{"id":"https://openalex.org/W2735736138","doi":"https://doi.org/10.1109/smacd.2017.7981561","title":"Comprehensive detection of counterfeit ICs via on-chip sensor and post-fabrication authentication policy","display_name":"Comprehensive detection of counterfeit ICs via on-chip sensor and post-fabrication authentication policy","publication_year":2017,"publication_date":"2017-06-01","ids":{"openalex":"https://openalex.org/W2735736138","doi":"https://doi.org/10.1109/smacd.2017.7981561","mag":"2735736138"},"language":"en","primary_location":{"id":"doi:10.1109/smacd.2017.7981561","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smacd.2017.7981561","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 14th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5077508150","display_name":"Yaoyao Ye","orcid":"https://orcid.org/0000-0003-0022-228X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yaoyao Ye","raw_affiliation_strings":["Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100412370","display_name":"Taeyoung Kim","orcid":"https://orcid.org/0000-0002-8353-1776"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Taeyoung Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California, Riverside, CA, USA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030264455","display_name":"Hai\u2010Bao Chen","orcid":"https://orcid.org/0000-0001-7046-3455"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haibao Chen","raw_affiliation_strings":["Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5115593255","display_name":"Hai Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hai Wang","raw_affiliation_strings":["School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063933849","display_name":"Esteban Tlelo\u2010Cuautle","orcid":"https://orcid.org/0000-0001-7187-4686"},"institutions":[{"id":"https://openalex.org/I39824353","display_name":"National Institute of Astrophysics, Optics and Electronics","ror":"https://ror.org/00bpmmc63","country_code":"MX","type":"facility","lineage":["https://openalex.org/I39824353"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"Esteban Tlelo-Cuautle","raw_affiliation_strings":["Department of Electronics, INAOE, Puebla, Mexico"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics, INAOE, Puebla, Mexico","institution_ids":["https://openalex.org/I39824353"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058844682","display_name":"Sheldon X.-D. Tan","orcid":"https://orcid.org/0000-0003-2119-6869"},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sheldon X.-D. Tan","raw_affiliation_strings":["University of California Riverside, Riverside, CA, US"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of California Riverside, Riverside, CA, US","institution_ids":["https://openalex.org/I103635307"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/counterfeit","display_name":"Counterfeit","score":0.9014409780502319},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6044016480445862},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5892965793609619},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5674394965171814},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.5445388555526733},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5023465156555176},{"id":"https://openalex.org/keywords/authentication","display_name":"Authentication (law)","score":0.50008225440979},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4919164180755615},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.34005528688430786},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24625924229621887},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.15601608157157898},{"id":"https://openalex.org/keywords/computer-security","display_name":"Computer security","score":0.14907580614089966},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09196126461029053}],"concepts":[{"id":"https://openalex.org/C2779356469","wikidata":"https://www.wikidata.org/wiki/Q502918","display_name":"Counterfeit","level":2,"score":0.9014409780502319},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6044016480445862},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5892965793609619},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5674394965171814},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.5445388555526733},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5023465156555176},{"id":"https://openalex.org/C148417208","wikidata":"https://www.wikidata.org/wiki/Q4825882","display_name":"Authentication (law)","level":2,"score":0.50008225440979},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4919164180755615},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.34005528688430786},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24625924229621887},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15601608157157898},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.14907580614089966},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09196126461029053},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/smacd.2017.7981561","is_oa":false,"landing_page_url":"https://doi.org/10.1109/smacd.2017.7981561","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 14th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/16","display_name":"Peace, Justice and strong institutions","score":0.46000000834465027}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1992413325","https://openalex.org/W2007719944","https://openalex.org/W2052421316","https://openalex.org/W2077036969","https://openalex.org/W2106409910","https://openalex.org/W2124458446","https://openalex.org/W2124954128","https://openalex.org/W2150608324","https://openalex.org/W2477020977","https://openalex.org/W4237823503","https://openalex.org/W4241472700","https://openalex.org/W6663545822","https://openalex.org/W6675797392"],"related_works":["https://openalex.org/W3191226418","https://openalex.org/W2357749344","https://openalex.org/W1539823648","https://openalex.org/W2362200800","https://openalex.org/W4323356230","https://openalex.org/W4290078996","https://openalex.org/W4372352523","https://openalex.org/W3113783116","https://openalex.org/W1579156572","https://openalex.org/W3211012000"],"abstract_inverted_index":{"Counterfeit":[0],"integrated":[1],"circuits":[2],"(ICs)":[3],"have":[4],"posed":[5],"a":[6,24,40,128],"major":[7],"security":[8],"and":[9,14,29,39,59,70,112,135,160,165],"safety":[10],"threat":[11],"on":[12,120],"commercial":[13],"mission-critical":[15],"systems.":[16],"In":[17],"this":[18],"paper,":[19],"we":[20,126],"propose":[21,127],"to":[22,73,133],"develop":[23],"comprehensive":[25],"counterfeit":[26,49,138],"ICs":[27,50],"detection":[28,158],"prevention":[30],"strategy,":[31],"consisting":[32],"of":[33,67,80,109,116,122,145,156],"an":[34],"innovative":[35],"multi-functional":[36,148],"on-chip":[37,152],"sensor":[38,65,82,87,94,100,149],"related":[41,77],"post-fabrication":[42,130],"authentication":[43,131],"methodology.":[44],"We":[45],"target":[46],"at":[47],"many":[48],"including":[51],"the":[52,63,85,90,123,143,146],"recycled/remarked/out-of-spec":[53],"ICs,":[54],"as":[55,57],"well":[56],"cloned":[58],"over-produced":[60],"ICs.":[61,139],"First,":[62],"new":[64,86,124,129],"consists":[66],"antifuse":[68],"memory":[69],"aging":[71,93,99],"sensors":[72,153],"reduce":[74],"reference":[75],"circuit":[76],"area":[78],"overhead":[79],"those":[81],"circuits.":[83],"Second,":[84],"combines":[88],"both":[89,110],"ring-oscillator":[91],"based":[92],"with":[95],"recently":[96],"proposed":[97,147],"electromigration(EM)-based":[98],"so":[101],"that":[102],"it":[103],"can":[104],"be":[105],"effective":[106],"for":[107],"estimation":[108,163],"short":[111],"long":[113],"period":[114],"time":[115,162],"chip":[117],"usage.":[118],"Third,":[119],"top":[121],"sensor,":[125],"methodology":[132],"detect":[134],"prevent":[136],"non-defective":[137],"Simulation":[140],"results":[141],"show":[142],"advantage":[144],"against":[150],"existing":[151],"in":[154],"terms":[155],"functionality,":[157],"coverage":[159],"usage":[161],"range":[164],"accuracy.":[166]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}
