{"id":"https://openalex.org/W4405489740","doi":"https://doi.org/10.1109/sensors60989.2024.10784954","title":"Monolithic Vacuum Packaging for a CMOS MEMS Resonator Oscillator","display_name":"Monolithic Vacuum Packaging for a CMOS MEMS Resonator Oscillator","publication_year":2024,"publication_date":"2024-10-20","ids":{"openalex":"https://openalex.org/W4405489740","doi":"https://doi.org/10.1109/sensors60989.2024.10784954"},"language":"en","primary_location":{"id":"doi:10.1109/sensors60989.2024.10784954","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors60989.2024.10784954","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110703839","display_name":"Chih-Hsien Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"C. Y. Chang","raw_affiliation_strings":["Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043453313","display_name":"C. T. Hsin","orcid":"https://orcid.org/0009-0000-3517-7226"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. T. Hsin","raw_affiliation_strings":["Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067222752","display_name":"Y.-Z. Juang","orcid":"https://orcid.org/0009-0002-0579-7058"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y. Z. Juang","raw_affiliation_strings":["Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5006294975","display_name":"Snow H. Tseng","orcid":"https://orcid.org/0000-0003-1743-801X"},"institutions":[{"id":"https://openalex.org/I4210120917","display_name":"Taiwan Semiconductor Manufacturing Company (Taiwan)","ror":"https://ror.org/02wx79d08","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210120917"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"S. H. Tseng","raw_affiliation_strings":["Taiwan Semiconductor Research Institute,Hsinchu,Taiwan"],"affiliations":[{"raw_affiliation_string":"Taiwan Semiconductor Research Institute,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I4210120917"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5110703839"],"corresponding_institution_ids":["https://openalex.org/I4210120917"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.21192009,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9818999767303467,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.7815306186676025},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7620817422866821},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.6337388157844543},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.589222252368927},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5677168369293213},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.484309583902359},{"id":"https://openalex.org/keywords/vacuum-packing","display_name":"Vacuum packing","score":0.4427736699581146},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.38593119382858276},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19682443141937256},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.08504417538642883}],"concepts":[{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.7815306186676025},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7620817422866821},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.6337388157844543},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.589222252368927},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5677168369293213},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.484309583902359},{"id":"https://openalex.org/C100155856","wikidata":"https://www.wikidata.org/wiki/Q682829","display_name":"Vacuum packing","level":2,"score":0.4427736699581146},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38593119382858276},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19682443141937256},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.08504417538642883}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/sensors60989.2024.10784954","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors60989.2024.10784954","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8399999737739563,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1977865810","https://openalex.org/W2037601440","https://openalex.org/W2061872754","https://openalex.org/W2110243492","https://openalex.org/W2153582785","https://openalex.org/W2189572986","https://openalex.org/W2743589684","https://openalex.org/W2794804106","https://openalex.org/W2968645643","https://openalex.org/W3034118777","https://openalex.org/W3180764612","https://openalex.org/W4285261129"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2120483398","https://openalex.org/W1530711136","https://openalex.org/W3014521742","https://openalex.org/W2537716684","https://openalex.org/W2369915283","https://openalex.org/W1592704263","https://openalex.org/W2117518154","https://openalex.org/W2372249525","https://openalex.org/W2386329913"],"abstract_inverted_index":{"The":[0,16,48,95],"paper":[1],"presents":[2],"a":[3,11,35,43,58,67,98,105,141],"monolithic":[4],"vacuum":[5,68,77,126,136],"packaging":[6,127],"methodology":[7],"specifically":[8],"tailored":[9],"for":[10,128],"CMOS":[12,21,37],"MEMS":[13,22,38],"resonator":[14,39,83],"oscillator.":[15],"chip":[17],"fabrication":[18],"follows":[19],"standardized":[20],"process,":[23],"ensuring":[24],"measurement":[25],"consistency":[26],"and":[27,54,88,104,144],"yielding":[28],"dies":[29],"with":[30,42,111],"stable":[31,146],"frequencies.":[32],"We":[33],"designed":[34],"0.18\u00b5m":[36],"oscillator":[40,49,96,131],"integrated":[41],"tunable":[44],"transimpedance":[45],"amplifier":[46],"(TIA).":[47],"operates":[50],"at":[51],"36":[52],"kHz":[53],"is":[55],"sealed":[56],"within":[57],"ceramic":[59],"dual":[60],"in-line":[61],"package":[62],"using":[63],"adhesive":[64],"encapsulation":[65],"under":[66],"pressure":[69],"of":[70,76,101,108],"20":[71],"mTorr.":[72],"After":[73],"five":[74],"months":[75],"maintenance":[78],"testing,":[79],"deviations":[80],"in":[81],"the":[82,129],"oscillator's":[84],"quality":[85],"factor,":[86],"amplitude,":[87],"resonant":[89,130],"frequency":[90],"remain":[91],"consistently":[92],"below":[93],"0.1%.":[94],"achieves":[97],"signal-to-noise":[99],"ratio":[100],"100":[102,116],"dbc/sqrt(Hz)":[103],"phase":[106],"jitter":[107],"8.2":[109],"ns":[110],"an":[112],"integration":[113],"bandwidth":[114],"from":[115],"Hz":[117],"to":[118],"16":[119],"kHz.":[120],"Experimental":[121],"results":[122],"demonstrate":[123],"that":[124],"this":[125],"can":[132],"successfully":[133],"achieve":[134],"medium":[135],"sealing":[137],"(20":[138],"mTorr)":[139],"over":[140],"long":[142],"period":[143],"maintain":[145],"component":[147],"characteristics.":[148]},"counts_by_year":[],"updated_date":"2025-12-19T19:40:27.379048","created_date":"2025-10-10T00:00:00"}