{"id":"https://openalex.org/W4389077945","doi":"https://doi.org/10.1109/sensors56945.2023.10325154","title":"TiN-C Based CMOS MEMS Pirani Gauge for on-Chip Pressure Measurement","display_name":"TiN-C Based CMOS MEMS Pirani Gauge for on-Chip Pressure Measurement","publication_year":2023,"publication_date":"2023-10-29","ids":{"openalex":"https://openalex.org/W4389077945","doi":"https://doi.org/10.1109/sensors56945.2023.10325154"},"language":"en","primary_location":{"id":"doi:10.1109/sensors56945.2023.10325154","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors56945.2023.10325154","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023677707","display_name":"Manu Garg","orcid":"https://orcid.org/0000-0001-6752-9812"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]},{"id":"https://openalex.org/I68891433","display_name":"Indian Institute of Technology Delhi","ror":"https://ror.org/049tgcd06","country_code":"IN","type":"education","lineage":["https://openalex.org/I68891433"]}],"countries":["IN","TW"],"is_corresponding":true,"raw_author_name":"Manu Garg","raw_affiliation_strings":["Indian Institute of Technology Delhi (IITD),Centre for Applied Research in Electronics (CARE),New Delhi,India,110016","International College of Semiconductor Technology (ICST), National Yang Ming Chiao Tung University (NYCU), Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indian Institute of Technology Delhi (IITD),Centre for Applied Research in Electronics (CARE),New Delhi,India,110016","institution_ids":["https://openalex.org/I68891433"]},{"raw_affiliation_string":"International College of Semiconductor Technology (ICST), National Yang Ming Chiao Tung University (NYCU), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113056307","display_name":"F. Tsai","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Fang Wei Tsai","raw_affiliation_strings":["National Yang Ming Chiao Tung University (NYCU),Department of Electronics and Electrical Engineering,Hsinchu,Taiwan,30010"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Yang Ming Chiao Tung University (NYCU),Department of Electronics and Electrical Engineering,Hsinchu,Taiwan,30010","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077460228","display_name":"Khanjan Joshi","orcid":"https://orcid.org/0000-0002-1085-884X"},"institutions":[{"id":"https://openalex.org/I68891433","display_name":"Indian Institute of Technology Delhi","ror":"https://ror.org/049tgcd06","country_code":"IN","type":"education","lineage":["https://openalex.org/I68891433"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Khanjan Joshi","raw_affiliation_strings":["Indian Institute of Technology Delhi (IITD),Centre for Applied Research in Electronics (CARE),New Delhi,India,110016"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indian Institute of Technology Delhi (IITD),Centre for Applied Research in Electronics (CARE),New Delhi,India,110016","institution_ids":["https://openalex.org/I68891433"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110171821","display_name":"Yi Chiu","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi Chiu","raw_affiliation_strings":["International College of Semiconductor Technology (ICST), National Yang Ming Chiao Tung University (NYCU),Hsinchu,Taiwan,30010","Department of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University (NYCU), Hsinchu, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"International College of Semiconductor Technology (ICST), National Yang Ming Chiao Tung University (NYCU),Hsinchu,Taiwan,30010","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University (NYCU), Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5014199984","display_name":"Pushpapraj Singh","orcid":"https://orcid.org/0000-0002-5894-7534"},"institutions":[{"id":"https://openalex.org/I68891433","display_name":"Indian Institute of Technology Delhi","ror":"https://ror.org/049tgcd06","country_code":"IN","type":"education","lineage":["https://openalex.org/I68891433"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Pushpapraj Singh","raw_affiliation_strings":["Indian Institute of Technology Delhi (IITD),Centre for Applied Research in Electronics (CARE),New Delhi,India,110016"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indian Institute of Technology Delhi (IITD),Centre for Applied Research in Electronics (CARE),New Delhi,India,110016","institution_ids":["https://openalex.org/I68891433"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5023677707"],"corresponding_institution_ids":["https://openalex.org/I148366613","https://openalex.org/I68891433"],"apc_list":null,"apc_paid":null,"fwci":0.1272,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.46400754,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tin","display_name":"Tin","score":0.6978762149810791},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6598042845726013},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6022027730941772},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5519886016845703},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.5149772763252258},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4668206572532654},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.45491790771484375},{"id":"https://openalex.org/keywords/thermal-conduction","display_name":"Thermal conduction","score":0.4419768750667572},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.359531044960022},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15406128764152527},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11211150884628296},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.07285010814666748}],"concepts":[{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.6978762149810791},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6598042845726013},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6022027730941772},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5519886016845703},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.5149772763252258},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4668206572532654},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.45491790771484375},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.4419768750667572},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.359531044960022},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15406128764152527},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11211150884628296},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.07285010814666748}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/sensors56945.2023.10325154","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors56945.2023.10325154","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.699999988079071,"id":"https://metadata.un.org/sdg/7"}],"awards":[{"id":"https://openalex.org/G4679959228","display_name":null,"funder_award_id":"NSTC 112-2221-E-A49-066-MY3","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"}],"funders":[{"id":"https://openalex.org/F4320322589","display_name":"Taiwan Semiconductor Manufacturing Company","ror":"https://ror.org/02wx79d08"},{"id":"https://openalex.org/F4320322795","display_name":"Ministry of Science and Technology, Taiwan","ror":"https://ror.org/02kv4zf79"},{"id":"https://openalex.org/F4320323092","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1966965526","https://openalex.org/W2103125677","https://openalex.org/W2108128601","https://openalex.org/W2522543064","https://openalex.org/W2743248935","https://openalex.org/W2971791416","https://openalex.org/W2995808697","https://openalex.org/W3157313459","https://openalex.org/W3161887940","https://openalex.org/W4212992443","https://openalex.org/W4224951190","https://openalex.org/W4282937969","https://openalex.org/W4317727185"],"related_works":["https://openalex.org/W1148372108","https://openalex.org/W2492470561","https://openalex.org/W2040310861","https://openalex.org/W2273391071","https://openalex.org/W2332218522","https://openalex.org/W2312192749","https://openalex.org/W2315775211","https://openalex.org/W1972530813","https://openalex.org/W1995598804","https://openalex.org/W2199674021"],"abstract_inverted_index":{"The":[0,13],"paper":[1],"presents":[2],"a":[3,19,24,43,64,72,100],"monolithically":[4],"integrable":[5],"CMOS":[6,29],"back-end-of-line":[7],"(BEOL)":[8],"integrated":[9],"MEMS":[10],"Pirani":[11],"gauge.":[12],"proposed":[14],"idea":[15],"is":[16,40],"implemented":[17],"using":[18],"TiN-C":[20],"platform":[21],"based":[22],"on":[23],"0.35":[25],"\u03bcm":[26],"2P4M":[27],"commercial":[28],"process.":[30],"In":[31],"the":[32,37,48,69,88,96,106,123],"given":[33],"implementation,":[34],"TiN":[35],"in":[36,92],"interconnect":[38],"layer":[39],"explored":[41],"as":[42],"heating":[44],"element.":[45],"Owing":[46],"to":[47,79],"lower":[49],"thermal":[50,57],"conductivity":[51],"(~4":[52],"W/m.K)":[53],"of":[54,59,87,103,118],"TiN,":[55],"excellent":[56,93,110],"isolation":[58],"intermetal":[60],"dielectric":[61],"layers,":[62],"and":[63],"narrow":[65],"vertical":[66],"conduction":[67],"gap,":[68],"gauge":[70,108],"exhibits":[71],"wide":[73],"dynamic":[74],"range":[75],"from":[76],"26":[77],"Pa":[78],"10":[80],"<sup":[81],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[82],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">6</sup>":[83],"Pa.":[84],"Experimental":[85],"results":[86],"fabricated":[89,107],"devices":[90],"are":[91],"agreement":[94],"with":[95,99],"simulated":[97],"curve":[98],"maximum":[101],"error":[102,116],"0.04%.":[104],"Additionally,":[105],"demonstrates":[109],"reproducibility":[111],"while":[112],"maintaining":[113],"an":[114],"acceptable":[115],"margin":[117],"\u2264":[119],"0.01":[120],"%":[121],"over":[122],"entire":[124],"range.":[125]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2026-05-03T08:25:01.440150","created_date":"2025-10-10T00:00:00"}