{"id":"https://openalex.org/W1965364801","doi":"https://doi.org/10.1109/tase.2013.2260739","title":"Magnetic Self-Assembly of Ultra-Thin Chips to Polymer Foils","display_name":"Magnetic Self-Assembly of Ultra-Thin Chips to Polymer Foils","publication_year":2013,"publication_date":"2013-05-14","ids":{"openalex":"https://openalex.org/W1965364801","doi":"https://doi.org/10.1109/tase.2013.2260739","mag":"1965364801"},"language":"en","primary_location":{"id":"doi:10.1109/tase.2013.2260739","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tase.2013.2260739","pdf_url":null,"source":{"id":"https://openalex.org/S34881539","display_name":"IEEE Transactions on Automation Science and Engineering","issn_l":"1545-5955","issn":["1545-5955","1558-3783"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Automation Science and Engineering","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079591380","display_name":"Emine Eda Kuran","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Emine Eda Kuran","raw_affiliation_strings":["Micro and Nano Engineering Laboratory, Faculty of Mechanical, Maritime and Materials Engineering, Delft University of Technology, Delft, The Netherlands","Micro & Nano Eng. Lab., Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micro and Nano Engineering Laboratory, Faculty of Mechanical, Maritime and Materials Engineering, Delft University of Technology, Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Micro & Nano Eng. Lab., Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049247562","display_name":"Marcel Tichem","orcid":"https://orcid.org/0000-0001-6441-5748"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Marcel Tichem","raw_affiliation_strings":["Micro and Nano Engineering Laboratory, Faculty of Mechanical, Maritime and Materials Engineering, Delft University of Technology, Delft, The Netherlands","Micro & Nano Eng. Lab., Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Micro and Nano Engineering Laboratory, Faculty of Mechanical, Maritime and Materials Engineering, Delft University of Technology, Delft, The Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Micro & Nano Eng. Lab., Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.0735,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.8570438,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"10","issue":"3","first_page":"536","last_page":"544"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11486","display_name":"Micro and Nano Robotics","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7718937397003174},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7638025283813477},{"id":"https://openalex.org/keywords/magnetic-field","display_name":"Magnetic field","score":0.5389910340309143},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.48660099506378174},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.4501851797103882},{"id":"https://openalex.org/keywords/viscosity","display_name":"Viscosity","score":0.44972115755081177},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.43787139654159546},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.413252592086792},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.32452261447906494},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3234379291534424},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2510493993759155},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.1656716763973236},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1331048309803009},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09525874257087708}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7718937397003174},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7638025283813477},{"id":"https://openalex.org/C115260700","wikidata":"https://www.wikidata.org/wiki/Q11408","display_name":"Magnetic field","level":2,"score":0.5389910340309143},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.48660099506378174},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.4501851797103882},{"id":"https://openalex.org/C127172972","wikidata":"https://www.wikidata.org/wiki/Q128709","display_name":"Viscosity","level":2,"score":0.44972115755081177},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.43787139654159546},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.413252592086792},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.32452261447906494},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3234379291534424},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2510493993759155},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.1656716763973236},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1331048309803009},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09525874257087708},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/tase.2013.2260739","is_oa":false,"landing_page_url":"https://doi.org/10.1109/tase.2013.2260739","pdf_url":null,"source":{"id":"https://openalex.org/S34881539","display_name":"IEEE Transactions on Automation Science and Engineering","issn_l":"1545-5955","issn":["1545-5955","1558-3783"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Automation Science and Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W157852784","https://openalex.org/W1967749295","https://openalex.org/W1970010192","https://openalex.org/W2005084662","https://openalex.org/W2005819989","https://openalex.org/W2015023149","https://openalex.org/W2025087687","https://openalex.org/W2025756861","https://openalex.org/W2038211564","https://openalex.org/W2052596355","https://openalex.org/W2064668222","https://openalex.org/W2069507241","https://openalex.org/W2078493768","https://openalex.org/W2079328849","https://openalex.org/W2086185047","https://openalex.org/W2106226759","https://openalex.org/W2111194392","https://openalex.org/W2113894085","https://openalex.org/W2120974428","https://openalex.org/W2123655860","https://openalex.org/W2126213769","https://openalex.org/W2132738978","https://openalex.org/W2148477962","https://openalex.org/W2159315069","https://openalex.org/W2160938906","https://openalex.org/W2167176844","https://openalex.org/W2167599813","https://openalex.org/W2169523596"],"related_works":["https://openalex.org/W2371309082","https://openalex.org/W2384401620","https://openalex.org/W2043947924","https://openalex.org/W2389568614","https://openalex.org/W2383439850","https://openalex.org/W4205876811","https://openalex.org/W4361799126","https://openalex.org/W2628640760","https://openalex.org/W2509006425","https://openalex.org/W2018755015"],"abstract_inverted_index":{"A":[0,40],"self-assembly":[1],"process":[2],"is":[3,52,148,176],"developed":[4],"for":[5],"the":[6,22,67,83,143,158,161,173],"placement":[7],"and":[8,30,34,51,101,130,140,142],"alignment":[9,85],"of":[10,25,124,135,160,167],"Ultra-Thin":[11],"Chips":[12],"(UTCs)":[13],"to":[14,33,56,81,104],"polymer":[15],"foils.":[16],"The":[17,152,165],"chips":[18,120],"are":[19],"presented":[20],"within":[21],"working":[23],"range":[24,94],"a":[26,37,58,92,99,105,115,122,133],"magnetic":[27,95],"force":[28],"field,":[29],"subsequently":[31],"driven":[32],"aligned":[35,131],"at":[36],"target":[38,106],"location.":[39,107],"low-viscosity":[41],"die":[42,162],"attach":[43,163],"adhesive":[44],"layer":[45],"supports":[46,113],"chip":[47,100],"mobility":[48],"during":[49],"alignment,":[50],"UV-cured":[53],"after":[54,71],"assembly":[55],"generate":[57,82],"mechanical":[59],"bond.":[60],"An":[61],"adaptive":[62],"electrical":[63],"interconnection":[64],"scheme":[65],"compensates":[66],"position":[68],"errors":[69],"present":[70],"assembly.":[72],"Standard":[73],"Ni":[74],"+":[75],"Au":[76],"bumps":[77],"provide":[78],"sufficient":[79],"magnetization":[80],"required":[84],"force.":[86],"Numerical":[87],"modeling":[88],"confirms":[89],"that":[90],"over":[91],"long":[93],"forces":[96],"operate":[97],"on":[98,157,172],"drive":[102],"it":[103],"Also,":[108],"an":[109],"asymmetric":[110],"bump":[111,174],"arrangement":[112],"achieving":[114],"unique":[116,168],"in-plane":[117,169],"orientation.":[118],"Experimentally,":[119],"with":[121,132],"thickness":[123],"20":[125],"\u03bcm":[126,137],"were":[127],"successfully":[128],"trapped":[129],"repeatability":[134],"\u00b1100":[136],"in":[138],"x":[139],"y-direction,":[141],"best":[144],"achieved":[145],"cycle":[146,153],"time":[147,154],"below":[149],"1.0":[150],"s.":[151],"depends":[155],"considerably":[156],"viscosity":[159],"adhesive.":[164],"presence":[166],"orientations,":[170],"depending":[171],"arrangement,":[175],"demonstrated.":[177]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":3}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}