{"id":"https://openalex.org/W4311413155","doi":"https://doi.org/10.1109/sensors52175.2022.9967313","title":"Integration of a humidity sensor with power electronic applications","display_name":"Integration of a humidity sensor with power electronic applications","publication_year":2022,"publication_date":"2022-10-30","ids":{"openalex":"https://openalex.org/W4311413155","doi":"https://doi.org/10.1109/sensors52175.2022.9967313"},"language":"en","primary_location":{"id":"doi:10.1109/sensors52175.2022.9967313","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors52175.2022.9967313","pdf_url":null,"source":{"id":"https://openalex.org/S4363604906","display_name":"2022 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Sensors","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100731420","display_name":"Weiyi Chen","orcid":"https://orcid.org/0000-0003-1702-5653"},"institutions":[{"id":"https://openalex.org/I4210148684","display_name":"Fraunhofer Institute for Integrated Systems and Device Technology","ror":"https://ror.org/04q5rka56","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210148684","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Weiyi Chen","raw_affiliation_strings":["Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","institution_ids":["https://openalex.org/I4210148684"]},{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany","institution_ids":["https://openalex.org/I4210148684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083031956","display_name":"Alexander Berwald","orcid":"https://orcid.org/0009-0008-1593-200X"},"institutions":[{"id":"https://openalex.org/I4210148684","display_name":"Fraunhofer Institute for Integrated Systems and Device Technology","ror":"https://ror.org/04q5rka56","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210148684","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Alexander Berwald","raw_affiliation_strings":["Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","institution_ids":["https://openalex.org/I4210148684"]},{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany","institution_ids":["https://openalex.org/I4210148684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004980609","display_name":"Alicia Hauke","orcid":"https://orcid.org/0000-0002-7967-5996"},"institutions":[{"id":"https://openalex.org/I4210148684","display_name":"Fraunhofer Institute for Integrated Systems and Device Technology","ror":"https://ror.org/04q5rka56","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210148684","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Alicia Hauke","raw_affiliation_strings":["Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","institution_ids":["https://openalex.org/I4210148684"]},{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany","institution_ids":["https://openalex.org/I4210148684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083548301","display_name":"Victoria Zimmermann","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148684","display_name":"Fraunhofer Institute for Integrated Systems and Device Technology","ror":"https://ror.org/04q5rka56","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210148684","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Victoria Zimmermann","raw_affiliation_strings":["Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","institution_ids":["https://openalex.org/I4210148684"]},{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany","institution_ids":["https://openalex.org/I4210148684"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110853452","display_name":"Christoph Friedrich Bayer","orcid":null},"institutions":[{"id":"https://openalex.org/I4210148684","display_name":"Fraunhofer Institute for Integrated Systems and Device Technology","ror":"https://ror.org/04q5rka56","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210148684","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christoph F. Bayer","raw_affiliation_strings":["Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","institution_ids":["https://openalex.org/I4210148684"]},{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany","institution_ids":["https://openalex.org/I4210148684"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049185009","display_name":"Michael P. M. Jank","orcid":"https://orcid.org/0000-0002-6523-2684"},"institutions":[{"id":"https://openalex.org/I4210148684","display_name":"Fraunhofer Institute for Integrated Systems and Device Technology","ror":"https://ror.org/04q5rka56","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210148684","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Michael P.M. Jank","raw_affiliation_strings":["Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany"],"raw_orcid":"https://orcid.org/0000-0002-6523-2684","affiliations":[{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB),Erlangen,Germany","institution_ids":["https://openalex.org/I4210148684"]},{"raw_affiliation_string":"Hybrid Integration, Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Erlangen, Germany","institution_ids":["https://openalex.org/I4210148684"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210148684"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.23125375,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10461","display_name":"Gas Sensing Nanomaterials and Sensors","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11472","display_name":"Analytical Chemistry and Sensors","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/1502","display_name":"Bioengineering"},"field":{"id":"https://openalex.org/fields/15","display_name":"Chemical Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/humidity","display_name":"Humidity","score":0.7871264219284058},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.7594791650772095},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.7270227670669556},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6819880604743958},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6417155861854553},{"id":"https://openalex.org/keywords/potting","display_name":"Potting","score":0.5081524848937988},{"id":"https://openalex.org/keywords/power-electronics","display_name":"Power electronics","score":0.4719278812408447},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.4458603262901306},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.42555558681488037},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.37456414103507996},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3659597337245941},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.3191336393356323},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.17233285307884216},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16378292441368103},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.10225057601928711}],"concepts":[{"id":"https://openalex.org/C151420433","wikidata":"https://www.wikidata.org/wiki/Q180600","display_name":"Humidity","level":2,"score":0.7871264219284058},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.7594791650772095},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.7270227670669556},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6819880604743958},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6417155861854553},{"id":"https://openalex.org/C115008941","wikidata":"https://www.wikidata.org/wiki/Q7235355","display_name":"Potting","level":2,"score":0.5081524848937988},{"id":"https://openalex.org/C178911571","wikidata":"https://www.wikidata.org/wiki/Q593143","display_name":"Power electronics","level":3,"score":0.4719278812408447},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.4458603262901306},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.42555558681488037},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37456414103507996},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3659597337245941},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.3191336393356323},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.17233285307884216},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16378292441368103},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.10225057601928711},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/sensors52175.2022.9967313","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors52175.2022.9967313","pdf_url":null,"source":{"id":"https://openalex.org/S4363604906","display_name":"2022 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Sensors","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/430409","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/430409","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G6816601860","display_name":null,"funder_award_id":"16EMO0321","funder_id":"https://openalex.org/F4320321114","funder_display_name":"Bundesministerium f\u00fcr Bildung und Forschung"}],"funders":[{"id":"https://openalex.org/F4320321114","display_name":"Bundesministerium f\u00fcr Bildung und Forschung","ror":"https://ror.org/04pz7b180"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1561172678","https://openalex.org/W1604552011","https://openalex.org/W1968693414","https://openalex.org/W2052181616","https://openalex.org/W2260960995","https://openalex.org/W6982603291"],"related_works":["https://openalex.org/W2362331110","https://openalex.org/W4289704098","https://openalex.org/W2393523157","https://openalex.org/W2057617908","https://openalex.org/W2351867721","https://openalex.org/W2134746914","https://openalex.org/W2312410299","https://openalex.org/W2054872892","https://openalex.org/W2371592224","https://openalex.org/W2939480989"],"abstract_inverted_index":{"Humidity":[0],"sensing":[1,105],"inside":[2],"power":[3,128],"electronic":[4,26],"modules":[5],"is":[6,87,122],"an":[7,54],"important":[8],"condition":[9],"monitoring":[10],"tool,":[11],"as":[12,79,81,124],"humidity":[13,29,76,115],"induced":[14],"corrosion":[15],"processes":[16],"can":[17],"lead":[18],"to":[19,52],"the":[20,44,73,90,93,101,104,112],"failure":[21],"of":[22,35,75,92,103,114],"devices":[23],"and":[24,64,107],"whole":[25],"systems.":[27],"A":[28],"sensor":[30,56],"based":[31],"on":[32],"capacitive":[33],"characterization":[34],"interdigitated":[36],"metal":[37],"electrode":[38],"structures":[39],"was":[40,50],"developed":[41],"together":[42],"with":[43,58],"corresponding":[45],"readout":[46],"electronics.":[47,129],"FEM":[48],"simulation":[49],"used":[51,123],"elaborate":[53],"optimized":[55],"structure":[57],"a":[59,97],"maximal":[60],"gain":[61],"in":[62,77,82,89,96,117,127],"capacitance":[63],"appropriate":[65],"basic":[66],"capacitance.":[67],"Electric":[68],"field":[69],"simulations":[70],"show":[71],"that":[72,121],"measurement":[74],"air":[78],"well":[80],"water":[83],"absorbing":[84],"solid-state":[85],"materials":[86],"possible":[88],"vicinity":[91],"sensor.":[94],"Experiments":[95],"climatic":[98],"chamber":[99],"verify":[100],"functionality":[102],"system":[106],"proof":[108],"its":[109],"suitability":[110],"for":[111],"detection":[113],"uptake":[116],"silicone":[118],"potting":[119],"gel":[120],"insulation":[125],"material":[126]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-02T09:51:11.867554","created_date":"2025-10-10T00:00:00"}