{"id":"https://openalex.org/W4200541067","doi":"https://doi.org/10.1109/sensors47087.2021.9639769","title":"On The Performance Enhancement of Cantilever Diaphragm Piezoelectric Microphone","display_name":"On The Performance Enhancement of Cantilever Diaphragm Piezoelectric Microphone","publication_year":2021,"publication_date":"2021-10-31","ids":{"openalex":"https://openalex.org/W4200541067","doi":"https://doi.org/10.1109/sensors47087.2021.9639769"},"language":"en","primary_location":{"id":"doi:10.1109/sensors47087.2021.9639769","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors47087.2021.9639769","pdf_url":null,"source":{"id":"https://openalex.org/S4363605007","display_name":"2021 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Sensors","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5057270658","display_name":"Shao-Da Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Shao-Da Wang","raw_affiliation_strings":["Power Mechanical Engineering, National Tsing Hua University"],"affiliations":[{"raw_affiliation_string":"Power Mechanical Engineering, National Tsing Hua University","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100663393","display_name":"Yu\u2013Chen Chen","orcid":"https://orcid.org/0000-0003-0737-9095"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Chen Chen","raw_affiliation_strings":["Institute of NanoEngineering and MicroSystem, National Tsing Hua University"],"affiliations":[{"raw_affiliation_string":"Institute of NanoEngineering and MicroSystem, National Tsing Hua University","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052099493","display_name":"Sung-Cheng Lo","orcid":"https://orcid.org/0000-0003-2467-1960"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Sung-Cheng Lo","raw_affiliation_strings":["Power Mechanical Engineering, National Tsing Hua University"],"affiliations":[{"raw_affiliation_string":"Power Mechanical Engineering, National Tsing Hua University","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084769890","display_name":"Yijia Wang","orcid":"https://orcid.org/0000-0001-9834-8854"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yi-Jia Wang","raw_affiliation_strings":["Power Mechanical Engineering, National Tsing Hua University"],"affiliations":[{"raw_affiliation_string":"Power Mechanical Engineering, National Tsing Hua University","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100892527","display_name":"Mingching Wu","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mingching Wu","raw_affiliation_strings":["Coretronic MEMS Co., Ltd., Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"Coretronic MEMS Co., Ltd., Hsinchu, Taiwan","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109048913","display_name":"Weileun Fang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Weileun Fang","raw_affiliation_strings":["Institute of NanoEngineering and MicroSystem, National Tsing Hua University","Power Mechanical Engineering, National Tsing Hua University"],"affiliations":[{"raw_affiliation_string":"Institute of NanoEngineering and MicroSystem, National Tsing Hua University","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Power Mechanical Engineering, National Tsing Hua University","institution_ids":["https://openalex.org/I25846049"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5057270658"],"corresponding_institution_ids":["https://openalex.org/I25846049"],"apc_list":null,"apc_paid":null,"fwci":0.867,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":{"value":0.65844942,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/figure-of-merit","display_name":"Figure of merit","score":0.8154147267341614},{"id":"https://openalex.org/keywords/microphone","display_name":"Microphone","score":0.6932578086853027},{"id":"https://openalex.org/keywords/diaphragm","display_name":"Diaphragm (acoustics)","score":0.680558979511261},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6628806591033936},{"id":"https://openalex.org/keywords/cantilever","display_name":"Cantilever","score":0.6487324237823486},{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.6371796131134033},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.6302034258842468},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.6283882260322571},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5136927962303162},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.4159832000732422},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2512205243110657},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2178577184677124},{"id":"https://openalex.org/keywords/vibration","display_name":"Vibration","score":0.19688108563423157},{"id":"https://openalex.org/keywords/sound-pressure","display_name":"Sound pressure","score":0.12427368760108948},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10895070433616638},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10520029067993164},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09052318334579468}],"concepts":[{"id":"https://openalex.org/C130277099","wikidata":"https://www.wikidata.org/wiki/Q3676605","display_name":"Figure of merit","level":2,"score":0.8154147267341614},{"id":"https://openalex.org/C2778263558","wikidata":"https://www.wikidata.org/wiki/Q46384","display_name":"Microphone","level":3,"score":0.6932578086853027},{"id":"https://openalex.org/C164292776","wikidata":"https://www.wikidata.org/wiki/Q5271779","display_name":"Diaphragm (acoustics)","level":3,"score":0.680558979511261},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6628806591033936},{"id":"https://openalex.org/C141354745","wikidata":"https://www.wikidata.org/wiki/Q17227","display_name":"Cantilever","level":2,"score":0.6487324237823486},{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.6371796131134033},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.6302034258842468},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.6283882260322571},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5136927962303162},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.4159832000732422},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2512205243110657},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2178577184677124},{"id":"https://openalex.org/C198394728","wikidata":"https://www.wikidata.org/wiki/Q3695508","display_name":"Vibration","level":2,"score":0.19688108563423157},{"id":"https://openalex.org/C68115822","wikidata":"https://www.wikidata.org/wiki/Q1068172","display_name":"Sound pressure","level":2,"score":0.12427368760108948},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10895070433616638},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10520029067993164},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09052318334579468}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/sensors47087.2021.9639769","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sensors47087.2021.9639769","pdf_url":null,"source":{"id":"https://openalex.org/S4363605007","display_name":"2021 IEEE Sensors","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Sensors","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.550000011920929,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320322108","display_name":"Ministry of Science and Technology","ror":"https://ror.org/032e49973"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2085840193","https://openalex.org/W2154722934","https://openalex.org/W2606617551","https://openalex.org/W2996565816","https://openalex.org/W2999602401","https://openalex.org/W4230536724","https://openalex.org/W4244021999"],"related_works":["https://openalex.org/W2107125189","https://openalex.org/W2760996480","https://openalex.org/W2303727101","https://openalex.org/W2368223165","https://openalex.org/W2357307510","https://openalex.org/W2048171849","https://openalex.org/W2009661802","https://openalex.org/W2156270368","https://openalex.org/W2386998121","https://openalex.org/W2373028423"],"abstract_inverted_index":{"This":[0],"study":[1],"demonstrates":[2],"the":[3,20,39,49,57,61,77,86,96,114,131,142],"piezoelectric":[4],"MEMS":[5],"microphone":[6,52],"(Fig.":[7],"1a)":[8],"with":[9,122,133],"cantilever":[10],"diaphragms":[11],"and":[12,63,79,130],"partially":[13,68],"removed":[14,69],"PZT":[15,62,105],"(piezoelectric":[16],"layer)":[17],"to":[18,47,70,84,89,94,107,119,125],"increase":[19],"bandwidth":[21,123],"(BW)":[22],"without":[23,75],"sacrificing":[24,76],"signal-to-noise":[25],"ratio":[26],"(SNR).":[27],"The":[28],"proposed":[29,128,143],"design":[30,144],"in":[31,138],"Fig.":[32],"1a":[33],"has":[34,145],"two":[35,80],"major":[36],"merits:":[37,82],"(1)":[38,83],"figure":[40,58],"of":[41,43,51,59],"merit":[42],"SNR\u00d7BW":[44],"is":[45],"presented":[46],"evaluate":[48],"performance":[50],"design,":[53,129],"(2)":[54,100],"based":[55],"on":[56,104,156],"merit,":[60],"top":[64],"electrode":[65,88],"layers":[66],"are":[67,136],"achieve":[71],"a":[72,146],"better":[73],"BW":[74],"SNR;":[78],"minor":[81],"pattern":[85],"bottom":[87],"reduce":[90,109],"stress-induced":[91],"diaphragm":[92,110],"bending":[93],"lower":[95],"acoustic":[97],"short":[98],"circuit;":[99],"apply":[101],"DC":[102],"bias":[103,155],"layer":[106],"further":[108],"bending.":[111],"Measurements":[112],"demonstrate":[113],"SNR":[115],"at":[116],"1kHz":[117],"up":[118,124],"77.2":[120],"dB":[121,148],"10kHz":[126],"for":[127],"comparison":[132],"reference":[134],"designs":[135],"summarized":[137],"Table":[139],"2.":[140],"Moreover,":[141],"3":[147],"sensitivity":[149],"enhancement":[150],"after":[151],"applying":[152],"10":[153],"V":[154],"PZT.":[157]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2026-03-30T08:08:38.191290","created_date":"2025-10-10T00:00:00"}