{"id":"https://openalex.org/W4297984702","doi":"https://doi.org/10.1109/sbcci55532.2022.9893242","title":"Advanced Thermal Management using Approximate Computing and On-Chip Thermoelectric Cooling","display_name":"Advanced Thermal Management using Approximate Computing and On-Chip Thermoelectric Cooling","publication_year":2022,"publication_date":"2022-08-22","ids":{"openalex":"https://openalex.org/W4297984702","doi":"https://doi.org/10.1109/sbcci55532.2022.9893242"},"language":"en","primary_location":{"id":"doi:10.1109/sbcci55532.2022.9893242","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sbcci55532.2022.9893242","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079463481","display_name":"Hammam Kattan","orcid":"https://orcid.org/0000-0002-3226-4479"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Hammam Kattan","raw_affiliation_strings":["University of Stuttgart,Chair of Semiconductor Test and Reliability,Stuttgart,Germany","Chair of Semiconductor Test and Reliability, University of Stuttgart, Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"University of Stuttgart,Chair of Semiconductor Test and Reliability,Stuttgart,Germany","institution_ids":["https://openalex.org/I100066346"]},{"raw_affiliation_string":"Chair of Semiconductor Test and Reliability, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059133190","display_name":"Hussam Amrouch","orcid":"https://orcid.org/0000-0002-5649-3102"},"institutions":[{"id":"https://openalex.org/I100066346","display_name":"University of Stuttgart","ror":"https://ror.org/04vnq7t77","country_code":"DE","type":"education","lineage":["https://openalex.org/I100066346"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Hussam Amrouch","raw_affiliation_strings":["University of Stuttgart,Chair of Semiconductor Test and Reliability,Stuttgart,Germany","Chair of Semiconductor Test and Reliability, University of Stuttgart, Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"University of Stuttgart,Chair of Semiconductor Test and Reliability,Stuttgart,Germany","institution_ids":["https://openalex.org/I100066346"]},{"raw_affiliation_string":"Chair of Semiconductor Test and Reliability, University of Stuttgart, Stuttgart, Germany","institution_ids":["https://openalex.org/I100066346"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5079463481"],"corresponding_institution_ids":["https://openalex.org/I100066346"],"apc_list":null,"apc_paid":null,"fwci":0.1499,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.37381464,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoelectric-effect","display_name":"Thermoelectric effect","score":0.769101619720459},{"id":"https://openalex.org/keywords/thermoelectric-cooling","display_name":"Thermoelectric cooling","score":0.7228423953056335},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.705456018447876},{"id":"https://openalex.org/keywords/thermoelectric-generator","display_name":"Thermoelectric generator","score":0.576622724533081},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.5625430941581726},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5310792326927185},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5171929597854614},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.5019021034240723},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.49324673414230347},{"id":"https://openalex.org/keywords/thermoelectric-materials","display_name":"Thermoelectric materials","score":0.4613627791404724},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3653697967529297},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3418395221233368},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2191205620765686},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11943089962005615},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11295965313911438}],"concepts":[{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.769101619720459},{"id":"https://openalex.org/C128458982","wikidata":"https://www.wikidata.org/wiki/Q18891486","display_name":"Thermoelectric cooling","level":3,"score":0.7228423953056335},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.705456018447876},{"id":"https://openalex.org/C117127486","wikidata":"https://www.wikidata.org/wiki/Q11569191","display_name":"Thermoelectric generator","level":3,"score":0.576622724533081},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.5625430941581726},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5310792326927185},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5171929597854614},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.5019021034240723},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.49324673414230347},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.4613627791404724},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3653697967529297},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3418395221233368},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2191205620765686},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11943089962005615},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11295965313911438},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/sbcci55532.2022.9893242","is_oa":false,"landing_page_url":"https://doi.org/10.1109/sbcci55532.2022.9893242","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 35th SBC/SBMicro/IEEE/ACM Symposium on Integrated Circuits and Systems Design (SBCCI)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8999999761581421}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1965904248","https://openalex.org/W2039681142","https://openalex.org/W2076639902","https://openalex.org/W2089826771","https://openalex.org/W2111062303","https://openalex.org/W2149237671","https://openalex.org/W2156259175","https://openalex.org/W2163517070","https://openalex.org/W2482217949","https://openalex.org/W2520877624","https://openalex.org/W2625439172","https://openalex.org/W3008930998","https://openalex.org/W3091745343","https://openalex.org/W3132769547","https://openalex.org/W3172855377","https://openalex.org/W6682200175"],"related_works":["https://openalex.org/W3035164232","https://openalex.org/W2037363130","https://openalex.org/W2149020627","https://openalex.org/W2514821055","https://openalex.org/W1986125854","https://openalex.org/W4386543406","https://openalex.org/W2080249650","https://openalex.org/W3165776358","https://openalex.org/W2808223191","https://openalex.org/W4289520621"],"abstract_inverted_index":{"In":[0],"this":[1],"work,":[2],"we":[3],"investigate":[4],"the":[5,18,22,30,68,71,76,127,136,144],"effectiveness":[6,147],"of":[7,70,148],"approximate":[8,25],"computing":[9,26,36,53],"and":[10,16,45,146],"on-chip":[11,19,79,102,149],"thermoelectric":[12],"cooling":[13,80,131,150],"on":[14,67],"mitigating":[15],"managing":[17],"temperatures.":[20],"On":[21,75],"first":[23],"hand,":[24,78],"has":[27,88],"emerged":[28,90],"in":[29,52,62],"last":[31],"decade":[32],"as":[33,91,133,135],"an":[34,59,92],"attractive":[35,93],"paradigm":[37],"that":[38,114],"offers":[39],"a":[40],"powerful":[41,94],"trade-off":[42],"between":[43],"power":[44,103],"accuracy.":[46,63],"For":[47],"deep":[48],"learning":[49],"ap-plications,":[50],"approximations":[51],"may":[54],"not":[55],"always":[56],"lead":[57],"to":[58,99,124],"observable":[60],"loss":[61],"This":[64,121],"largely":[65],"depends":[66],"sensitivity":[69],"executed":[72],"DNN":[73],"models.":[74],"other":[77],"using":[81,109,151],"novel":[82],"ultra":[83],"thin-film":[84],"Thermoelectric":[85,152],"(TE)":[86],"devices":[87],"also":[89],"means":[95],"for":[96],"heat":[97],"dissipation":[98],"suppress":[100],"excessive":[101],"densities.":[104],"Our":[105],"investigations":[106],"are":[107],"done":[108],"commercial":[110],"ANSYS":[111],"tool":[112],"flows":[113],"employ":[115],"accurate":[116],"Finite":[117],"Elements":[118],"Analysis":[119],"(FEA).":[120],"enables":[122],"us":[123],"accurately":[125],"study":[126],"Peltier's":[128],"effect":[129,138],"(for":[130,139],"purposes)":[132,142],"well":[134],"Seebeck's":[137],"energy":[140],"harvesting":[141],"demonstrating":[143],"promise":[145],"devices.":[153]},"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2026-03-13T16:22:10.518609","created_date":"2025-10-10T00:00:00"}