{"id":"https://openalex.org/W2529908109","doi":"https://doi.org/10.1109/tase.2016.2608955","title":"Prescriptive Modeling and Compensation of In-Plane Shape Deformation for 3-D Printed Freeform Products","display_name":"Prescriptive Modeling and Compensation of In-Plane Shape Deformation for 3-D Printed Freeform Products","publication_year":2016,"publication_date":"2016-10-11","ids":{"openalex":"https://openalex.org/W2529908109","doi":"https://doi.org/10.1109/tase.2016.2608955","mag":"2529908109"},"language":"en","primary_location":{"id":"doi:10.1109/tase.2016.2608955","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tase.2016.2608955","pdf_url":null,"source":{"id":"https://openalex.org/S34881539","display_name":"IEEE Transactions on Automation Science and Engineering","issn_l":"1545-5955","issn":["1545-5955","1558-3783"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Automation Science and Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5053268237","display_name":"He Luan","orcid":null},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"He Luan","raw_affiliation_strings":["Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I1174212"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088889300","display_name":"Qiang Huang","orcid":"https://orcid.org/0000-0001-7826-4792"},"institutions":[{"id":"https://openalex.org/I1174212","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60","country_code":"US","type":"education","lineage":["https://openalex.org/I1174212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Qiang Huang","raw_affiliation_strings":["Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Industrial and Systems Engineering, University of Southern California, Los Angeles, CA, USA","institution_ids":["https://openalex.org/I1174212"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5053268237"],"corresponding_institution_ids":["https://openalex.org/I1174212"],"apc_list":null,"apc_paid":null,"fwci":4.6638,"has_fulltext":false,"cited_by_count":55,"citation_normalized_percentile":{"value":0.94688123,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":99},"biblio":{"volume":"14","issue":"1","first_page":"73","last_page":"82"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stereolithography","display_name":"Stereolithography","score":0.9178314208984375},{"id":"https://openalex.org/keywords/compensation","display_name":"Compensation (psychology)","score":0.6948901414871216},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.5701207518577576},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.543343186378479},{"id":"https://openalex.org/keywords/polyhedron","display_name":"Polyhedron","score":0.5357723832130432},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.5321005582809448},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.5242193937301636},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5115042924880981},{"id":"https://openalex.org/keywords/plane","display_name":"Plane (geometry)","score":0.48163002729415894},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.47958818078041077},{"id":"https://openalex.org/keywords/free-form-deformation","display_name":"Free-form deformation","score":0.4608423709869385},{"id":"https://openalex.org/keywords/geometric-shape","display_name":"Geometric shape","score":0.45900461077690125},{"id":"https://openalex.org/keywords/cylinder","display_name":"Cylinder","score":0.43357905745506287},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.4301186203956604},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3015668988227844},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.18357273936271667},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.11576268076896667},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.10097232460975647}],"concepts":[{"id":"https://openalex.org/C2779154291","wikidata":"https://www.wikidata.org/wiki/Q1022471","display_name":"Stereolithography","level":2,"score":0.9178314208984375},{"id":"https://openalex.org/C2780023022","wikidata":"https://www.wikidata.org/wiki/Q1338171","display_name":"Compensation (psychology)","level":2,"score":0.6948901414871216},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.5701207518577576},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.543343186378479},{"id":"https://openalex.org/C54829058","wikidata":"https://www.wikidata.org/wiki/Q172937","display_name":"Polyhedron","level":2,"score":0.5357723832130432},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.5321005582809448},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.5242193937301636},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5115042924880981},{"id":"https://openalex.org/C17825722","wikidata":"https://www.wikidata.org/wiki/Q17285","display_name":"Plane (geometry)","level":2,"score":0.48163002729415894},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.47958818078041077},{"id":"https://openalex.org/C2780391921","wikidata":"https://www.wikidata.org/wiki/Q1454193","display_name":"Free-form deformation","level":3,"score":0.4608423709869385},{"id":"https://openalex.org/C7305733","wikidata":"https://www.wikidata.org/wiki/Q207961","display_name":"Geometric shape","level":2,"score":0.45900461077690125},{"id":"https://openalex.org/C203311528","wikidata":"https://www.wikidata.org/wiki/Q34132","display_name":"Cylinder","level":2,"score":0.43357905745506287},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.4301186203956604},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3015668988227844},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.18357273936271667},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.11576268076896667},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.10097232460975647},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0},{"id":"https://openalex.org/C11171543","wikidata":"https://www.wikidata.org/wiki/Q41630","display_name":"Psychoanalysis","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tase.2016.2608955","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tase.2016.2608955","pdf_url":null,"source":{"id":"https://openalex.org/S34881539","display_name":"IEEE Transactions on Automation Science and Engineering","issn_l":"1545-5955","issn":["1545-5955","1558-3783"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Automation Science and Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4399999976158142,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[{"id":"https://openalex.org/G4144983191","display_name":null,"funder_award_id":"CMMI-1333550","funder_id":"https://openalex.org/F4320306076","funder_display_name":"National Science Foundation"}],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320308668","display_name":"University of Southern California","ror":"https://ror.org/03taz7m60"},{"id":"https://openalex.org/F4320327471","display_name":"China Aerospace Science and Technology Corporation","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":34,"referenced_works":["https://openalex.org/W618308785","https://openalex.org/W1585777635","https://openalex.org/W1586219442","https://openalex.org/W1970597525","https://openalex.org/W1983579396","https://openalex.org/W1984108360","https://openalex.org/W1985828105","https://openalex.org/W2002817321","https://openalex.org/W2002882252","https://openalex.org/W2006609100","https://openalex.org/W2008987433","https://openalex.org/W2009729739","https://openalex.org/W2019112365","https://openalex.org/W2023185035","https://openalex.org/W2030679944","https://openalex.org/W2034489870","https://openalex.org/W2041008276","https://openalex.org/W2045295108","https://openalex.org/W2046303963","https://openalex.org/W2072719868","https://openalex.org/W2090451920","https://openalex.org/W2093599714","https://openalex.org/W2100232638","https://openalex.org/W2131328806","https://openalex.org/W2134967127","https://openalex.org/W2135542662","https://openalex.org/W2142721422","https://openalex.org/W2147203632","https://openalex.org/W2191746746","https://openalex.org/W2210796340","https://openalex.org/W2277411090","https://openalex.org/W2345286239","https://openalex.org/W3101408490","https://openalex.org/W4235054673"],"related_works":["https://openalex.org/W2384464911","https://openalex.org/W2029991833","https://openalex.org/W2371826068","https://openalex.org/W2516537537","https://openalex.org/W2319893025","https://openalex.org/W2571624776","https://openalex.org/W2388794022","https://openalex.org/W4240258517","https://openalex.org/W2598524437","https://openalex.org/W4253173689"],"abstract_inverted_index":{"Although":[0],"3-D":[1],"printing":[2,153],"or":[3],"additive":[4],"manufacturing":[5,13],"(AM)":[6],"holds":[7],"great":[8],"promise":[9],"as":[10],"a":[11,23,51,93,119,160],"direct":[12],"technology,":[14],"the":[15,41,68,72,78,111,138,148],"geometric":[16,32,84],"accuracy":[17,42,154],"of":[18,43,53,86,96,150,155,162],"AM":[19,44,63,87,163],"built":[20,45,88,158],"products":[21,29,90,157],"remains":[22],"critical":[24],"issue,":[25],"especially":[26],"for":[27,110],"freeform":[28,46,89,125],"with":[30],"complex":[31],"shapes.":[33,99],"Efforts":[34],"have":[35],"long":[36],"been":[37],"attempted":[38],"to":[39,59,74],"improve":[40],"products.":[47],"But":[48],"there":[49],"is":[50],"lack":[52],"generic":[54],"and":[55,62,76,106,113,142],"prescriptive":[56,140],"methodology":[57,73],"transparent":[58],"specific":[60],"designs":[61],"processes.":[64,164],"This":[65,145],"paper":[66,117,146],"fills":[67],"gap":[69],"by":[70,121,159],"establishing":[71],"predict":[75],"compensate":[77],"in-plane":[79],"(x":[80],"-":[81],"y":[82],"plane)":[83],"deformation":[85,127],"based":[91],"on":[92],"limited":[94],"number":[95],"simple":[97],"trial":[98],"Built":[100],"upon":[101],"our":[102],"previous":[103],"predictive":[104],"model":[105],"optimal":[107],"compensation":[108,143],"study":[109],"cylinder":[112],"polyhedron":[114],"shapes,":[115],"this":[116],"makes":[118],"breakthrough":[120],"directly":[122],"controlling":[123],"arbitrary":[124,156],"shape":[126],"from":[128],"computer-aided":[129],"design.":[130],"Experimental":[131],"investigation":[132],"using":[133],"stereolithography":[134],"process":[135],"successfully":[136],"validates":[137],"proposed":[139],"modeling":[141],"methodology.":[144],"provides":[147],"prospect":[149],"proactively":[151],"improving":[152],"variety":[161]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":12},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":6},{"year":2020,"cited_by_count":7},{"year":2019,"cited_by_count":8},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":5}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}