{"id":"https://openalex.org/W2067780294","doi":"https://doi.org/10.1109/socc.2014.6948948","title":"Cost-optimal design of wireless pre-bonding test framework","display_name":"Cost-optimal design of wireless pre-bonding test framework","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W2067780294","doi":"https://doi.org/10.1109/socc.2014.6948948","mag":"2067780294"},"language":"en","primary_location":{"id":"doi:10.1109/socc.2014.6948948","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2014.6948948","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 27th IEEE International System-on-Chip Conference (SOCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5018046595","display_name":"Unni Chandran","orcid":null},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Unni Chandran","raw_affiliation_strings":["The Center for Advanced Computer Studies, University of Louisiana at Lafayette","[The Center for Advanced Computer Studies, University of Louisiana at Lafayette, USA]"],"affiliations":[{"raw_affiliation_string":"The Center for Advanced Computer Studies, University of Louisiana at Lafayette","institution_ids":["https://openalex.org/I79516672"]},{"raw_affiliation_string":"[The Center for Advanced Computer Studies, University of Louisiana at Lafayette, USA]","institution_ids":["https://openalex.org/I79516672"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100899183","display_name":"Dan Zhao","orcid":"https://orcid.org/0000-0001-9016-5594"},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dan Zhao","raw_affiliation_strings":["The Center for Advanced Computer Studies, University of Louisiana at Lafayette","[The Center for Advanced Computer Studies, University of Louisiana at Lafayette, USA]"],"affiliations":[{"raw_affiliation_string":"The Center for Advanced Computer Studies, University of Louisiana at Lafayette","institution_ids":["https://openalex.org/I79516672"]},{"raw_affiliation_string":"[The Center for Advanced Computer Studies, University of Louisiana at Lafayette, USA]","institution_ids":["https://openalex.org/I79516672"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5018046595"],"corresponding_institution_ids":["https://openalex.org/I79516672"],"apc_list":null,"apc_paid":null,"fwci":0.628,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.73774711,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"324","last_page":"329"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.6821717023849487},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5614562034606934},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5463767647743225},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4482106864452362},{"id":"https://openalex.org/keywords/scheduling","display_name":"Scheduling (production processes)","score":0.44514933228492737},{"id":"https://openalex.org/keywords/exploit","display_name":"Exploit","score":0.4374655783176422},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.4181267321109772},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25904837250709534},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.20776516199111938},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10555171966552734}],"concepts":[{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.6821717023849487},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5614562034606934},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5463767647743225},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4482106864452362},{"id":"https://openalex.org/C206729178","wikidata":"https://www.wikidata.org/wiki/Q2271896","display_name":"Scheduling (production processes)","level":2,"score":0.44514933228492737},{"id":"https://openalex.org/C165696696","wikidata":"https://www.wikidata.org/wiki/Q11287","display_name":"Exploit","level":2,"score":0.4374655783176422},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.4181267321109772},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25904837250709534},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.20776516199111938},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10555171966552734},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.0},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/socc.2014.6948948","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2014.6948948","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 27th IEEE International System-on-Chip Conference (SOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6299999952316284,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W2013679798","https://openalex.org/W2058227699","https://openalex.org/W2068545846","https://openalex.org/W2095709610","https://openalex.org/W2095790208","https://openalex.org/W2100597370","https://openalex.org/W2104522423","https://openalex.org/W2113475058","https://openalex.org/W2116426145","https://openalex.org/W2132155220","https://openalex.org/W2141061687","https://openalex.org/W2143621442","https://openalex.org/W2144149750","https://openalex.org/W2168063067","https://openalex.org/W2295688064","https://openalex.org/W3022359323","https://openalex.org/W3149147135","https://openalex.org/W4205976331","https://openalex.org/W4231021813","https://openalex.org/W4231431893","https://openalex.org/W6676374574","https://openalex.org/W6677637676"],"related_works":["https://openalex.org/W17155033","https://openalex.org/W3207760230","https://openalex.org/W1496222301","https://openalex.org/W2035329725","https://openalex.org/W4312814274","https://openalex.org/W1590307681","https://openalex.org/W2536018345","https://openalex.org/W4285370786","https://openalex.org/W2296488620","https://openalex.org/W2149245348"],"abstract_inverted_index":{"In":[0,33],"a":[1,68,114,144],"three-dimensional":[2],"stacked":[3],"IC":[4],"(3D-SIC),":[5],"pre-bonding":[6,66],"die":[7],"tests":[8],"are":[9,95],"performed":[10],"to":[11,49,121],"test":[12,36,53,71,87,115,124,129,138,147],"different":[13],"functional":[14],"components":[15],"on":[16,25],"dies":[17,29],"as":[18],"the":[19,26,35,57,85,107,123,136,141],"yield":[20],"of":[21,28,110,143],"3D-SIC":[22],"highly":[23],"depends":[24],"quality":[27],"used":[30],"for":[31],"stacking.":[32],"observing":[34],"challenges":[37],"in":[38,75],"pre-bonding,":[39],"contactless":[40],"wireless":[41,70,81,137,146],"probing":[42,82],"using":[43],"inductive":[44],"coupling":[45],"has":[46],"been":[47],"introduced":[48],"provide":[50],"high":[51,62,64],"bandwidth":[52,63],"data":[54],"transfer":[55],"without":[56],"stress-induced":[58],"damage.":[59],"Aiming":[60],"at":[61],"parallel":[65],"test,":[67],"hybrid":[69,86,145],"framework":[72],"is":[73,118],"established":[74],"this":[76],"paper":[77],"by":[78,98],"utilizing":[79],"such":[80],"techniques.":[83],"Under":[84],"framework,":[88],"both":[89],"IP":[90],"cores":[91],"and":[92,102,127,140],"embedded":[93],"TSVs":[94],"tested":[96],"concurrently":[97],"applying":[99],"scan":[100],"methodology":[101],"BIST":[103],"respectively.":[104],"To":[105],"exploit":[106],"performance-cost":[108],"effectiveness":[109],"our":[111],"new":[112],"architecture,":[113],"scheduling":[116],"scheme":[117],"thereby":[119],"proposed":[120],"optimize":[122],"resource":[125],"distribution":[126],"minimize":[128],"application":[130],"time.":[131],"The":[132],"simulation":[133],"study":[134],"demonstrates":[135],"capability":[139],"feasibility":[142],"infrastructure.":[148]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}