{"id":"https://openalex.org/W1974185940","doi":"https://doi.org/10.1109/socc.2010.5784737","title":"Power noise suppression technique using active decoupling capacitor for TSV 3D integration","display_name":"Power noise suppression technique using active decoupling capacitor for TSV 3D integration","publication_year":2010,"publication_date":"2010-09-01","ids":{"openalex":"https://openalex.org/W1974185940","doi":"https://doi.org/10.1109/socc.2010.5784737","mag":"1974185940"},"language":"en","primary_location":{"id":"doi:10.1109/socc.2010.5784737","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2010.5784737","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"23rd IEEE International SOC Conference","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102391663","display_name":"Tien\u2010Hung Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Tien-Hung Lin","raw_affiliation_strings":["Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao Tung University, Hsinchu, Taiwan","Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao-Tung University, HsinChu 300, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao-Tung University, HsinChu 300, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066525875","display_name":"Po-Tsang Huang","orcid":"https://orcid.org/0000-0001-8679-2755"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Po-Tsang Huang","raw_affiliation_strings":["Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao Tung University, Hsinchu, Taiwan","Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao-Tung University, HsinChu 300, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao-Tung University, HsinChu 300, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5111568152","display_name":"Wei Hwang","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Wei Hwang","raw_affiliation_strings":["Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao Tung University, Hsinchu, Taiwan","Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao-Tung University, HsinChu 300, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Electronics Engineering & Institute of Electronics, and Microelectronics and Information Systems Research Center, National Chiao-Tung University, HsinChu 300, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I148366613"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"209","last_page":"212"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/decoupling-capacitor","display_name":"Decoupling capacitor","score":0.8010414838790894},{"id":"https://openalex.org/keywords/decoupling","display_name":"Decoupling (probability)","score":0.7528955936431885},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.6403279900550842},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.6102237105369568},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5881417989730835},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5717049241065979},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.5327401757240295},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5002994537353516},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4279812276363373},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.35118675231933594},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3324829041957855},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3244013488292694}],"concepts":[{"id":"https://openalex.org/C35196352","wikidata":"https://www.wikidata.org/wiki/Q1532649","display_name":"Decoupling capacitor","level":4,"score":0.8010414838790894},{"id":"https://openalex.org/C205606062","wikidata":"https://www.wikidata.org/wiki/Q5249645","display_name":"Decoupling (probability)","level":2,"score":0.7528955936431885},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.6403279900550842},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.6102237105369568},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5881417989730835},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5717049241065979},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.5327401757240295},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5002994537353516},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4279812276363373},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.35118675231933594},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3324829041957855},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3244013488292694},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/socc.2010.5784737","is_oa":false,"landing_page_url":"https://doi.org/10.1109/socc.2010.5784737","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"23rd IEEE International SOC Conference","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8799999952316284,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W2043548604","https://openalex.org/W2103972191","https://openalex.org/W2109314689","https://openalex.org/W2110392223","https://openalex.org/W2115027000","https://openalex.org/W2119807774","https://openalex.org/W2126420455","https://openalex.org/W2127645316"],"related_works":["https://openalex.org/W2591634623","https://openalex.org/W2115156230","https://openalex.org/W2972236120","https://openalex.org/W2730834029","https://openalex.org/W1600789903","https://openalex.org/W1849148950","https://openalex.org/W2537334175","https://openalex.org/W1968306380","https://openalex.org/W2103363348","https://openalex.org/W1548863870"],"abstract_inverted_index":{"In":[0,23],"three-dimensional":[1],"(3D)":[2],"integration,":[3],"the":[4,44,49,76,95],"increasing":[5],"supply":[6,51,74,86],"current":[7],"through":[8],"both":[9],"package":[10],"and":[11,56,68,89],"through-silicon-via":[12],"(TSV)":[13],"would":[14],"lead":[15],"to":[16],"a":[17,26],"large":[18],"simultaneous":[19],"switching":[20],"noise":[21,27,46,52,78,87],"potentially.":[22],"this":[24],"paper,":[25],"suppression":[28,79],"technique":[29],"using":[30],"low":[31],"power":[32,50],"active":[33,59],"decoupling":[34],"capacitors":[35],"(DECAPs)":[36],"is":[37],"proposed":[38,77],"for":[39],"TSV":[40,69],"3D":[41],"integration.":[42],"Through":[43],"latch-based":[45],"detection":[47],"circuitry,":[48],"can":[53,81],"be":[54],"detected":[55],"regulated":[57],"via":[58],"DECAPs.":[60],"Based":[61],"on":[62],"UMC":[63],"65":[64],"nm":[65],"CMOS":[66],"technology":[67],"model":[70],"at":[71,94],"1":[72],"V":[73],"voltage,":[75],"circuit":[80],"realize":[82],"maximum":[83],"7.4":[84],"dB":[85],"reduction":[88],"12":[90],"X":[91],"boost":[92],"fact":[93],"resonant":[96],"frequency.":[97]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}