{"id":"https://openalex.org/W4240699797","doi":"https://doi.org/10.1109/socc.2014.6948873","title":"Message from program chairs","display_name":"Message from program chairs","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W4240699797","doi":"https://doi.org/10.1109/socc.2014.6948873"},"language":"en","primary_location":{"id":"doi:10.1109/socc.2014.6948873","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2014.6948873","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 27th IEEE International System-on-Chip Conference (SOCC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113668436","display_name":"Thomas Buechner","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Thomas Buechner","raw_affiliation_strings":["IBM, USA"],"affiliations":[{"raw_affiliation_string":"IBM, USA","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5078136344","display_name":"Danella Zhao","orcid":null},"institutions":[{"id":"https://openalex.org/I79516672","display_name":"University of Louisiana at Lafayette","ror":"https://ror.org/01x8rc503","country_code":"US","type":"education","lineage":["https://openalex.org/I2799628689","https://openalex.org/I79516672"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Danella Zhao","raw_affiliation_strings":["University of Louisiana at Lafayette, USA"],"affiliations":[{"raw_affiliation_string":"University of Louisiana at Lafayette, USA","institution_ids":["https://openalex.org/I79516672"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5113668436"],"corresponding_institution_ids":["https://openalex.org/I1341412227"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.36121327,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"vi","last_page":"vii"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.048500001430511475,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.048500001430511475,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.039000000804662704,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13436","display_name":"Space Technology and Applications","score":0.03099999949336052,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/las-vegas","display_name":"Las vegas","score":0.9306458234786987},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.8046650886535645},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5145174860954285},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.38763171434402466},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.34171509742736816},{"id":"https://openalex.org/keywords/library-science","display_name":"Library science","score":0.3402976393699646},{"id":"https://openalex.org/keywords/engineering-management","display_name":"Engineering management","score":0.3245463967323303},{"id":"https://openalex.org/keywords/political-science","display_name":"Political science","score":0.23623067140579224},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.15422305464744568}],"concepts":[{"id":"https://openalex.org/C2993101906","wikidata":"https://www.wikidata.org/wiki/Q23768","display_name":"Las vegas","level":3,"score":0.9306458234786987},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.8046650886535645},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5145174860954285},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.38763171434402466},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.34171509742736816},{"id":"https://openalex.org/C161191863","wikidata":"https://www.wikidata.org/wiki/Q199655","display_name":"Library science","level":1,"score":0.3402976393699646},{"id":"https://openalex.org/C110354214","wikidata":"https://www.wikidata.org/wiki/Q6314146","display_name":"Engineering management","level":1,"score":0.3245463967323303},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.23623067140579224},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.15422305464744568},{"id":"https://openalex.org/C18918823","wikidata":"https://www.wikidata.org/wiki/Q49389","display_name":"Tourism","level":2,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/socc.2014.6948873","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2014.6948873","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 27th IEEE International System-on-Chip Conference (SOCC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W4245666690","https://openalex.org/W4253427688","https://openalex.org/W4302418915","https://openalex.org/W4233922020","https://openalex.org/W416606028","https://openalex.org/W2039159578","https://openalex.org/W2333359418","https://openalex.org/W4238722241","https://openalex.org/W4300942584"],"abstract_inverted_index":{"On":[0],"behalf":[1],"of":[2,39],"the":[3,11,40],"Technical":[4],"Program":[5],"Committee,":[6],"we":[7,53],"welcome":[8],"you":[9],"to":[10],"27th":[12],"IEEE":[13],"International":[14],"System-on-Chip":[15],"Conference,":[16],"held":[17],"this":[18,55],"year":[19,52],"in":[20,46],"Las":[21],"Vegas,":[22],"Nevada.":[23],"For":[24],"over":[25],"25":[26],"years,":[27],"SOCC":[28],"including":[29],"its":[30],"predecessor":[31],"conferences":[32,42],"ASIC":[33],"and":[34,49],"ASIC/SOC":[35],"has":[36],"been":[37],"one":[38],"premier":[41],"for":[43],"sharing":[44],"advances":[45],"SoC":[47],"technologies":[48],"applications.":[50],"This":[51],"continue":[54],"tradition":[56],"with":[57],"an":[58],"outstanding":[59],"technical":[60],"program.":[61]},"counts_by_year":[],"updated_date":"2026-03-03T08:47:05.690250","created_date":"2025-10-10T00:00:00"}