{"id":"https://openalex.org/W4413096229","doi":"https://doi.org/10.1109/smacd65553.2025.11092285","title":"CAD Modeling of a Wafer-Level Packaging GaN Transistors for Electrothermal Simulation Using the Finite Element Method","display_name":"CAD Modeling of a Wafer-Level Packaging GaN Transistors for Electrothermal Simulation Using the Finite Element Method","publication_year":2025,"publication_date":"2025-07-07","ids":{"openalex":"https://openalex.org/W4413096229","doi":"https://doi.org/10.1109/smacd65553.2025.11092285"},"language":"en","primary_location":{"id":"doi:10.1109/smacd65553.2025.11092285","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smacd65553.2025.11092285","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 21st International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuits Design (SMACD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5093503864","display_name":"M. Belguith","orcid":null},"institutions":[{"id":"https://openalex.org/I8636806","display_name":"University of Sousse","ror":"https://ror.org/00dmpgj58","country_code":"TN","type":"education","lineage":["https://openalex.org/I8636806"]}],"countries":["TN"],"is_corresponding":true,"raw_author_name":"Mohamed Belguith","raw_affiliation_strings":["Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia"],"affiliations":[{"raw_affiliation_string":"Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia","institution_ids":["https://openalex.org/I8636806"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015538402","display_name":"Sonia Eloued","orcid":"https://orcid.org/0000-0002-2928-2430"},"institutions":[{"id":"https://openalex.org/I8636806","display_name":"University of Sousse","ror":"https://ror.org/00dmpgj58","country_code":"TN","type":"education","lineage":["https://openalex.org/I8636806"]}],"countries":["TN"],"is_corresponding":false,"raw_author_name":"Sonia Eloued","raw_affiliation_strings":["Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia"],"affiliations":[{"raw_affiliation_string":"Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia","institution_ids":["https://openalex.org/I8636806"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080140521","display_name":"Moncef Kadi","orcid":"https://orcid.org/0000-0002-6336-830X"},"institutions":[{"id":"https://openalex.org/I62396329","display_name":"Universit\u00e9 de Rouen Normandie","ror":"https://ror.org/03nhjew95","country_code":"FR","type":"education","lineage":["https://openalex.org/I4210105918","https://openalex.org/I62396329"]},{"id":"https://openalex.org/I2802505300","display_name":"\u00c9cole Sup\u00e9rieure d'Ing\u00e9nieurs en G\u00e9nie \u00c9lectrique","ror":"https://ror.org/01apwkd48","country_code":"FR","type":"education","lineage":["https://openalex.org/I2802505300"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Moncef Kadi","raw_affiliation_strings":["UNIROUEN, ESIGELEC, IRSEEM,Rouen,France,76000"],"affiliations":[{"raw_affiliation_string":"UNIROUEN, ESIGELEC, IRSEEM,Rouen,France,76000","institution_ids":["https://openalex.org/I62396329","https://openalex.org/I2802505300"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005970426","display_name":"Jaleleddine Ben Hadj Slama","orcid":"https://orcid.org/0000-0003-1817-1521"},"institutions":[{"id":"https://openalex.org/I8636806","display_name":"University of Sousse","ror":"https://ror.org/00dmpgj58","country_code":"TN","type":"education","lineage":["https://openalex.org/I8636806"]}],"countries":["TN"],"is_corresponding":false,"raw_author_name":"Jaleleddine Ben Hadj Slama","raw_affiliation_strings":["Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia"],"affiliations":[{"raw_affiliation_string":"Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia","institution_ids":["https://openalex.org/I8636806"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068725785","display_name":"Mahmoud Hamouda","orcid":"https://orcid.org/0000-0003-2919-1819"},"institutions":[{"id":"https://openalex.org/I8636806","display_name":"University of Sousse","ror":"https://ror.org/00dmpgj58","country_code":"TN","type":"education","lineage":["https://openalex.org/I8636806"]}],"countries":["TN"],"is_corresponding":false,"raw_author_name":"Mahmoud Hamouda","raw_affiliation_strings":["Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia"],"affiliations":[{"raw_affiliation_string":"Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse,LATIS-Laboratory of Advanced Technology and Intelligent Systems,Sousse,Tunisia","institution_ids":["https://openalex.org/I8636806"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5093503864"],"corresponding_institution_ids":["https://openalex.org/I8636806"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15143223,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.984000027179718,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12898","display_name":"Induction Heating and Inverter Technology","score":0.958299994468689,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7588263154029846},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.7237710952758789},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.6089926362037659},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5617489814758301},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.5190168619155884},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.48066723346710205},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.4698582887649536},{"id":"https://openalex.org/keywords/solid-modeling","display_name":"Solid modeling","score":0.45991766452789307},{"id":"https://openalex.org/keywords/wafer-scale-integration","display_name":"Wafer-scale integration","score":0.4387243688106537},{"id":"https://openalex.org/keywords/semiconductor-device-modeling","display_name":"Semiconductor device modeling","score":0.4259960353374481},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3844367563724518},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3639630079269409},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.31573331356048584},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20638063549995422},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19256073236465454},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.16545793414115906},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.11864382028579712},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.0911264717578888}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7588263154029846},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.7237710952758789},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.6089926362037659},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5617489814758301},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.5190168619155884},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48066723346710205},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.4698582887649536},{"id":"https://openalex.org/C108882727","wikidata":"https://www.wikidata.org/wiki/Q2991685","display_name":"Solid modeling","level":2,"score":0.45991766452789307},{"id":"https://openalex.org/C2778638305","wikidata":"https://www.wikidata.org/wiki/Q7406100","display_name":"Wafer-scale integration","level":3,"score":0.4387243688106537},{"id":"https://openalex.org/C4775677","wikidata":"https://www.wikidata.org/wiki/Q7449393","display_name":"Semiconductor device modeling","level":3,"score":0.4259960353374481},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3844367563724518},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3639630079269409},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.31573331356048584},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20638063549995422},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19256073236465454},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.16545793414115906},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.11864382028579712},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0911264717578888},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/smacd65553.2025.11092285","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smacd65553.2025.11092285","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 21st International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuits Design (SMACD)","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-05242438v1","is_oa":false,"landing_page_url":"https://normandie-univ.hal.science/hal-05242438","pdf_url":null,"source":{"id":"https://openalex.org/S4406922461","display_name":"SPIRE - Sciences Po Institutional REpository","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2025 21st International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuits Design (SMACD), Jul 2025, Istanbul, France. pp.1-4, ⟨10.1109/SMACD65553.2025.11092285⟩","raw_type":"Conference papers"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W4200315228","https://openalex.org/W4389777384"],"related_works":["https://openalex.org/W2156194080","https://openalex.org/W2171369689","https://openalex.org/W4200597737","https://openalex.org/W2011986249","https://openalex.org/W2096487736","https://openalex.org/W2766742654","https://openalex.org/W2089003336","https://openalex.org/W4312229006","https://openalex.org/W2751049450","https://openalex.org/W1969921064"],"abstract_inverted_index":{"This":[0],"study":[1],"presents":[2],"a":[3,51,85],"detailed":[4,70],"CAD":[5],"model":[6],"for":[7,56],"wafer-level":[8],"packaged":[9],"GaN":[10,115],"transistors":[11,116],"to":[12,25,68,107],"perform":[13],"electrothermal":[14],"simulations":[15],"using":[16],"the":[17,31,80,92,102,109],"Finite":[18],"Element":[19],"Method":[20],"(FEM).":[21],"The":[22,47,59,82],"research":[23],"aims":[24],"enhance":[26],"thermal":[27,71],"management":[28],"and":[29,40,65,96,111],"optimize":[30],"design":[32],"of":[33,76,104,114],"power":[34],"converters":[35],"by":[36],"integrating":[37],"comprehensive":[38],"geometric":[39],"material":[41],"modeling":[42],"into":[43],"advanced":[44],"simulation":[45],"tools.":[46],"focus":[48],"is":[49],"on":[50],"48V/12V-10A":[52],"half-bridge":[53],"buck":[54],"converter":[55],"electric":[57],"vehicles.":[58],"proposed":[60,93],"methodology":[61,95],"combines":[62],"Ansys":[63],"Q3D":[64],"Icepak":[66],"software":[67],"generate":[69],"mapping,":[72],"enabling":[73],"precise":[74],"identification":[75],"heat":[77],"distribution":[78],"across":[79],"system.":[81],"results":[83],"reveal":[84],"16\u00b0C":[86],"difference":[87],"in":[88,117],"junction":[89],"temperature":[90],"between":[91],"CAD-based":[94],"traditional":[97],"approaches.":[98],"These":[99],"findings":[100],"underscore":[101],"potential":[103],"this":[105],"technique":[106],"improve":[108],"reliability":[110],"energy":[112],"efficiency":[113],"high-performance":[118],"automotive":[119],"applications.":[120]},"counts_by_year":[],"updated_date":"2025-12-19T19:40:27.379048","created_date":"2025-10-10T00:00:00"}