{"id":"https://openalex.org/W2885371501","doi":"https://doi.org/10.1109/smacd.2018.8434891","title":"Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires","display_name":"Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires","publication_year":2018,"publication_date":"2018-07-01","ids":{"openalex":"https://openalex.org/W2885371501","doi":"https://doi.org/10.1109/smacd.2018.8434891","mag":"2885371501"},"language":"en","primary_location":{"id":"doi:10.1109/smacd.2018.8434891","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smacd.2018.8434891","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048992445","display_name":"Sheriff Sadiqbatcha","orcid":"https://orcid.org/0000-0001-7474-3366"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheriff Sadiqbatcha","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013935639","display_name":"Chase Cook","orcid":"https://orcid.org/0000-0002-0734-8398"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chase Cook","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027081374","display_name":"Zeyu Sun","orcid":"https://orcid.org/0000-0001-7465-1824"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zeyu Sun","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.08,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.33819829,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"21","last_page":"24"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9428001642227173},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7849348187446594},{"id":"https://openalex.org/keywords/very-large-scale-integration","display_name":"Very-large-scale integration","score":0.5897082686424255},{"id":"https://openalex.org/keywords/sink","display_name":"Sink (geography)","score":0.550719678401947},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5281909704208374},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5077687501907349},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5041302442550659},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4768446683883667},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.46442711353302},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4269981384277344},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.37210625410079956},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2472103238105774},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.23559802770614624},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.22152921557426453},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2071310579776764},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09292083978652954}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9428001642227173},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7849348187446594},{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.5897082686424255},{"id":"https://openalex.org/C143050476","wikidata":"https://www.wikidata.org/wiki/Q194502","display_name":"Sink (geography)","level":2,"score":0.550719678401947},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5281909704208374},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5077687501907349},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5041302442550659},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4768446683883667},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.46442711353302},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4269981384277344},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.37210625410079956},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2472103238105774},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.23559802770614624},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22152921557426453},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2071310579776764},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09292083978652954},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C58640448","wikidata":"https://www.wikidata.org/wiki/Q42515","display_name":"Cartography","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/smacd.2018.8434891","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smacd.2018.8434891","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W2007639067","https://openalex.org/W2007719944","https://openalex.org/W2037431404","https://openalex.org/W2081786181","https://openalex.org/W2083090974","https://openalex.org/W2150608324","https://openalex.org/W2168381636","https://openalex.org/W2172141047","https://openalex.org/W2342660339","https://openalex.org/W2343272038","https://openalex.org/W2596163423","https://openalex.org/W2773119488","https://openalex.org/W2793045524","https://openalex.org/W2803933686"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2136403807","https://openalex.org/W796810817","https://openalex.org/W2081032080","https://openalex.org/W2134733504","https://openalex.org/W2144460576"],"abstract_inverted_index":{"In":[0],"this":[1,68],"work,":[2],"we":[3,70,91,160],"propose":[4],"a":[5,35,47,93,163,170],"novel":[6],"electromigration":[7],"(EM)":[8],"wear-out":[9,139],"acceleration":[10,24],"technique":[11,25],"for":[12,184],"fast":[13],"EM":[14,81,124,138,186],"reliability-testing":[15],"and":[16,101,109,130],"aging-analysis":[17],"of":[18,41,116,137,188],"practical":[19,185],"VLSI":[20],"chips.":[21],"The":[22,112],"new":[23,48],"is":[26,77,120,181],"based":[27],"on":[28,38,105],"the":[29,39,55,58,106,117,135,152,157],"observation":[30],"that":[31,121],"sink":[32,59],"structures":[33],"have":[34],"significant":[36,114],"impact":[37],"lifetime":[40,164],"multisegment":[42],"interconnect":[43,51,74],"wires.":[44],"We":[45],"develop":[46],"configurable":[49],"sink-structured":[50],"wire":[52,107],"in":[53,57,140],"which":[54,76,97,147,180],"current":[56,110],"segment":[60],"can":[61,83,161],"be":[62,84],"activated/deactivated":[63],"dynamically":[64],"during":[65],"operation.":[66],"Using":[67,156],"method,":[69,159],"show":[71],"how":[72],"an":[73],"structure,":[75],"initially":[78],"immortal":[79],"to":[80,86,169],"effects,":[82],"induced":[85],"fail":[87],"very":[88,182],"quickly.":[89],"Furthermore,":[90],"use":[92],"robust":[94],"failure":[95],"scheme":[96],"considers":[98],"both":[99],"early":[100],"late":[102],"failures":[103],"depending":[104],"topology":[108],"direction.":[111],"most":[113],"contribution":[115],"proposed":[118,158],"work":[119],"it":[122],"enables":[123,134],"accelerated":[125,150],"testing":[126,136,187],"at":[127,176],"low":[128,178],"temperature":[129],"voltage.":[131],"This":[132],"feature":[133],"isolation":[141],"without":[142],"invoking":[143],"other":[144],"reliability":[145],"effects":[146],"are":[148],"also":[149],"by":[151],"traditional":[153],"stressing":[154],"conditions.":[155],"achieve":[162],"reduction":[165],"from":[166],"10+":[167],"years":[168],"few":[171],"days,":[172],"or":[173],"even":[174],"hours,":[175],"relatively":[177],"temperatures,":[179],"desirable":[183],"typical":[189],"nanometer":[190],"CMOS":[191],"ICs.":[192]},"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}