105,111],"fully":[4,68],"wireless":[5,27,47],"cardiac":[6,95],"pressure":[7,56,88,99],"sensing":[8],"system.":[9],"Food":[10],"and":[11,29,37,53],"Drug":[12],"Administration":[13],"(FDA)":[14],"approved":[15],"medical":[16],"stents":[17],"are":[18],"explored":[19],"as":[20],"radiating":[21],"structures":[22],"to":[23,97],"support":[24],"simultaneous":[25],"transcutaneous":[26],"telemetry":[28],"powering.":[30],"An":[31],"application-specific":[32],"integrated":[33],"circuit":[34],"(ASIC),":[35],"designed":[36],"fabricated":[38],"using":[39,110],"the":[40,91,94],"Texas":[41],"Instruments":[42],"130-nm":[43],"CMOS":[44],"process,":[45],"enables":[46],"telemetry,":[48],"remote":[49],"powering,":[50],"voltage":[51],"regulation,":[52],"processing":[54],"of":[55,81,93,101,107,114],"measurements":[57],"from":[58],"microelectromechanical":[60],"systems":[61],"(MEMS)":[62],"capacitive":[63],"sensor.":[64],"demonstrates":[67],"wireless-pressure-sensing":[69],"functionality":[70],"with":[71],"an":[72],"external":[73],"35-dB.m":[74],"RF":[75],"powering":[76],"source":[77],"across":[78],"distance":[80],"10":[82],"cm.":[83],"Measurements":[84],"in":[85],"regulated":[87],"chamber":[89],"demonstrate":[90],"ability":[92],"system":[96],"achieve":[98],"resolutions":[100],"0.5":[102],"mmHg":[103,109],"over":[104],"range":[106],"0-50":[108],"channel":[112],"data-rate":[113],"42.2":[115],"kb/s.":[116]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":9},{"year":2024,"cited_by_count":8},{"year":2023,"cited_by_count":20},{"year":2022,"cited_by_count":16},{"year":2021,"cited_by_count":8},{"year":2020,"cited_by_count":11},{"year":2019,"cited_by_count":19},{"year":2018,"cited_by_count":19},{"year":2017,"cited_by_count":16},{"year":2016,"cited_by_count":11},{"year":2015,"cited_by_count":18},{"year":2014,"cited_by_count":14},{"year":2013,"cited_by_count":20},{"year":2012,"cited_by_count":13}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}