{"id":"https://openalex.org/W3110905233","doi":"https://doi.org/10.1109/sensors47125.2020.9278669","title":"Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB","display_name":"Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB","publication_year":2020,"publication_date":"2020-10-25","ids":{"openalex":"https://openalex.org/W3110905233","doi":"https://doi.org/10.1109/sensors47125.2020.9278669","mag":"3110905233"},"language":"en","primary_location":{"id":"doi:10.1109/sensors47125.2020.9278669","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors47125.2020.9278669","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://hdl.handle.net/2078.1/243580","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070055225","display_name":"Serguei Stoukatch","orcid":"https://orcid.org/0000-0002-5060-4086"},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Serguei Stoukatch","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Microsys lab, Liege University, Seraing, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Microsys lab, Liege University, Seraing, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102004307","display_name":"Nicol\u00e1s Andr\u00e9","orcid":"https://orcid.org/0000-0002-1514-028X"},"institutions":[{"id":"https://openalex.org/I95674353","display_name":"UCLouvain","ror":"https://ror.org/02495e989","country_code":"BE","type":"education","lineage":["https://openalex.org/I95674353"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Nicolas Andre","raw_affiliation_strings":["Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 Catholique de Louvain, Louvain-la-Neuve, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 Catholique de Louvain, Louvain-la-Neuve, Belgium","institution_ids":["https://openalex.org/I95674353"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032510689","display_name":"Thibault Delhaye","orcid":"https://orcid.org/0000-0002-3433-8638"},"institutions":[{"id":"https://openalex.org/I95674353","display_name":"UCLouvain","ror":"https://ror.org/02495e989","country_code":"BE","type":"education","lineage":["https://openalex.org/I95674353"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Thibault Delhaye","raw_affiliation_strings":["Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 Catholique de Louvain, Louvain-la-Neuve, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 Catholique de Louvain, Louvain-la-Neuve, Belgium","institution_ids":["https://openalex.org/I95674353"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001225623","display_name":"F. Dupont","orcid":"https://orcid.org/0000-0002-2939-4694"},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Francois Dupont","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Microsys lab, Liege University, Seraing, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Microsys lab, Liege University, Seraing, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027098050","display_name":"Jean\u2010Michel Redout\u00e9","orcid":"https://orcid.org/0000-0001-9612-4312"},"institutions":[{"id":"https://openalex.org/I157674565","display_name":"University of Li\u00e8ge","ror":"https://ror.org/00afp2z80","country_code":"BE","type":"education","lineage":["https://openalex.org/I157674565"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Jean-Michel Redoute","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Microsys lab, Liege University, Seraing, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Microsys lab, Liege University, Seraing, Belgium","institution_ids":["https://openalex.org/I157674565"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064026729","display_name":"Denis Flandre","orcid":"https://orcid.org/0000-0001-5298-5196"},"institutions":[{"id":"https://openalex.org/I95674353","display_name":"UCLouvain","ror":"https://ror.org/02495e989","country_code":"BE","type":"education","lineage":["https://openalex.org/I95674353"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Denis Flandre","raw_affiliation_strings":["Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 Catholique de Louvain, Louvain-la-Neuve, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Information and Communication Technologies, Electronics and Applied Mathematics (ICTEAM), Universit\u00e9 Catholique de Louvain, Louvain-la-Neuve, Belgium","institution_ids":["https://openalex.org/I95674353"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0853,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.41001776,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.6727086901664734},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.6589831113815308},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6169067621231079},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.583293080329895},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5652216076850891},{"id":"https://openalex.org/keywords/strain-gauge","display_name":"Strain gauge","score":0.5248018503189087},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5088110566139221},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.4828660786151886},{"id":"https://openalex.org/keywords/manufacturing-cost","display_name":"Manufacturing cost","score":0.4390649199485779},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.42819955945014954},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4167032241821289},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.34387022256851196},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.32898128032684326},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3275126814842224},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3202686011791229},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.30774959921836853},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.26598864793777466},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.23717626929283142},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.23657220602035522},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21485406160354614},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.1836387813091278}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.6727086901664734},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.6589831113815308},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6169067621231079},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.583293080329895},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5652216076850891},{"id":"https://openalex.org/C60584519","wikidata":"https://www.wikidata.org/wiki/Q610723","display_name":"Strain gauge","level":2,"score":0.5248018503189087},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5088110566139221},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4828660786151886},{"id":"https://openalex.org/C2778337023","wikidata":"https://www.wikidata.org/wiki/Q6753108","display_name":"Manufacturing cost","level":2,"score":0.4390649199485779},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.42819955945014954},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4167032241821289},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.34387022256851196},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.32898128032684326},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3275126814842224},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3202686011791229},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.30774959921836853},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.26598864793777466},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23717626929283142},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23657220602035522},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21485406160354614},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.1836387813091278},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/sensors47125.2020.9278669","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors47125.2020.9278669","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE SENSORS","raw_type":"proceedings-article"},{"id":"pmh:oai:dial.uclouvain.be:boreal:243580","is_oa":true,"landing_page_url":"http://hdl.handle.net/2078.1/243580","pdf_url":null,"source":{"id":"https://openalex.org/S4306401974","display_name":"DIAL (Catholic University of Leuven)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I99464096","host_organization_name":"KU Leuven","host_organization_lineage":["https://openalex.org/I99464096"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Sensors, Vol. 2020, p. 1-4 (2020)","raw_type":"info:eu-repo/semantics/article"},{"id":"pmh:oai:orbi.ulg.ac.be:2268/256428","is_oa":false,"landing_page_url":"https://orbi.uliege.be/handle/2268/256428","pdf_url":null,"source":{"id":"https://openalex.org/S4306400651","display_name":"Open Repository and Bibliography (University of Li\u00e8ge)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I157674565","host_organization_name":"University of Li\u00e8ge","host_organization_lineage":["https://openalex.org/I157674565"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Proceedings of IEEE Sensors, 1-4 (2020-10-25); 2020 IEEE Sensors, Rotterdam, Netherlands [NL], 25-28 Oct. 2020","raw_type":"http://purl.org/coar/resource_type/c_5794"}],"best_oa_location":{"id":"pmh:oai:dial.uclouvain.be:boreal:243580","is_oa":true,"landing_page_url":"http://hdl.handle.net/2078.1/243580","pdf_url":null,"source":{"id":"https://openalex.org/S4306401974","display_name":"DIAL (Catholic University of Leuven)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I99464096","host_organization_name":"KU Leuven","host_organization_lineage":["https://openalex.org/I99464096"],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Sensors, Vol. 2020, p. 1-4 (2020)","raw_type":"info:eu-repo/semantics/article"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320335322","display_name":"European Regional Development Fund","ror":"https://ror.org/00k4n6c32"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1976904922","https://openalex.org/W2023639429","https://openalex.org/W2046788175","https://openalex.org/W2075968937","https://openalex.org/W2317953216","https://openalex.org/W2603849861","https://openalex.org/W2624951199","https://openalex.org/W2742519254","https://openalex.org/W2770093914","https://openalex.org/W2789868184","https://openalex.org/W2901096064","https://openalex.org/W2942680606","https://openalex.org/W7006502625"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W4232272518","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2115932404","https://openalex.org/W2046757767","https://openalex.org/W2158483827","https://openalex.org/W2097457201"],"abstract_inverted_index":{"We":[0],"developed":[1],"a":[2,29,70],"low-cost":[3],"process":[4,40,60],"for":[5,53],"assembling":[6],"versatile":[7],"sensors":[8],"without":[9,78],"expensive,":[10],"thick":[11],"metal":[12],"finish":[13],"on":[14,75],"rigid":[15],"and":[16,50,56],"flexible":[17,76],"PCB":[18,77],"using":[19],"anisotropic":[20],"conductive":[21],"films":[22],"(ACF)":[23],"flip-chip":[24],"(FC)":[25],"process.":[26],"This":[27],"allows":[28],"lower":[30],"temperature":[31],"budget":[32],"than":[33],"conventional":[34],"FC":[35,39],"assembly.":[36],"The":[37,59],"ACF":[38],"requires":[41],"no":[42],"expensive":[43],"set":[44],"up,":[45],"is":[46],"quick":[47],"to":[48,64],"implement":[49],"suits":[51],"perfectly":[52],"sensor":[54,74],"prototyping":[55],"low-scale":[57],"manufacturing.":[58],"was":[61],"directly":[62],"applied":[63],"assemble":[65],"the":[66],"bare":[67],"die":[68],"of":[69],"CMOS":[71],"strain":[72],"gauge":[73],"compromising":[79],"its":[80],"integrity.":[81]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2020-12-21T00:00:00"}