{"id":"https://openalex.org/W2012701699","doi":"https://doi.org/10.1109/slip.2013.6681680","title":"Toward quantifying the IC design value of interconnect technology improvements","display_name":"Toward quantifying the IC design value of interconnect technology improvements","publication_year":2013,"publication_date":"2013-06-01","ids":{"openalex":"https://openalex.org/W2012701699","doi":"https://doi.org/10.1109/slip.2013.6681680","mag":"2012701699"},"language":"en","primary_location":{"id":"doi:10.1109/slip.2013.6681680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/slip.2013.6681680","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113828714","display_name":"Tuck-Boon Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tuck-Boon Chan","raw_affiliation_strings":["ECE Departments, University of California at San Diego","ECE Dept., Univ. of California at San Diego, La Jolla, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ECE Departments, University of California at San Diego","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"ECE Dept., Univ. of California at San Diego, La Jolla, CA, USA#TAB#","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073558386","display_name":"Andrew B. Kahng","orcid":"https://orcid.org/0000-0002-4490-5018"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew B. Kahng","raw_affiliation_strings":["CSE","CSE Dept., Univ. of California at San Diego, La Jolla, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CSE","institution_ids":[]},{"raw_affiliation_string":"CSE Dept., Univ. of California at San Diego, La Jolla, CA, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100454287","display_name":"Jiajia Li","orcid":"https://orcid.org/0000-0002-3420-9764"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jiajia Li","raw_affiliation_strings":["ECE Departments, University of California at San Diego","ECE Dept., Univ. of California at San Diego, La Jolla, CA, USA#TAB#"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ECE Departments, University of California at San Diego","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"ECE Dept., Univ. of California at San Diego, La Jolla, CA, USA#TAB#","institution_ids":["https://openalex.org/I36258959"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I36258959"],"apc_list":null,"apc_paid":null,"fwci":0.4801,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.68789861,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":"22","issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7211755514144897},{"id":"https://openalex.org/keywords/back-end-of-line","display_name":"Back end of line","score":0.6424018144607544},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.609843909740448},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.5009210109710693},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.47559627890586853},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4460587501525879},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.4329655170440674},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.40733087062835693},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3526949882507324},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.26132631301879883},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15230756998062134}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7211755514144897},{"id":"https://openalex.org/C2776628375","wikidata":"https://www.wikidata.org/wiki/Q4839229","display_name":"Back end of line","level":3,"score":0.6424018144607544},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.609843909740448},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.5009210109710693},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47559627890586853},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4460587501525879},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.4329655170440674},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.40733087062835693},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3526949882507324},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.26132631301879883},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15230756998062134},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/slip.2013.6681680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/slip.2013.6681680","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.310.4186","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.310.4186","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://vlsicad.ucsd.edu/Publications/Conferences/298/c298.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320338291","display_name":"Sandia National Laboratories","ror":"https://ror.org/01apwpt12"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1969875181","https://openalex.org/W2024283281","https://openalex.org/W2059229417","https://openalex.org/W2098883414","https://openalex.org/W2103839066","https://openalex.org/W2122957076","https://openalex.org/W2141793803","https://openalex.org/W2152815343","https://openalex.org/W2155237865","https://openalex.org/W2155891206","https://openalex.org/W2170926125","https://openalex.org/W3148214629","https://openalex.org/W6642610253","https://openalex.org/W6656175740","https://openalex.org/W6685075765"],"related_works":["https://openalex.org/W2469980698","https://openalex.org/W4242813950","https://openalex.org/W1991973217","https://openalex.org/W2084737927","https://openalex.org/W2157788653","https://openalex.org/W4398198336","https://openalex.org/W2136403807","https://openalex.org/W2383563100","https://openalex.org/W2393658466","https://openalex.org/W4248234938"],"abstract_inverted_index":{"As":[0],"technology":[1,25,44,61,84,90,130,160,166],"scales,":[2],"wire":[3],"delay":[4],"due":[5],"to":[6,27,47,76,105,157],"interconnect":[7,83,101,129],"resistance":[8,102],"(R)":[9],"and":[10,19,23,91,112,121,162,171],"capacitance":[11,104],"(C)":[12],"is":[13],"increasing.":[14],"Thus,":[15],"improvement":[16],"of":[17,56,59,80,100,118,128,151],"middle-of-line":[18],"back-end-of-line":[20],"(BEOL)":[21],"materials":[22],"process":[24],"(e.g.,":[26,143],"achieve":[28],"reduced":[29],"barrier":[30],"material":[31],"thickness":[32],"or":[33,135],"dielectric":[34],"permittivity)":[35],"has":[36,50],"always":[37],"been":[38,52],"a":[39,74,133],"key":[40],"goal":[41],"in":[42,82,173],"the":[43,57,78],"roadmap.":[45],"However,":[46],"date":[48],"there":[49],"not":[51],"any":[53],"systematic":[54],"quantification":[55],"value":[58],"BEOL":[60,159],"improvements":[62,81,131,167],"on":[63,85,108],"integrated":[64],"circuit":[65],"(LC)":[66],"design":[67,109,120],"metrics.":[68],"In":[69],"this":[70,149],"work,":[71],"we":[72,97],"create":[73],"framework":[75,140],"study":[77],"impact":[79],"IC":[86],"designs.":[87],"Using":[88],"45nm":[89],"benchmark":[92],"designs":[93],"from":[94],"public":[95],"sources,":[96],"map":[98],"reductions":[99],"and/or":[103],"resulting":[106],"impacts":[107],"power,":[110],"performance":[111],"area":[113],"-":[114],"for":[115],"various":[116],"types":[117],"physical":[119],"operating":[122],"contexts.":[123],"By":[124],"quantifying":[125],"potential":[126],"benefits":[127],"at":[132],"block":[134],"core":[136],"level,":[137],"our":[138],"proposed":[139],"complements":[141],"lower-level":[142],"critical-path)":[144],"projections.":[145],"We":[146],"believe":[147],"that":[148],"type":[150],"early":[152],"assessment":[153],"can":[154],"be":[155],"useful":[156],"guide":[158],"investments":[161],"targets,":[163],"especially":[164],"as":[165],"require":[168],"ever-increasing":[169],"resources":[170],"focus":[172],"R&D":[174],"efforts.":[175]},"counts_by_year":[{"year":2015,"cited_by_count":2}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}