{"id":"https://openalex.org/W4311214826","doi":"https://doi.org/10.1109/sensors52175.2022.9967038","title":"Non-Invasive Calorimetric Sensor for Waterflow Event Detection in Premise Plumbing Systems","display_name":"Non-Invasive Calorimetric Sensor for Waterflow Event Detection in Premise Plumbing Systems","publication_year":2022,"publication_date":"2022-10-30","ids":{"openalex":"https://openalex.org/W4311214826","doi":"https://doi.org/10.1109/sensors52175.2022.9967038"},"language":"en","primary_location":{"id":"doi:10.1109/sensors52175.2022.9967038","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors52175.2022.9967038","pdf_url":null,"source":{"id":"https://openalex.org/S4363604906","display_name":"2022 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Sensors","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112458109","display_name":"Chandrashekhar Choudhary","orcid":null},"institutions":[{"id":"https://openalex.org/I63135867","display_name":"University of Cincinnati","ror":"https://ror.org/01e3m7079","country_code":"US","type":"education","lineage":["https://openalex.org/I63135867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Chandrashekhar Choudhary","raw_affiliation_strings":["University of Cincinnati,Department of Electrical and Computer Engineering,Ohio,USA","Department of Electrical and Computer Engineering, University of Cincinnati, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cincinnati,Department of Electrical and Computer Engineering,Ohio,USA","institution_ids":["https://openalex.org/I63135867"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Cincinnati, Ohio, USA","institution_ids":["https://openalex.org/I63135867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043053837","display_name":"Gagan Batra","orcid":null},"institutions":[{"id":"https://openalex.org/I63135867","display_name":"University of Cincinnati","ror":"https://ror.org/01e3m7079","country_code":"US","type":"education","lineage":["https://openalex.org/I63135867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gagan Batra","raw_affiliation_strings":["University of Cincinnati,Department of Electrical and Computer Engineering,Ohio,USA","Department of Electrical and Computer Engineering, University of Cincinnati, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cincinnati,Department of Electrical and Computer Engineering,Ohio,USA","institution_ids":["https://openalex.org/I63135867"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Cincinnati, Ohio, USA","institution_ids":["https://openalex.org/I63135867"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052577681","display_name":"Steven G. Buchberger","orcid":"https://orcid.org/0000-0002-8795-1583"},"institutions":[{"id":"https://openalex.org/I63135867","display_name":"University of Cincinnati","ror":"https://ror.org/01e3m7079","country_code":"US","type":"education","lineage":["https://openalex.org/I63135867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Steven G. Buchberger","raw_affiliation_strings":["University of Cincinnati,Department of Civil and Architectural Engineering and Construction Management,Ohio,USA","Department of Civil and Architectural Engineering and Construction Management, University of Cincinnati, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cincinnati,Department of Civil and Architectural Engineering and Construction Management,Ohio,USA","institution_ids":["https://openalex.org/I63135867"]},{"raw_affiliation_string":"Department of Civil and Architectural Engineering and Construction Management, University of Cincinnati, Ohio, USA","institution_ids":["https://openalex.org/I63135867"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100455385","display_name":"Tao Li","orcid":"https://orcid.org/0000-0003-3046-1791"},"institutions":[{"id":"https://openalex.org/I63135867","display_name":"University of Cincinnati","ror":"https://ror.org/01e3m7079","country_code":"US","type":"education","lineage":["https://openalex.org/I63135867"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tao Li","raw_affiliation_strings":["University of Cincinnati,Department of Electrical and Computer Engineering,Ohio,USA","Department of Electrical and Computer Engineering, University of Cincinnati, Ohio, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Cincinnati,Department of Electrical and Computer Engineering,Ohio,USA","institution_ids":["https://openalex.org/I63135867"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Cincinnati, Ohio, USA","institution_ids":["https://openalex.org/I63135867"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I63135867"],"apc_list":null,"apc_paid":null,"fwci":0.8154,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.71421371,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11220","display_name":"Water Systems and Optimization","score":0.9894000291824341,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11220","display_name":"Water Systems and Optimization","score":0.9894000291824341,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9883000254631042,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9674999713897705,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/offset","display_name":"Offset (computer science)","score":0.7029611468315125},{"id":"https://openalex.org/keywords/thermal-conduction","display_name":"Thermal conduction","score":0.5220082402229309},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5162174701690674},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.4948429465293884},{"id":"https://openalex.org/keywords/thermocouple","display_name":"Thermocouple","score":0.45853859186172485},{"id":"https://openalex.org/keywords/real-time-computing","display_name":"Real-time computing","score":0.36932066082954407},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3545522093772888},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.33754509687423706},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32766515016555786},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3171345889568329},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.289404034614563},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07915839552879333}],"concepts":[{"id":"https://openalex.org/C175291020","wikidata":"https://www.wikidata.org/wiki/Q1156822","display_name":"Offset (computer science)","level":2,"score":0.7029611468315125},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.5220082402229309},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5162174701690674},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.4948429465293884},{"id":"https://openalex.org/C168068576","wikidata":"https://www.wikidata.org/wiki/Q190241","display_name":"Thermocouple","level":2,"score":0.45853859186172485},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.36932066082954407},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3545522093772888},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.33754509687423706},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32766515016555786},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3171345889568329},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.289404034614563},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07915839552879333},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/sensors52175.2022.9967038","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors52175.2022.9967038","pdf_url":null,"source":{"id":"https://openalex.org/S4363604906","display_name":"2022 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Sensors","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.47999998927116394,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"},{"score":0.44999998807907104,"display_name":"Clean water and sanitation","id":"https://metadata.un.org/sdg/6"}],"awards":[{"id":"https://openalex.org/G6451526363","display_name":null,"funder_award_id":"70NANB21H014,70NANB21H181","funder_id":"https://openalex.org/F4320332178","funder_display_name":"National Institute of Standards and Technology"}],"funders":[{"id":"https://openalex.org/F4320332178","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W2016423999","https://openalex.org/W2325306420","https://openalex.org/W2506500377","https://openalex.org/W2557480894","https://openalex.org/W2783015207","https://openalex.org/W2883929067","https://openalex.org/W2885474337","https://openalex.org/W2887794915","https://openalex.org/W2889251582","https://openalex.org/W2920072928","https://openalex.org/W2924161473","https://openalex.org/W2971209107","https://openalex.org/W2980091012","https://openalex.org/W3012333312","https://openalex.org/W3023643304","https://openalex.org/W3083495575","https://openalex.org/W4311413078","https://openalex.org/W6747483613","https://openalex.org/W6783072027"],"related_works":["https://openalex.org/W2112582741","https://openalex.org/W3216017874","https://openalex.org/W2966484342","https://openalex.org/W4285295200","https://openalex.org/W2025687625","https://openalex.org/W2387797796","https://openalex.org/W2019795571","https://openalex.org/W2115727343","https://openalex.org/W2035119797","https://openalex.org/W2379282466"],"abstract_inverted_index":{"Non-invasive":[0],"and":[1,51,67,89,101,112,148],"low-cost":[2,29],"sensors":[3,56,81],"for":[4,13,33],"waterflow":[5,37],"event":[6],"detection":[7,35],"are":[8],"required":[9],"to":[10,59,96,102],"determine":[11],"p-values":[12],"the":[14,46,61,65,70,110,146,151],"estimation":[15],"of":[16,36,121,150],"peak":[17],"water":[18,68,141],"demand":[19],"during":[20],"premise":[21],"plumbing":[22],"system":[23],"design.":[24],"This":[25],"paper":[26],"presents":[27],"a":[28,42,49,134],"calorimetric":[30],"flow":[31],"sensor":[32,90,116],"non-invasive":[34],"inside":[38],"copper":[39],"waterpipes.":[40,124],"As":[41],"critical":[43],"design":[44],"parameter,":[45],"distance":[47],"between":[48,64,109],"heater":[50,66,87,111],"two":[52],"symmetrically":[53],"placed":[54],"temperature":[55,80,113,135],"was":[57],"optimized":[58],"maximize":[60],"thermal":[62],"coupling":[63],"through":[69],"pipe":[71],"wall.":[72],"A":[73],"printed":[74],"circuit":[75],"board":[76],"with":[77,94,133,139],"commercial":[78],"high-resolution":[79],"as":[82,84],"well":[83],"precision":[85],"3D-printed":[86],"bridge":[88],"mount":[91,117],"were":[92],"designed":[93],"features":[95],"improve":[97],"heat":[98,106,130],"conduction":[99,107,131],"symmetry":[100,132],"minimize":[103],"undesired":[104],"direct":[105],"paths":[108],"sensors.":[114],"The":[115,125],"also":[118],"allows":[119],"ease":[120],"deployment":[122],"on":[123],"assembled":[126],"device":[127],"showed":[128],"excellent":[129],"offset":[136],"<0.054\u00b0C.":[137],"Tests":[138],"emulated":[140],"on/off":[142],"events":[143],"successfully":[144],"verified":[145],"operation":[147],"functions":[149],"sensor.":[152]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}