{"id":"https://openalex.org/W2062684350","doi":"https://doi.org/10.1109/socc.2013.6749680","title":"High-level TSV resource sharing and optimization for TSV based 3D IC designs","display_name":"High-level TSV resource sharing and optimization for TSV based 3D IC designs","publication_year":2013,"publication_date":"2013-09-01","ids":{"openalex":"https://openalex.org/W2062684350","doi":"https://doi.org/10.1109/socc.2013.6749680","mag":"2062684350"},"language":"en","primary_location":{"id":"doi:10.1109/socc.2013.6749680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2013.6749680","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International SOC Conference","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101464519","display_name":"Byung-Hyun Lee","orcid":"https://orcid.org/0000-0002-7117-6797"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Byunghyun Lee","raw_affiliation_strings":["System LSI Division, Samsung Electronics Company, Ltd., Yongin 446-711, Korea","Syst. LSI Div., Samsung Electron. Co. Ltd., Yongin, South Korea"],"affiliations":[{"raw_affiliation_string":"System LSI Division, Samsung Electronics Company, Ltd., Yongin 446-711, Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"Syst. LSI Div., Samsung Electron. Co. Ltd., Yongin, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049474875","display_name":"Taewhan Kim","orcid":"https://orcid.org/0000-0002-6114-3772"},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Taewhan Kim","raw_affiliation_strings":["Nano Systems Institute (NSI), Seoul National University, Seoul, Korea","Dept. of Electr. & Comput. Eng., Seoul Nat. Univ., Seoul, South Korea"],"affiliations":[{"raw_affiliation_string":"Nano Systems Institute (NSI), Seoul National University, Seoul, Korea","institution_ids":["https://openalex.org/I139264467"]},{"raw_affiliation_string":"Dept. of Electr. & Comput. Eng., Seoul Nat. Univ., Seoul, South Korea","institution_ids":["https://openalex.org/I139264467"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5101464519"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.2364,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.61208436,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"153","last_page":"158"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9952999949455261,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9835000038146973,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.7064003348350525},{"id":"https://openalex.org/keywords/granularity","display_name":"Granularity","score":0.6882615685462952},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6542426347732544},{"id":"https://openalex.org/keywords/shared-resource","display_name":"Shared resource","score":0.6131404042243958},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5435376763343811},{"id":"https://openalex.org/keywords/resource-allocation","display_name":"Resource allocation","score":0.5245963931083679},{"id":"https://openalex.org/keywords/high-level-synthesis","display_name":"High-level synthesis","score":0.5116243958473206},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4668959081172943},{"id":"https://openalex.org/keywords/resource","display_name":"Resource (disambiguation)","score":0.44733721017837524},{"id":"https://openalex.org/keywords/function","display_name":"Function (biology)","score":0.42578524351119995},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4188113510608673},{"id":"https://openalex.org/keywords/minification","display_name":"Minification","score":0.4149460792541504},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.36952370405197144},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.2917415201663971},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2730775475502014},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.18473047018051147},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.1457059681415558},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.14229077100753784},{"id":"https://openalex.org/keywords/field-programmable-gate-array","display_name":"Field-programmable gate array","score":0.12633231282234192}],"concepts":[{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.7064003348350525},{"id":"https://openalex.org/C177774035","wikidata":"https://www.wikidata.org/wiki/Q1246948","display_name":"Granularity","level":2,"score":0.6882615685462952},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6542426347732544},{"id":"https://openalex.org/C51332947","wikidata":"https://www.wikidata.org/wiki/Q1172305","display_name":"Shared resource","level":2,"score":0.6131404042243958},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5435376763343811},{"id":"https://openalex.org/C29202148","wikidata":"https://www.wikidata.org/wiki/Q287260","display_name":"Resource allocation","level":2,"score":0.5245963931083679},{"id":"https://openalex.org/C58013763","wikidata":"https://www.wikidata.org/wiki/Q5754574","display_name":"High-level synthesis","level":3,"score":0.5116243958473206},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4668959081172943},{"id":"https://openalex.org/C206345919","wikidata":"https://www.wikidata.org/wiki/Q20380951","display_name":"Resource (disambiguation)","level":2,"score":0.44733721017837524},{"id":"https://openalex.org/C14036430","wikidata":"https://www.wikidata.org/wiki/Q3736076","display_name":"Function (biology)","level":2,"score":0.42578524351119995},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4188113510608673},{"id":"https://openalex.org/C147764199","wikidata":"https://www.wikidata.org/wiki/Q6865248","display_name":"Minification","level":2,"score":0.4149460792541504},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.36952370405197144},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.2917415201663971},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2730775475502014},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.18473047018051147},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.1457059681415558},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.14229077100753784},{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.12633231282234192},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C78458016","wikidata":"https://www.wikidata.org/wiki/Q840400","display_name":"Evolutionary biology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/socc.2013.6749680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2013.6749680","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE International SOC Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Decent work and economic growth","id":"https://metadata.un.org/sdg/8","score":0.4300000071525574}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W1541633348","https://openalex.org/W1968609578","https://openalex.org/W2063747323","https://openalex.org/W2064559570","https://openalex.org/W2065874420","https://openalex.org/W2089322412","https://openalex.org/W2109826730","https://openalex.org/W2117285153","https://openalex.org/W2124414146","https://openalex.org/W2124989655","https://openalex.org/W2126084661","https://openalex.org/W2129296059","https://openalex.org/W2131193257","https://openalex.org/W2148292324","https://openalex.org/W2152965341","https://openalex.org/W2167220795","https://openalex.org/W2168938583","https://openalex.org/W2169892331","https://openalex.org/W3139550494","https://openalex.org/W4231455094","https://openalex.org/W4235066485","https://openalex.org/W4255435342","https://openalex.org/W6666544085","https://openalex.org/W6677504465","https://openalex.org/W6678502064","https://openalex.org/W6684297216","https://openalex.org/W6684891719"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2046139226","https://openalex.org/W2513353273","https://openalex.org/W2549021975","https://openalex.org/W2333804548","https://openalex.org/W4399621287","https://openalex.org/W1968957853","https://openalex.org/W2310189477"],"abstract_inverted_index":{"Under":[0],"the":[1,9,19,25,29,33,44,55,80,91,95,100,106,120,128,143,149,174,179,184,205,234,253,265,269,280],"current":[2],"process":[3],"and":[4,41,65,85,137,160,196,208,214,244],"layer":[5,131,168,271],"bonding":[6],"technology":[7],"for":[8,192],"TSV":[10,20,36,56,83,109,135,157,193,212,216,242,250,275],"(through-silicon-via)":[11],"based":[12],"3D":[13,62,130,167],"ICs,":[14],"it":[15,223],"is":[16,22,99,126,224],"known":[17],"that":[18,226],"resource":[21,57,110,158,194],"one":[23,89],"of":[24,28,32,54,82,90,94,105,108,119,166,173,178,236,255,260,283],"major":[26],"sources":[27],"function":[30],"failure":[31],"chip.":[34],"Furthermore,":[35],"takes":[37],"much":[38],"larger":[39],"size":[40],"pitch":[42],"than":[43],"normal":[45],"logic":[46],"components.":[47],"For":[48],"this":[49],"reason,":[50],"a":[51,116,164],"careful":[52],"allocation":[53,84,136],"has":[58],"been":[59,69],"required":[60],"in":[61,240,248],"IC":[63],"designs,":[64,222],"several":[66],"works":[67],"have":[68,133],"proposed":[70,228],"to":[71,87,115,123,142,232],"allocate":[72],"TSVs":[73,237],"minimally":[74],"or":[75,102],"economically.":[76],"This":[77,125,153],"work":[78,154],"addresses":[79],"problem":[81],"optimization":[86,161],"overcome":[88],"critical":[92],"limitations":[93],"previous":[96,129],"works,":[97],"which":[98,170,198],"unawareness":[101],"no":[103,274],"exploitation":[104],"possibility":[107],"sharing,":[111],"previously":[112],"merely":[113],"resorting":[114],"simple":[117],"binding":[118],"data":[121,144,180],"transfers":[122,181],"TSVs.":[124],"because":[127],"partitioners":[132],"performed":[134],"minimization":[138],"without":[139],"any":[140],"link":[141],"transfer":[145],"information":[146,177],"accessible":[147],"from":[148,183],"high-level":[150,185],"synthesis":[151],"flow.":[152],"proposes":[155],"two":[156,190],"sharing":[159,195,206,213,243,251,276],"algorithms":[162,191,229],"(as":[163],"post-processing":[165],"partitioning)":[169],"make":[171],"use":[172],"life":[175],"time":[176],"taken":[182],"synthesis.":[186],"Precisely,":[187],"we":[188],"propose":[189],"optimization,":[197],"can":[199],"be":[200],"selectively":[201],"applied":[202],"depending":[203],"on":[204],"granularity":[207],"design":[209],"complexity:":[210],"word-level":[211,241],"bit-level":[215,249],"sharing.":[217],"Through":[218],"experiments":[219],"with":[220,264,273],"benchmark":[221],"confirmed":[225],"our":[227],"are":[230],"able":[231],"reduce":[233],"number":[235],"by":[238,268],"10.5%\u223c41.1%":[239],"15.5%":[245],"\u223c":[246,257],"45.1%":[247],"at":[252],"expense":[254],"2.0%":[256],"18.1%":[258],"increase":[259],"2D":[261],"wirelength":[262],"compared":[263],"results":[266],"produced":[267],"conventional":[270],"partitioning":[272],"while":[277],"still":[278],"meeting":[279],"timing":[281],"constraint":[282],"designs.":[284]},"counts_by_year":[{"year":2017,"cited_by_count":2},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}