{"id":"https://openalex.org/W4310880210","doi":"https://doi.org/10.1109/sensors52175.2022.9967127","title":"A Heat Conduction Structure for the Etching Process of MEMS Devices with Support Anchors","display_name":"A Heat Conduction Structure for the Etching Process of MEMS Devices with Support Anchors","publication_year":2022,"publication_date":"2022-10-30","ids":{"openalex":"https://openalex.org/W4310880210","doi":"https://doi.org/10.1109/sensors52175.2022.9967127"},"language":"en","primary_location":{"id":"doi:10.1109/sensors52175.2022.9967127","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors52175.2022.9967127","pdf_url":null,"source":{"id":"https://openalex.org/S4363604906","display_name":"2022 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Sensors","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074419263","display_name":"Jianjun Ma","orcid":"https://orcid.org/0000-0002-7799-0167"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Jianjun Ma","raw_affiliation_strings":["Tsinghua University,Department of Precision Instrument,Beijing,China,100084"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036651728","display_name":"Bowen Xing","orcid":"https://orcid.org/0000-0002-4283-6485"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bowen Xing","raw_affiliation_strings":["Tsinghua University,Department of Precision Instrument,Beijing,China,100084"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100704522","display_name":"Pu Chen","orcid":"https://orcid.org/0000-0002-6706-8291"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Pu Chen","raw_affiliation_strings":["East China Institute of Photo-Electron IC,Bengbu,China,233030"],"affiliations":[{"raw_affiliation_string":"East China Institute of Photo-Electron IC,Bengbu,China,233030","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016259130","display_name":"Bin Zhou","orcid":"https://orcid.org/0000-0002-7206-6418"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bin Zhou","raw_affiliation_strings":["Tsinghua University,Department of Precision Instrument,Beijing,China,100084"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075311656","display_name":"Qi Wei","orcid":"https://orcid.org/0000-0003-3189-7562"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qi Wei","raw_affiliation_strings":["Tsinghua University,Department of Precision Instrument,Beijing,China,100084"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5022325814","display_name":"Rong Zhang","orcid":"https://orcid.org/0000-0002-9872-2954"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Rong Zhang","raw_affiliation_strings":["Tsinghua University,Department of Precision Instrument,Beijing,China,100084"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,Department of Precision Instrument,Beijing,China,100084","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5074419263"],"corresponding_institution_ids":["https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.44612929,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":1.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":1.0,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.8046461939811707},{"id":"https://openalex.org/keywords/thermal-conduction","display_name":"Thermal conduction","score":0.7928870916366577},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.762333869934082},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7583563327789307},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7497144341468811},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7397302389144897},{"id":"https://openalex.org/keywords/scanning-electron-microscope","display_name":"Scanning electron microscope","score":0.601355791091919},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5233951210975647},{"id":"https://openalex.org/keywords/conduction-electron","display_name":"Conduction electron","score":0.5073601603507996},{"id":"https://openalex.org/keywords/isotropic-etching","display_name":"Isotropic etching","score":0.46277105808258057},{"id":"https://openalex.org/keywords/dry-etching","display_name":"Dry etching","score":0.45557206869125366},{"id":"https://openalex.org/keywords/homogeneity","display_name":"Homogeneity (statistics)","score":0.4265035390853882},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.40022340416908264},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.37109166383743286},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.06611156463623047}],"concepts":[{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.8046461939811707},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.7928870916366577},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.762333869934082},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7583563327789307},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7497144341468811},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7397302389144897},{"id":"https://openalex.org/C26771246","wikidata":"https://www.wikidata.org/wiki/Q321095","display_name":"Scanning electron microscope","level":2,"score":0.601355791091919},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5233951210975647},{"id":"https://openalex.org/C2992503781","wikidata":"https://www.wikidata.org/wiki/Q528769","display_name":"Conduction electron","level":3,"score":0.5073601603507996},{"id":"https://openalex.org/C33220542","wikidata":"https://www.wikidata.org/wiki/Q6086567","display_name":"Isotropic etching","level":4,"score":0.46277105808258057},{"id":"https://openalex.org/C1291036","wikidata":"https://www.wikidata.org/wiki/Q1191918","display_name":"Dry etching","level":4,"score":0.45557206869125366},{"id":"https://openalex.org/C142259097","wikidata":"https://www.wikidata.org/wiki/Q5891314","display_name":"Homogeneity (statistics)","level":2,"score":0.4265035390853882},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.40022340416908264},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.37109166383743286},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.06611156463623047},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/sensors52175.2022.9967127","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors52175.2022.9967127","pdf_url":null,"source":{"id":"https://openalex.org/S4363604906","display_name":"2022 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Sensors","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4399999976158142,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1994102683","https://openalex.org/W2027872603","https://openalex.org/W2049751832","https://openalex.org/W2308336328","https://openalex.org/W2802749458","https://openalex.org/W6648885282"],"related_works":["https://openalex.org/W2045553774","https://openalex.org/W2011001474","https://openalex.org/W2093631838","https://openalex.org/W4387743859","https://openalex.org/W2542354647","https://openalex.org/W4388394548","https://openalex.org/W2196738352","https://openalex.org/W1991288435","https://openalex.org/W2065825709","https://openalex.org/W2094633807"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"a":[3],"heat":[4,14,41,49,72],"conduction":[5,42,50],"structure":[6],"(HCS)":[7],"is":[8,38,124],"designed":[9],"to":[10,69,116],"conduct":[11],"the":[12,16,20,30,35,39,57,62,66,70,76,81,95,103,106,119],"concentrated":[13],"on":[15],"etched":[17],"wafer":[18],"in":[19,44,52],"etching":[21,33,77,92,111],"process":[22],"of":[23,48,65,94,105,122],"MEMS":[24],"devices":[25],"with":[26,56],"support":[27],"anchors.":[28,60],"During":[29],"reactive":[31,87],"ion":[32,88],"process,":[34],"anchor":[36],"layer":[37],"main":[40],"path":[43,51],"vacuum.":[45],"The":[46,83,108],"length":[47],"different":[53],"locations":[54],"varies":[55],"distance":[58],"from":[59,114],"Therefore,":[61],"uneven":[63],"contribution":[64],"anchors":[67],"leads":[68],"local":[71],"concentration,":[73],"which":[74],"worsens":[75],"homogeneity":[78],"and":[79,89,99,118],"causes":[80],"over-etching.":[82],"HCS":[84],"also":[85],"consumes":[86],"then":[90],"reduces":[91],"defect":[93,121],"sidewalls.":[96],"FE":[97],"simulations":[98],"experiments":[100],"have":[101],"verified":[102],"effectiveness":[104],"structure.":[107],"average":[109],"over-":[110],"value":[112],"decreases":[113],"O.87\u03bcm":[115],"O.20\u03bcm":[117],"profile":[120],"sidewalls":[123],"significantly":[125],"improved":[126],"as":[127],"observed":[128],"by":[129],"Scanning":[130],"Electron":[131],"Microscope.":[132]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}