{"id":"https://openalex.org/W2290752691","doi":"https://doi.org/10.1109/socc.2015.7406993","title":"A novel thermal-aware structure of TSV cluster","display_name":"A novel thermal-aware structure of TSV cluster","publication_year":2015,"publication_date":"2015-09-01","ids":{"openalex":"https://openalex.org/W2290752691","doi":"https://doi.org/10.1109/socc.2015.7406993","mag":"2290752691"},"language":"en","primary_location":{"id":"doi:10.1109/socc.2015.7406993","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2015.7406993","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 28th IEEE International System-on-Chip Conference (SOCC)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084844391","display_name":"Jingyan Fu","orcid":"https://orcid.org/0000-0003-3017-4848"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jingyan Fu","raw_affiliation_strings":["Beijing University of Technology Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing University of Technology Beijing, China","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112107545","display_name":"Ligang Hou","orcid":null},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ligang Hou","raw_affiliation_strings":["Beijing University of Technology Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing University of Technology Beijing, China","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100394108","display_name":"Jinhui Wang","orcid":"https://orcid.org/0009-0000-1584-3631"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jinhui Wang","raw_affiliation_strings":["Beijing University of Technology Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing University of Technology Beijing, China","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101700196","display_name":"Bo L\u00fc","orcid":"https://orcid.org/0000-0003-2688-8602"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Lu","raw_affiliation_strings":["Beijing University of Technology Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing University of Technology Beijing, China","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083004837","display_name":"Wei Zhao","orcid":"https://orcid.org/0000-0002-8590-1988"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Zhao","raw_affiliation_strings":["Beijing University of Technology Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing University of Technology Beijing, China","institution_ids":["https://openalex.org/I37796252"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100397835","display_name":"Yang Yang","orcid":"https://orcid.org/0009-0004-2934-6870"},"institutions":[{"id":"https://openalex.org/I37796252","display_name":"Beijing University of Technology","ror":"https://ror.org/037b1pp87","country_code":"CN","type":"education","lineage":["https://openalex.org/I37796252"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Yang","raw_affiliation_strings":["Beijing University of Technology Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing University of Technology Beijing, China","institution_ids":["https://openalex.org/I37796252"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I37796252"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"406","last_page":"409"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12808","display_name":"Ferroelectric and Negative Capacitance Devices","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cluster","display_name":"Cluster (spacecraft)","score":0.6468332409858704},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5669909119606018},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.47731813788414},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34472090005874634},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.15545806288719177},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12017828226089478},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07598701119422913}],"concepts":[{"id":"https://openalex.org/C164866538","wikidata":"https://www.wikidata.org/wiki/Q367351","display_name":"Cluster (spacecraft)","level":2,"score":0.6468332409858704},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5669909119606018},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.47731813788414},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34472090005874634},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.15545806288719177},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12017828226089478},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07598701119422913}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/socc.2015.7406993","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2015.7406993","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 28th IEEE International System-on-Chip Conference (SOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5299999713897705,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1988844974","https://openalex.org/W2003631910","https://openalex.org/W2010009884","https://openalex.org/W2021517442","https://openalex.org/W2055227209","https://openalex.org/W2129782853","https://openalex.org/W2131673221","https://openalex.org/W2160849628","https://openalex.org/W2162909165","https://openalex.org/W2164024586","https://openalex.org/W3143398174","https://openalex.org/W6647504435","https://openalex.org/W6650955489"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W2898370298","https://openalex.org/W2137437058","https://openalex.org/W4390401159","https://openalex.org/W2744391499","https://openalex.org/W3120461830","https://openalex.org/W4230250635","https://openalex.org/W3041790586"],"abstract_inverted_index":{"Although":[0],"thermal-aware":[1],"TSV":[2,15,40,61,76],"(Through":[3],"Silicon":[4],"Via)":[5],"cluster's":[6,62,77],"behavior":[7],"has":[8],"been":[9,54],"studied":[10],"extensively,":[11],"the":[12,46,58,74,80,91],"structure":[13,38,63,78],"of":[14,39,49,60,83],"cluster,":[16],"which":[17,86],"is":[18,31,42],"also":[19],"important":[20],"to":[21,44,56,89],"thermal":[22,47,65,81,92],"problem":[23],"in":[24,67],"3D":[25,50,68,84],"IC":[26],"(Three":[27],"Dimensional":[28],"Integrate":[29],"Circuit),":[30],"ignored.":[32],"In":[33],"this":[34],"paper,":[35],"a":[36],"novel":[37],"cluster":[41],"proposed":[43,75],"improve":[45],"performance":[48,66,82],"IC.":[51,69],"Models":[52],"have":[53],"established":[55],"study":[57],"effect":[59],"on":[64],"Simulation":[70],"results":[71],"show":[72],"that":[73],"improves":[79],"IC,":[85],"can":[87],"help":[88],"alleviate":[90],"problem.":[93]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}