{"id":"https://openalex.org/W2010890382","doi":"https://doi.org/10.1109/ssd.2013.6564151","title":"Conductive behavior modeling of dual-axis CMOS MEMS convective accelerometers using 3D FEM and spherical model","display_name":"Conductive behavior modeling of dual-axis CMOS MEMS convective accelerometers using 3D FEM and spherical model","publication_year":2013,"publication_date":"2013-03-01","ids":{"openalex":"https://openalex.org/W2010890382","doi":"https://doi.org/10.1109/ssd.2013.6564151","mag":"2010890382"},"language":"en","primary_location":{"id":"doi:10.1109/ssd.2013.6564151","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ssd.2013.6564151","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th International Multi-Conferences on Systems, Signals & Devices 2013 (SSD13)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041691169","display_name":"Brahim Mezghani","orcid":"https://orcid.org/0000-0002-6626-9817"},"institutions":[{"id":"https://openalex.org/I142899784","display_name":"University of Sfax","ror":"https://ror.org/04d4sd432","country_code":"TN","type":"education","lineage":["https://openalex.org/I142899784"]}],"countries":["TN"],"is_corresponding":true,"raw_author_name":"B. Mezghani","raw_affiliation_strings":["Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia"],"affiliations":[{"raw_affiliation_string":"Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]},{"raw_affiliation_string":"Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025205082","display_name":"Far\u00e8s Tounsi","orcid":"https://orcid.org/0000-0002-7130-4007"},"institutions":[{"id":"https://openalex.org/I142899784","display_name":"University of Sfax","ror":"https://ror.org/04d4sd432","country_code":"TN","type":"education","lineage":["https://openalex.org/I142899784"]}],"countries":["TN"],"is_corresponding":false,"raw_author_name":"F. Tounsi","raw_affiliation_strings":["Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia"],"affiliations":[{"raw_affiliation_string":"Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]},{"raw_affiliation_string":"Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043052527","display_name":"H\u00e9la Yaich","orcid":null},"institutions":[{"id":"https://openalex.org/I142899784","display_name":"University of Sfax","ror":"https://ror.org/04d4sd432","country_code":"TN","type":"education","lineage":["https://openalex.org/I142899784"]}],"countries":["TN"],"is_corresponding":false,"raw_author_name":"H. Yaich","raw_affiliation_strings":["Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia"],"affiliations":[{"raw_affiliation_string":"Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]},{"raw_affiliation_string":"Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055124358","display_name":"Mohamed Masmoudi","orcid":"https://orcid.org/0000-0002-1571-4386"},"institutions":[{"id":"https://openalex.org/I142899784","display_name":"University of Sfax","ror":"https://ror.org/04d4sd432","country_code":"TN","type":"education","lineage":["https://openalex.org/I142899784"]}],"countries":["TN"],"is_corresponding":false,"raw_author_name":"M. Masmoudi","raw_affiliation_strings":["Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia"],"affiliations":[{"raw_affiliation_string":"Electronics, Micro-technology and Communication (EMC) Research Group, National Engineering School of Sfax (ENIS), University of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]},{"raw_affiliation_string":"Micro-Technol. & Commun. (EMC) Res. Group, Univ. of Sfax, Sfax, Tunisia","institution_ids":["https://openalex.org/I142899784"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5041691169"],"corresponding_institution_ids":["https://openalex.org/I142899784"],"apc_list":null,"apc_paid":null,"fwci":0.4729,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.68165477,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"141","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9933000206947327,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-conduction","display_name":"Thermal conduction","score":0.7320384383201599},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.676378607749939},{"id":"https://openalex.org/keywords/accelerometer","display_name":"Accelerometer","score":0.6185221672058105},{"id":"https://openalex.org/keywords/radius","display_name":"RADIUS","score":0.6120010614395142},{"id":"https://openalex.org/keywords/convection","display_name":"Convection","score":0.5950872302055359},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.5755507349967957},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.5652459859848022},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5485211610794067},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5418651103973389},{"id":"https://openalex.org/keywords/convective-heat-transfer","display_name":"Convective heat transfer","score":0.46001574397087097},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.4496777057647705},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.3890075981616974},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.24681460857391357},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.23649471998214722},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2195872962474823},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.1638018786907196},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.15069404244422913},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.09344932436943054}],"concepts":[{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.7320384383201599},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.676378607749939},{"id":"https://openalex.org/C89805583","wikidata":"https://www.wikidata.org/wiki/Q192940","display_name":"Accelerometer","level":2,"score":0.6185221672058105},{"id":"https://openalex.org/C178635117","wikidata":"https://www.wikidata.org/wiki/Q747499","display_name":"RADIUS","level":2,"score":0.6120010614395142},{"id":"https://openalex.org/C10899652","wikidata":"https://www.wikidata.org/wiki/Q160329","display_name":"Convection","level":2,"score":0.5950872302055359},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.5755507349967957},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5652459859848022},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5485211610794067},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5418651103973389},{"id":"https://openalex.org/C41231900","wikidata":"https://www.wikidata.org/wiki/Q918227","display_name":"Convective heat transfer","level":3,"score":0.46001574397087097},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.4496777057647705},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3890075981616974},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.24681460857391357},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.23649471998214722},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2195872962474823},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1638018786907196},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.15069404244422913},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.09344932436943054},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ssd.2013.6564151","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ssd.2013.6564151","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th International Multi-Conferences on Systems, Signals & Devices 2013 (SSD13)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5199999809265137,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1483752119","https://openalex.org/W1983851185","https://openalex.org/W2007238733","https://openalex.org/W2057763316","https://openalex.org/W2063998458","https://openalex.org/W2073493507","https://openalex.org/W2140436747","https://openalex.org/W2533143182","https://openalex.org/W6628827098"],"related_works":["https://openalex.org/W2765080098","https://openalex.org/W2385749422","https://openalex.org/W2272290532","https://openalex.org/W2355290145","https://openalex.org/W2353465659","https://openalex.org/W2009888974","https://openalex.org/W3161496874","https://openalex.org/W2026330382","https://openalex.org/W2915680872","https://openalex.org/W2760400221"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"heat":[3,24,62,114],"conduction":[4,25],"modeling":[5,104],"of":[6,23,52,80],"dual":[7],"axis":[8],"micromachined":[9],"convective":[10],"accelerometers.":[11],"Results":[12],"from":[13],"FEM":[14,33],"simulation":[15],"are":[16,30,68,91,105,108,138],"used":[17,31,69,109],"to":[18,75,94,110],"develop":[19,76],"an":[20,77],"analytical":[21,78],"model":[22,74],"main":[26],"parameters.":[27],"Two":[28,100],"variables":[29],"in":[32,70],"simulations:":[34],"heater":[35,113],"temperature":[36],"and":[37,89,98,107,117],"cavity":[38],"depth.":[39],"The":[40,85],"latter":[41],"parameter":[42],"has":[43],"a":[44,71],"large":[45],"impact":[46],"on":[47],"the":[48,58,61,125],"overall":[49,126],"conductive":[50,128],"behavior":[51],"thermal":[53],"accelerometers":[54],"since":[55],"it":[56],"fixes":[57],"volume":[59],"where":[60],"bubble":[63,87],"can":[64],"expand.":[65],"Simulation":[66],"results":[67],"derived":[72,122,136],"spherical":[73],"expression":[79],"outer":[81],"isotherm":[82],"equivalent":[83,102],"radius.":[84],"hot":[86],"radius":[88,103],"form":[90],"closely":[92],"related":[93],"sensor":[95,127,143],"geometry":[96],"parameters":[97],"temperature.":[99],"distinct":[101],"studied":[106],"express":[111],"both":[112],"transfer":[115],"coefficient":[116],"common":[118],"mode.":[119],"These":[120],"physically-based":[121],"expressions":[123,137],"govern":[124],"behavior.":[129],"It":[130],"is":[131],"also":[132],"shown":[133],"that":[134],"these":[135],"still":[139],"valid":[140],"for":[141],"different":[142],"design":[144],"geometries.":[145]},"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}