{"id":"https://openalex.org/W3150809889","doi":"https://doi.org/10.1109/slip.2011.6135439","title":"Performance and power analysis of through silicon via based 3D IC integration","display_name":"Performance and power analysis of through silicon via based 3D IC integration","publication_year":2011,"publication_date":"2011-06-01","ids":{"openalex":"https://openalex.org/W3150809889","doi":"https://doi.org/10.1109/slip.2011.6135439","mag":"3150809889"},"language":"en","primary_location":{"id":"doi:10.1109/slip.2011.6135439","is_oa":false,"landing_page_url":"https://doi.org/10.1109/slip.2011.6135439","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Workshop on System Level Interconnect Prediction","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032951039","display_name":"Hung Viet Nguyen","orcid":"https://orcid.org/0000-0001-6349-1044"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Hung Viet Nguyen","raw_affiliation_strings":["School of Electrical and Computer Engineering, UNIST, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, UNIST, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063210139","display_name":"Myunghwan Ryu","orcid":null},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Myunghwan Ryu","raw_affiliation_strings":["School of Electrical and Computer Engineering, UNIST, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, UNIST, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100337289","display_name":"Y.-M. Kim","orcid":"https://orcid.org/0000-0001-8720-6113"},"institutions":[{"id":"https://openalex.org/I48566637","display_name":"Ulsan National Institute of Science and Technology","ror":"https://ror.org/017cjz748","country_code":"KR","type":"education","lineage":["https://openalex.org/I48566637"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youngmin Kim","raw_affiliation_strings":["School of Electrical and Computer Engineering, UNIST, Ulsan, South Korea"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, UNIST, Ulsan, South Korea","institution_ids":["https://openalex.org/I48566637"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5032951039"],"corresponding_institution_ids":["https://openalex.org/I48566637"],"apc_list":null,"apc_paid":null,"fwci":0.5299,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.73651284,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9868999719619751,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.8057904243469238},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7842780351638794},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6585227847099304},{"id":"https://openalex.org/keywords/footprint","display_name":"Footprint","score":0.5393047332763672},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5159490704536438},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.46176546812057495},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.437466025352478},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4072595238685608},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.36760789155960083},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3558201491832733},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3072468042373657},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.28878727555274963},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2818244695663452},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12827780842781067},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0897357165813446}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.8057904243469238},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7842780351638794},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6585227847099304},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.5393047332763672},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5159490704536438},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.46176546812057495},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.437466025352478},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4072595238685608},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.36760789155960083},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3558201491832733},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3072468042373657},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28878727555274963},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2818244695663452},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12827780842781067},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0897357165813446},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/slip.2011.6135439","is_oa":false,"landing_page_url":"https://doi.org/10.1109/slip.2011.6135439","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Workshop on System Level Interconnect Prediction","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8799999952316284,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W2084347051"],"abstract_inverted_index":{"In":[0,116],"the":[1,59,78,95,104,120,136,164,199,218,235,243,249],"recent":[2],"decades,":[3],"power":[4,72,182,200],"consumption":[5,73],"of":[6,61,100,202,237,246,252,261],"System":[7],"on":[8,65,171],"Chip":[9],"(SoC)":[10],"is":[11,93,283],"getting":[12],"more":[13],"dominant":[14],"and":[15,33,38,74,97,144,153,180,204,240,264,289],"Through-Silicon":[16,62],"Via":[17,63],"(TSV)":[18,64],"technology":[19,126],"has":[20],"emerged":[21],"as":[22,69,71,107,109],"a":[23,280],"promising":[24],"solution":[25],"to":[26,48,76,134,142,209,225],"enhance":[27],"system":[28],"integration":[29],"at":[30],"lower":[31],"cost":[32],"reduce":[34,198],"footprint.":[35],"Powerful":[36],"microprocessor":[37],"immense":[39],"memory":[40],"capability":[41],"integrated":[42],"in":[43,113,186,211,274],"standard":[44],"2D":[45],"IC":[46,50,54,88,125,223,276,287],"enabled":[47],"improve":[49,205],"performance":[51,68,207,251,288],"by":[52,118,148,175,191],"shrinking":[53],"dimensions.":[55],"Our":[56],"research":[57,188],"evaluates":[58],"impact":[60],"3D":[66,87,114,137,157,221,253,275,286],"chip":[67],"well":[70,108],"investigates":[75],"understand":[77],"optimum":[79],"TSV":[80,101,128,193,219,238,247,262,278],"dimension":[81,239],"(i.e.,":[82],"diameter,":[83,265],"height,":[84],"etc\u2026)":[85],"for":[86,123,228,248,270,285],"fabrication.":[89],"The":[90,184],"key":[91],"idea":[92],"using":[94],"physical":[96],"electrical":[98],"modeling":[99],"which":[102],"considers":[103],"coupling":[105],"effects":[106],"TSV-to-bulk":[110],"silicon":[111,166],"parameters":[112],"circuitry.":[115],"addition,":[117],"combining":[119],"conventional":[121],"metrics":[122],"planar":[124],"with":[127,140,279],"modeling,":[129],"several":[130],"methodologies":[131],"are":[132],"developed":[133],"evaluate":[135],"chip's":[138],"behavior":[139],"respect":[141],"interconnect":[143,173,203],"repeaters.":[145],"For":[146],"example,":[147],"exploiting":[149],"101-stage":[150],"Ring":[151],"Oscillator":[152],"100-inverter":[154],"chain":[155],"into":[156],"IC,":[158],"it":[159],"can":[160,196,267],"be":[161,226],"said":[162],"that":[163,190,269],"through":[165],"via":[167],"brings":[168],"substantial":[169],"benefits":[170],"local":[172],"layers":[174],"improving":[176],"overall":[177,206],"transmission":[178],"speed":[179],"reducing":[181],"consumption.":[183],"results":[185],"our":[187],"show":[189],"adopting":[192],"infusion":[194],"we":[195,233,266],"both":[197],"dissipation":[201],"up":[208],"35%":[210],"4-die":[212],"stacking":[213],"case.":[214],"Like":[215],"all":[216],"ICs,":[217],"based":[220],"stacked":[222],"need":[224],"analyzed":[227],"manufacturing":[229],"process":[230],"variation.":[231],"Hence,":[232],"investigate":[234],"variation":[236],"then":[241],"propose":[242],"optimal":[244],"shape":[245],"best":[250,284],"systems":[254],"integration.":[255],"From":[256],"simultaneous":[257],"Monte":[258],"Carlo":[259],"simulations":[260],"height":[263],"conclude":[268],"given":[271],"specific":[272],"pitch":[273],"technology,":[277],"small":[281],"diameter":[282],"energy":[290],"dissipation.":[291]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}