{"id":"https://openalex.org/W4285282901","doi":"https://doi.org/10.1109/taes.2022.3181117","title":"MicroCrack-Net: A Deep Neural Network With Outline Profile-Guided Feature Augmentation and Attention-Based Multiscale Fusion for MicroCrack Detection of Tantalum Capacitors","display_name":"MicroCrack-Net: A Deep Neural Network With Outline Profile-Guided Feature Augmentation and Attention-Based Multiscale Fusion for MicroCrack Detection of Tantalum Capacitors","publication_year":2022,"publication_date":"2022-06-08","ids":{"openalex":"https://openalex.org/W4285282901","doi":"https://doi.org/10.1109/taes.2022.3181117"},"language":"en","primary_location":{"id":"doi:10.1109/taes.2022.3181117","is_oa":false,"landing_page_url":"https://doi.org/10.1109/taes.2022.3181117","pdf_url":null,"source":{"id":"https://openalex.org/S193624734","display_name":"IEEE Transactions on Aerospace and Electronic Systems","issn_l":"0018-9251","issn":["0018-9251","1557-9603","2371-9877"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Aerospace and Electronic Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052120592","display_name":"Mingyang Cheng","orcid":null},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Mingyang Cheng","raw_affiliation_strings":["Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064385040","display_name":"Chuqiao Xu","orcid":"https://orcid.org/0000-0001-5611-2990"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chuqiao Xu","raw_affiliation_strings":["Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026626611","display_name":"Junliang Wang","orcid":"https://orcid.org/0000-0003-0558-8598"},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junliang Wang","raw_affiliation_strings":["Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100447801","display_name":"Wenjun Zhang","orcid":"https://orcid.org/0000-0001-7973-8769"},"institutions":[{"id":"https://openalex.org/I32625721","display_name":"University of Saskatchewan","ror":"https://ror.org/010x8gc63","country_code":"CA","type":"education","lineage":["https://openalex.org/I32625721"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Wenjun Zhang","raw_affiliation_strings":["Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, Canada"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, Canada","institution_ids":["https://openalex.org/I32625721"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010280426","display_name":"Yaqin Zhou","orcid":"https://orcid.org/0000-0003-3788-8122"},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yaqin Zhou","raw_affiliation_strings":["Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100436775","display_name":"Jie Zhang","orcid":"https://orcid.org/0000-0002-6215-0237"},"institutions":[{"id":"https://openalex.org/I181326427","display_name":"Donghua University","ror":"https://ror.org/035psfh38","country_code":"CN","type":"education","lineage":["https://openalex.org/I181326427"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Zhang","raw_affiliation_strings":["Donghua University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Donghua University, Shanghai, China","institution_ids":["https://openalex.org/I181326427"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5052120592"],"corresponding_institution_ids":["https://openalex.org/I181326427"],"apc_list":null,"apc_paid":null,"fwci":1.5658,"has_fulltext":false,"cited_by_count":17,"citation_normalized_percentile":{"value":0.80587972,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"58","issue":"6","first_page":"5141","last_page":"5152"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12169","display_name":"Non-Destructive Testing Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11606","display_name":"Infrastructure Maintenance and Monitoring","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/feature-extraction","display_name":"Feature extraction","score":0.6572983264923096},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.625291109085083},{"id":"https://openalex.org/keywords/convolutional-neural-network","display_name":"Convolutional neural network","score":0.6034307479858398},{"id":"https://openalex.org/keywords/feature","display_name":"Feature (linguistics)","score":0.5860664248466492},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.575045108795166},{"id":"https://openalex.org/keywords/pattern-recognition","display_name":"Pattern recognition (psychology)","score":0.5628087520599365},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5228962302207947},{"id":"https://openalex.org/keywords/image-fusion","display_name":"Image fusion","score":0.4658679962158203},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4655376672744751},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.45674294233322144},{"id":"https://openalex.org/keywords/artificial-neural-network","display_name":"Artificial neural network","score":0.45106297731399536},{"id":"https://openalex.org/keywords/tantalum","display_name":"Tantalum","score":0.44204720854759216},{"id":"https://openalex.org/keywords/pooling","display_name":"Pooling","score":0.4303463101387024},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3836904764175415},{"id":"https://openalex.org/keywords/computer-vision","display_name":"Computer vision","score":0.3290718197822571},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.314484179019928},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.23413601517677307},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20675107836723328},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.10865858197212219},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09517678618431091}],"concepts":[{"id":"https://openalex.org/C52622490","wikidata":"https://www.wikidata.org/wiki/Q1026626","display_name":"Feature extraction","level":2,"score":0.6572983264923096},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.625291109085083},{"id":"https://openalex.org/C81363708","wikidata":"https://www.wikidata.org/wiki/Q17084460","display_name":"Convolutional neural network","level":2,"score":0.6034307479858398},{"id":"https://openalex.org/C2776401178","wikidata":"https://www.wikidata.org/wiki/Q12050496","display_name":"Feature (linguistics)","level":2,"score":0.5860664248466492},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.575045108795166},{"id":"https://openalex.org/C153180895","wikidata":"https://www.wikidata.org/wiki/Q7148389","display_name":"Pattern recognition (psychology)","level":2,"score":0.5628087520599365},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5228962302207947},{"id":"https://openalex.org/C69744172","wikidata":"https://www.wikidata.org/wiki/Q860822","display_name":"Image fusion","level":3,"score":0.4658679962158203},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4655376672744751},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.45674294233322144},{"id":"https://openalex.org/C50644808","wikidata":"https://www.wikidata.org/wiki/Q192776","display_name":"Artificial neural network","level":2,"score":0.45106297731399536},{"id":"https://openalex.org/C514619126","wikidata":"https://www.wikidata.org/wiki/Q1123","display_name":"Tantalum","level":2,"score":0.44204720854759216},{"id":"https://openalex.org/C70437156","wikidata":"https://www.wikidata.org/wiki/Q7228652","display_name":"Pooling","level":2,"score":0.4303463101387024},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3836904764175415},{"id":"https://openalex.org/C31972630","wikidata":"https://www.wikidata.org/wiki/Q844240","display_name":"Computer vision","level":1,"score":0.3290718197822571},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.314484179019928},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.23413601517677307},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20675107836723328},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.10865858197212219},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09517678618431091},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/taes.2022.3181117","is_oa":false,"landing_page_url":"https://doi.org/10.1109/taes.2022.3181117","pdf_url":null,"source":{"id":"https://openalex.org/S193624734","display_name":"IEEE Transactions on Aerospace and Electronic Systems","issn_l":"0018-9251","issn":["0018-9251","1557-9603","2371-9877"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Transactions on Aerospace and Electronic Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G7001259432","display_name":null,"funder_award_id":"51905091","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8520785280","display_name":null,"funder_award_id":"20CG41","funder_id":"https://openalex.org/F4320321881","funder_display_name":"Shanghai Municipal Education Commission"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321659","display_name":"Shanghai Education Development Foundation","ror":"https://ror.org/02kq92y46"},{"id":"https://openalex.org/F4320321881","display_name":"Shanghai Municipal Education Commission","ror":"https://ror.org/05tewj457"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":49,"referenced_works":["https://openalex.org/W1536680647","https://openalex.org/W1686810756","https://openalex.org/W1826654109","https://openalex.org/W1903029394","https://openalex.org/W1914562277","https://openalex.org/W1963857321","https://openalex.org/W1971100300","https://openalex.org/W2033294017","https://openalex.org/W2033318022","https://openalex.org/W2062658581","https://openalex.org/W2076844371","https://openalex.org/W2126264453","https://openalex.org/W2144801789","https://openalex.org/W2194775991","https://openalex.org/W2216559353","https://openalex.org/W2407692387","https://openalex.org/W2511065100","https://openalex.org/W2549139847","https://openalex.org/W2618530766","https://openalex.org/W2786174052","https://openalex.org/W2794732825","https://openalex.org/W2800240267","https://openalex.org/W2886415518","https://openalex.org/W2899242765","https://openalex.org/W2908667960","https://openalex.org/W2910798558","https://openalex.org/W2912350898","https://openalex.org/W2913580266","https://openalex.org/W2917531299","https://openalex.org/W2920768970","https://openalex.org/W2923486253","https://openalex.org/W2963037989","https://openalex.org/W2963420686","https://openalex.org/W2963446712","https://openalex.org/W2971843891","https://openalex.org/W2996977448","https://openalex.org/W3010717703","https://openalex.org/W3013984308","https://openalex.org/W3024418937","https://openalex.org/W3046313223","https://openalex.org/W3087089863","https://openalex.org/W3093870111","https://openalex.org/W3104156061","https://openalex.org/W3113005610","https://openalex.org/W3113371083","https://openalex.org/W3165938138","https://openalex.org/W4226093122","https://openalex.org/W6637373629","https://openalex.org/W6747842307"],"related_works":["https://openalex.org/W2953234277","https://openalex.org/W1528583601","https://openalex.org/W4205596140","https://openalex.org/W1984807757","https://openalex.org/W2100413076","https://openalex.org/W4247206500","https://openalex.org/W2042834330","https://openalex.org/W3136814059","https://openalex.org/W2626256601","https://openalex.org/W2479646687"],"abstract_inverted_index":{"The":[0,163],"microcrack":[1,21,36,89,102],"defect":[2,139],"in":[3,28,42,118,141,157,185],"the":[4,8,13,17,20,29,32,35,40,43,52,57,62,88,95,115,119,131,134,142,155,160,168],"terminal":[5,58],"electrode":[6],"of":[7,16,34,54,64,111,133,159],"tantalum":[9],"capacitor":[10],"seriously":[11],"affects":[12],"service":[14],"life":[15],"capacitor.":[18],"However,":[19],"displays":[22],"low":[23],"contrast":[24],"and":[25,39,78,149,173,183],"large":[26],"noises":[27],"image.":[30],"Meanwhile,":[31],"width":[33],"is":[37,45,91,127,171],"small,":[38],"area":[41],"image":[44,143],"tiny,":[46],"which":[47],"brings":[48],"additional":[49],"challenges":[50],"to":[51,93,99,107,129,137,153],"detection":[53,71,135],"microcracks":[55],"on":[56],"electrodes.":[59],"To":[60],"improve":[61],"performance":[63,176],"detecting":[65,186],"microcracks,":[66],"this":[67,86],"article":[68],"proposes":[69],"a":[70],"model":[72,136,170],"with":[73,83,144],"outline":[74,90],"profile-guided":[75],"feature":[76,97,147],"augmentation":[77],"attention-based":[79],"multiscale":[80],"fusion,":[81],"titled":[82],"MicroCrack-Net.":[84],"In":[85],"method,":[87],"utilized":[92],"guide":[94],"lossless":[96],"extraction":[98,148],"strengthen":[100],"unobvious":[101],"features":[103],"without":[104],"pooling":[105],"operation":[106],"avoid":[108],"information":[109],"loss":[110],"tiny":[112],"defects":[113],"during":[114],"layer-by-layer":[116],"processing":[117],"convolutional":[120],"neural":[121],"network.":[122],"A":[123],"gradual":[124],"attention":[125,132],"mechanism":[126],"proposed":[128,169],"attract":[130],"local":[138],"areas":[140],"noises.":[145],"Multiscale":[146],"fusion":[150],"are":[151],"designed":[152],"process":[154],"data":[156],"tensors":[158],"same":[161],"size.":[162],"experimental":[164],"results":[165],"demonstrated":[166],"that":[167],"effective":[172],"has":[174],"superior":[175],"over":[177],"VGG16,":[178],"resNet50,":[179],"resNext50,":[180],"DenseNet,":[181],"Racki-Net,":[182],"SegDecNet":[184],"microcracks.":[187]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}