{"id":"https://openalex.org/W2802507231","doi":"https://doi.org/10.1109/tase.2018.2826362","title":"An Online Tool Temperature Monitoring Method Based on Physics-Guided Infrared Image Features and Artificial Neural Network for Dry Cutting","display_name":"An Online Tool Temperature Monitoring Method Based on Physics-Guided Infrared Image Features and Artificial Neural Network for Dry Cutting","publication_year":2018,"publication_date":"2018-05-01","ids":{"openalex":"https://openalex.org/W2802507231","doi":"https://doi.org/10.1109/tase.2018.2826362","mag":"2802507231"},"language":"en","primary_location":{"id":"doi:10.1109/tase.2018.2826362","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tase.2018.2826362","pdf_url":null,"source":{"id":"https://openalex.org/S34881539","display_name":"IEEE Transactions on Automation Science and Engineering","issn_l":"1545-5955","issn":["1545-5955","1558-3783"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Automation Science and Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083153534","display_name":"Kok-Meng Lee","orcid":"https://orcid.org/0000-0002-9547-094X"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Kok-Meng Lee","raw_affiliation_strings":["George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101914685","display_name":"Yang Huang","orcid":"https://orcid.org/0000-0002-1788-9120"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Huang","raw_affiliation_strings":["State Key Laboratory of Digital Manufacturing and Equipment Technology, and School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Digital Manufacturing and Equipment Technology, and School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101747141","display_name":"Jingjing Ji","orcid":"https://orcid.org/0000-0001-5179-0274"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jingjing Ji","raw_affiliation_strings":["State Key Laboratory of Digital Manufacturing and Equipment Technology, and School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Digital Manufacturing and Equipment Technology, and School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5018843146","display_name":"Chun-Yeon Lin","orcid":"https://orcid.org/0000-0003-4585-5881"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chun-Yeon Lin","raw_affiliation_strings":["George W. Woodruff School of Mechanical Engneering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"George W. Woodruff School of Mechanical Engneering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5083153534"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":1.9426,"has_fulltext":false,"cited_by_count":26,"citation_normalized_percentile":{"value":0.8364486,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":99},"biblio":{"volume":"15","issue":"4","first_page":"1665","last_page":"1676"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.6888620257377625},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.526518702507019},{"id":"https://openalex.org/keywords/thermography","display_name":"Thermography","score":0.4812638461589813},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.4783605933189392},{"id":"https://openalex.org/keywords/field","display_name":"Field (mathematics)","score":0.45910337567329407},{"id":"https://openalex.org/keywords/infrared","display_name":"Infrared","score":0.4518274664878845},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.4447854459285736},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.44155025482177734},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.4346785247325897},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.41178983449935913},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.4087413251399994},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.39626437425613403},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3857155740261078},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.3418545424938202},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3198447823524475},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.23034712672233582},{"id":"https://openalex.org/keywords/contact-angle","display_name":"Contact angle","score":0.18320971727371216},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.14511865377426147},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.14156684279441833},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.14100268483161926},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.13815513253211975}],"concepts":[{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.6888620257377625},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.526518702507019},{"id":"https://openalex.org/C2779222261","wikidata":"https://www.wikidata.org/wiki/Q624587","display_name":"Thermography","level":3,"score":0.4812638461589813},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.4783605933189392},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.45910337567329407},{"id":"https://openalex.org/C158355884","wikidata":"https://www.wikidata.org/wiki/Q11388","display_name":"Infrared","level":2,"score":0.4518274664878845},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.4447854459285736},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.44155025482177734},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.4346785247325897},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.41178983449935913},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.4087413251399994},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.39626437425613403},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3857155740261078},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.3418545424938202},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3198447823524475},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.23034712672233582},{"id":"https://openalex.org/C6556556","wikidata":"https://www.wikidata.org/wiki/Q899239","display_name":"Contact angle","level":2,"score":0.18320971727371216},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.14511865377426147},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.14156684279441833},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.14100268483161926},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.13815513253211975},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C54517805","wikidata":"https://www.wikidata.org/wiki/Q7456118","display_name":"Sessile drop technique","level":3,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tase.2018.2826362","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tase.2018.2826362","pdf_url":null,"source":{"id":"https://openalex.org/S34881539","display_name":"IEEE Transactions on Automation Science and Engineering","issn_l":"1545-5955","issn":["1545-5955","1558-3783"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Automation Science and Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G3978112669","display_name":null,"funder_award_id":"51505168","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8296094997","display_name":null,"funder_award_id":"2013CB035803","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G8417142931","display_name":null,"funder_award_id":"CMMI-1662700","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":33,"referenced_works":["https://openalex.org/W1592140515","https://openalex.org/W1965220308","https://openalex.org/W1974119203","https://openalex.org/W1974310882","https://openalex.org/W1995180252","https://openalex.org/W2001913072","https://openalex.org/W2013505487","https://openalex.org/W2014527527","https://openalex.org/W2040426636","https://openalex.org/W2062180331","https://openalex.org/W2065658267","https://openalex.org/W2066599148","https://openalex.org/W2075190370","https://openalex.org/W2084682650","https://openalex.org/W2085401028","https://openalex.org/W2086409190","https://openalex.org/W2087070363","https://openalex.org/W2088886701","https://openalex.org/W2114603952","https://openalex.org/W2116966446","https://openalex.org/W2156311656","https://openalex.org/W2324140550","https://openalex.org/W2469309222","https://openalex.org/W2471613230","https://openalex.org/W2524779692","https://openalex.org/W2558062258","https://openalex.org/W2569157906","https://openalex.org/W2739030331","https://openalex.org/W2800729783","https://openalex.org/W4239682791","https://openalex.org/W6635379646","https://openalex.org/W6727172626","https://openalex.org/W6742221324"],"related_works":["https://openalex.org/W4310007303","https://openalex.org/W2224543647","https://openalex.org/W35959284","https://openalex.org/W2286188758","https://openalex.org/W2141980482","https://openalex.org/W2900544575","https://openalex.org/W4391030883","https://openalex.org/W2513461979","https://openalex.org/W4255358997","https://openalex.org/W2946143309"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"an":[3,60,164],"efficient":[4],"method,":[5],"which":[6],"reconstructs":[7],"the":[8,12,23,28,46,50,70,75,86,110,127,157],"temperature":[9,26,33,113,158],"field":[10,34,43,58],"around":[11],"tool/chip":[13],"interface":[14],"from":[15,85],"infrared":[16],"(IR)":[17],"thermal":[18],"images,":[19],"for":[20,44,69],"online":[21],"monitoring":[22,159],"internal":[24],"peak":[25],"of":[27,96,156],"cutting":[29],"tool.":[30],"The":[31,94,119,153],"tool":[32,51,171],"is":[35,65,161],"divided":[36],"into":[37],"two":[38],"regions;":[39],"namely,":[40],"a":[41,56,137,142,169],"far":[42],"solving":[45],"heat-transfer":[47],"coefficient":[48],"between":[49],"and":[52,55,106,117],"ambient":[53],"temperature,":[54],"near":[57],"where":[59],"artificial":[61],"neural":[62],"network":[63],"(ANN)":[64],"trained":[66],"to":[67,80],"account":[68],"unknown":[71],"heat":[72,104],"variations":[73],"at":[74],"frictional":[76],"contact":[77,103,112],"interface.":[78],"Methods":[79],"extract":[81],"physics-based":[82],"feature":[83,99],"points":[84],"IR":[87,139],"image":[88,97],"as":[89,145,147],"ANN":[90],"inputs":[91],"are":[92,114],"discussed.":[93],"effects":[95],"resolution,":[98],"selection,":[100],"chip":[101],"occlusion,":[102],"variation,":[105],"measurement":[107],"noises":[108],"on":[109,141,163],"estimated":[111],"analyzed":[115],"numerically":[116,148],"experimentally.":[118],"proposed":[120],"method":[121,160],"has":[122],"been":[123],"verified":[124],"by":[125],"comparing":[126],"ANN-estimated":[128],"surface":[129],"temperatures":[130],"against":[131],"\u201ctrue":[132],"values\u201d":[133],"experimentally":[134],"obtained":[135],"using":[136,150],"high-resolution":[138],"imager":[140],"custom-designed":[143],"testbed":[144],"well":[146],"simulated":[149],"finite-element":[151],"analysis.":[152],"concept":[154],"feasibility":[155],"demonstrated":[162],"industrial":[165],"lathe-turning":[166],"center":[167],"with":[168],"commercial":[170],"insert.":[172]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":5},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}